Patents by Inventor Hak-Kwan Kim

Hak-Kwan Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11129280
    Abstract: An electronic component-embedded substrate includes an electronic component module having a first surface and a second surface opposite to the first surface, and including a first support member having a first through-portion, a first electronic component disposed in the first through-portion, a first resin layer covering at least a portion of the first electronic component, a second support member disposed on one side of the first support member and having a second through-portion, a second electronic component disposed in the second through-portion and connected to the first electronic component, and a second resin layer covering at least a portion of the second electronic component, an insulating material covering at least a portion of each of a side surface of the electronic component module and the first surface, and a first wiring layer disposed on the insulating material and connected to the first electronic component.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: September 21, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Kwan Lee, Kyung Hwan Ko, Kyoung Jun Kim, Yong Hoon Kim, Seung Eun Lee, Hak Chun Kim
  • Patent number: 11114371
    Abstract: A substrate-on-substrate structure and an electronic device including the same are provided. The substrate-on-substrate structure includes: a first printed circuit board having a first side and a second side; a second printed circuit board disposed on the second side of the first printed circuit board, and having a first side connected to the second side of the first printed circuit board and a second side opposite to the first side connected to the second side of the first printed circuit board; a reinforcing structure attached to the first side of the second printed circuit board, and spaced apart from the second side of the first printed circuit board; and an underfill resin disposed between the second side of the first printed circuit board and the first side of the second printed circuit board, and covering at least a portion of the reinforcing structure.
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: September 7, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong Hoon Kim, Seung Eun Lee, Young Kwan Lee, Hak Chun Kim
  • Patent number: 11004611
    Abstract: A multilayer electronic component includes a body having a stacked structure in which a plurality of internal electrodes and dielectric layers are alternately stacked; and external electrodes disposed on an outer surface of the body and connected to the internal electrodes. The dielectric layer includes a plurality of grains and a plurality of graphene particles, and the plurality of graphene particles are disposed at boundaries of the plurality of grains.
    Type: Grant
    Filed: July 30, 2020
    Date of Patent: May 11, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yu Ra Shin, Myeong Gi Kim, Eung Soo Kim, Hak Kwan Kim, Jang Yeol Lee, Seong Min Chin
  • Patent number: 10892092
    Abstract: A conductive powder for an internal electrode includes a metal particle; and a graphene layer or an oxidized graphene layer disposed on at least a portion of a surface of the metal particle.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: January 12, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Myeong Gi Kim, Yu Ra Shin, Jang Yeol Lee, Seong Min Chin, Hak Kwan Kim
  • Publication number: 20200357576
    Abstract: A multilayer electronic component includes a body having a stacked structure in which a plurality of internal electrodes and dielectric layers are alternately stacked; and external electrodes disposed on an outer surface of the body and connected to the internal electrodes. The dielectric layer includes a plurality of grains and a plurality of graphene particles, and the plurality of graphene particles are disposed at boundaries of the plurality of grains.
    Type: Application
    Filed: July 30, 2020
    Publication date: November 12, 2020
    Inventors: Yu Ra SHIN, Myeong Gi KIM, Eung Soo KIM, Hak Kwan KIM, Jang Yeol LEE, Seong Min CHIN
  • Patent number: 10763044
    Abstract: A multilayer electronic component includes a body having a stacked structure in which a plurality of internal electrodes and dielectric layers are alternately stacked; and external electrodes disposed on an outer surface of the body and connected to the internal electrodes. The dielectric layer includes a plurality of grains and a plurality of graphene particles, and the plurality of graphene particles are disposed at boundaries of the plurality of grains.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: September 1, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yu Ra Shin, Myeong Gi Kim, Eung Soo Kim, Hak Kwan Kim, Jang Yeol Lee, Seong Min Chin
  • Patent number: 10699850
    Abstract: A multilayer capacitor includes a body including an internal electrode alternately disposed with a dielectric layer; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of grains and grain boundaries disposed between adjacent grains, and the grain boundaries include a plurality of graphene platelets.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: June 30, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seung Yong Lee, Yu Ra Shin, Hak Kwan Kim, Jin Bok Shin, Myung Joo Lee
  • Patent number: 10600572
    Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body, wherein the dielectric layer contains a barium titanate-based powder particle having a core-shell structure including a core and a shell around the core, the shell having a structure in which titanium is partially substituted with an element having the same oxidation number as that of the titanium in the barium titanate-based powder particle and having an ionic radius different from that of the titanium in the barium titanate-based powder particle, and the shell covers at least 30% of a surface of the core.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: March 24, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Woo Kim, Jong Ho Lee, Min Gi Sin, Hak Kwan Kim, Chin Mo Kim, Chi Hwa Lee, Hong Seok Kim, Woo Sup Kim, Chang Hwa Park
  • Patent number: 10580575
    Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body, wherein the dielectric layer contains a barium titanate-based powder particle having a core-shell structure including a core and a shell around the core, the shell having a structure in which titanium is partially substituted with an element having the same oxidation number as that of the titanium in the barium titanate-based powder particle and having an ionic radius different from that of the titanium in the barium titanate-based powder particle, and the shell covers at least 30% of a surface of the core.
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: March 3, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Woo Kim, Jong Ho Lee, Min Gi Sin, Hak Kwan Kim, Chin Mo Kim, Chi Hwa Lee, Hong Seok Kim, Woo Sup Kim, Chang Hwa Park
  • Publication number: 20190341192
    Abstract: A multilayer electronic component includes a body having a stacked structure in which a plurality of internal electrodes and dielectric layers are alternately stacked; and external electrodes disposed on an outer surface of the body and connected to the internal electrodes. The dielectric layer includes a plurality of grains and a plurality of graphene particles, and the plurality of graphene particles are disposed at boundaries of the plurality of grains.
    Type: Application
    Filed: July 19, 2019
    Publication date: November 7, 2019
    Inventors: Yu Ra SHIN, Myeong Gi KIM, Eung Soo KIM, Hak Kwan KIM, Jang Yeol LEE, Seong Min CHIN
  • Publication number: 20190333699
    Abstract: A multilayer capacitor includes a body including an internal electrode alternately disposed with a dielectric layer; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of grains and grain boundaries disposed between adjacent grains, and the grain boundaries include a plurality of graphene platelets.
    Type: Application
    Filed: October 31, 2018
    Publication date: October 31, 2019
    Inventors: Seung Yong LEE, Yu Ra SHIN, Hak Kwan KIM, Jin Bok SHIN, Myung Joo LEE
  • Patent number: 10418178
    Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body, wherein the dielectric layer contains a barium titanate-based powder particle having a core-shell structure including a core and a shell around the core, the shell having a structure in which titanium is partially substituted with an element having the same oxidation number as that of the titanium in the barium titanate-based powder particle and having an ionic radius different from that of the titanium in the barium titanate-based powder particle, and the shell covers at least 30% of a surface of the core.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: September 17, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Woo Kim, Jong Ho Lee, Min Gi Sin, Hak Kwan Kim, Chin Mo Kim, Chi Hwa Lee, Hong Seok Kim, Woo Sup Kim, Chang Hwa Park
  • Patent number: 10403436
    Abstract: A multilayer electronic component includes a body having a stacked structure in which a plurality of internal electrodes and dielectric layers are alternately stacked; and external electrodes disposed on an outer surface of the body and connected to the internal electrodes. The dielectric layer includes a plurality of grains and a plurality of graphene particles, and the plurality of graphene particles are disposed at boundaries of the plurality of grains.
    Type: Grant
    Filed: August 11, 2017
    Date of Patent: September 3, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yu Ra Shin, Myeong Gi Kim, Eung Soo Kim, Hak Kwan Kim, Jang Yeol Lee, Seong Min Chin
  • Publication number: 20190228909
    Abstract: A conductive powder for an internal electrode includes a metal particle; and a graphene layer or an oxidized graphene layer disposed on at least a portion of a surface of the metal particle.
    Type: Application
    Filed: April 2, 2019
    Publication date: July 25, 2019
    Inventors: Myeong Gi KIM, Yu Ra SHIN, Jang Yeol LEE, Seong MIN, Hak Kwan KIM
  • Publication number: 20190172641
    Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body, wherein the dielectric layer contains a barium titanate-based powder particle having a core-shell structure including a core and a shell around the core, the shell having a structure in which titanium is partially substituted with an element having the same oxidation number as that of the titanium in the barium titanate-based powder particle and having an ionic radius different from that of the titanium in the barium titanate-based powder particle, and the shell covers at least 30% of a surface of the core.
    Type: Application
    Filed: February 5, 2019
    Publication date: June 6, 2019
    Inventors: Jin Woo KIM, Jong Ho LEE, Min Gi SIN, Hak Kwan KIM, Chin Mo KIM, Chi Hwa LEE, Hong Seok KIM, Woo Sup KIM, Chang Hwa PARK
  • Patent number: 10290423
    Abstract: A conductive powder for an internal electrode includes a metal particle; and a graphene layer or an oxidized graphene layer disposed on at least a portion of a surface of the metal particle.
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: May 14, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Myeong Gi Kim, Yu Ra Shin, Jang Yeol Lee, Seong Min Chin, Hak Kwan Kim
  • Publication number: 20180174756
    Abstract: A multilayer electronic component includes a body having a stacked structure in which a plurality of internal electrodes and dielectric layers are alternately stacked; and external electrodes disposed on an outer surface of the body and connected to the internal electrodes. The dielectric layer includes a plurality of grains and a plurality of graphene particles, and the plurality of graphene particles are disposed at boundaries of the plurality of grains.
    Type: Application
    Filed: August 11, 2017
    Publication date: June 21, 2018
    Inventors: Yu Ra SHIN, Myeong Gi KIM, Eung Soo KIM, Hak Kwan KIM, Jang Yeol LEE, Seong Min CHIN
  • Publication number: 20180144863
    Abstract: A conductive powder for an internal electrode includes a metal particle; and a graphene layer or an oxidized graphene layer disposed on at least a portion of a surface of the metal particle.
    Type: Application
    Filed: March 2, 2017
    Publication date: May 24, 2018
    Inventors: Myeong Gi KIM, Yu Ra SHIN, Jang Yeol LEE, Seong Min CHIN, Hak Kwan KIM
  • Publication number: 20180130601
    Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body, wherein the dielectric layer contains a barium titanate-based powder particle having a core-shell structure including a core and a shell around the core, the shell having a structure in which titanium is partially substituted with an element having the same oxidation number as that of the titanium in the barium titanate-based powder particle and having an ionic radius different from that of the titanium in the barium titanate-based powder particle, and the shell covers at least 30% of a surface of the core.
    Type: Application
    Filed: August 23, 2017
    Publication date: May 10, 2018
    Inventors: Jin Woo KIM, Jong Ho LEE, Min Gi SIN, Hak Kwan KIM, Chin Mo KIM, Chi Hwa LEE, Hong Seok KIM, Woo Sup KIM, Chang Hwa PARK
  • Patent number: 9966179
    Abstract: A common mode filter includes a magnetic substrate in which ferrite particles having anisotropy and a planar structure are disposed to have a planar orientation.
    Type: Grant
    Filed: April 15, 2016
    Date of Patent: May 8, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chin Mo Kim, Jung Wook Seo, Eun Hye Na, Hak Kwan Kim, Hyung Jin Jeon, Sung Yong An