Abstract: A semiconductor memory device including a plurality of layers each including a memory cell array and which are stacked over each other; and at least one power plane for supplying power to the layers. The power plane includes a region to which a power voltage is applied and a region to which a ground voltage is applied.

Abstract: A semiconductor memory device having a 3D stacked structure includes: a first semiconductor area with a stacked structure of a first layer having first data and a second layer having second data; a first line for delivering an access signal for accessing the first semiconductor area; and a second line for outputting the first and/or second data from the first semiconductor area, wherein access timings of accessing the first and second layers are controlled so that a first time delay from the delivery of the access signal to the first layer to the output of the first data is substantially identical to a second time delay from the delivery of the access signal to the second layer to the output of the second data, thereby compensating for skew according to an inter-layer timing delay and thus performing a normal operation. Accordingly, the advantage of high-integration according to a stacked structure can be maximized by satisfying data input/output within a predetermined standard.

Abstract: A data line layout includes column selection lines arranged in a first direction at a layer on a memory cell array region, and data lines arranged in the first direction at the layer, the data lines being connected between I/O sense amplifiers and I/O pads.

Abstract: A data line layout structure comprises a plurality of first data lines, second data lines, a third data line, a first data line driver, and a second data line driver. The plurality of first data lines are connected to sub mats in a memory mat so that a predetermined number of first data lines are connected to each sub mat. The second data lines are disposed in a smaller quantity than the number of the first data lines so as to form a hierarchy with respect to the first data lines. The third data line is disposed to form a hierarchy with respect to the second data lines, and transfers data provided through the second data lines to a data latch. The first data line driver is connected between the first data lines and the second data lines, and performs a logical ORing operation for output of the first data lines so as to drive a corresponding second data line.

Abstract: A semiconductor memory device has a hierarchical bit line structure. The semiconductor memory device may include first and second memory cell clusters, which share the same bit line pair and are divided operationally; third and fourth memory cell clusters, which are connected respectively corresponding to word lines coupled with the first and second memory cell clusters, and which share a bit line pair different from the bit line pair and are divided operationally; and a column pass gate for switching one of bit line pairs connected with the first to fourth memory cell clusters, to a common sense amplifier, in response to a column selection signal. Whereby an operating speed decrease caused by load of peripheral circuits connected to the bit line is improved, and the number of column pass gates is reduced substantially with a reduction of chip size.

Abstract: A semiconductor memory device has a hierarchical bit line structure. The semiconductor memory device may include first and second memory cell clusters, which share the same bit line pair and are divided operationally; third and fourth memory cell clusters, which are connected respectively corresponding to word lines coupled with the first and second memory cell clusters, and which share a bit line pair different from the bit line pair and are divided operationally; and a column pass gate for switching one of bit line pairs connected with the first to fourth memory cell clusters, to a common sense amplifier, in response to a column selection signal. Whereby an operating speed decrease caused by load of peripheral circuits connected to the bit line is improved, and the number of column pass gates is reduced substantially with a reduction of chip size.

Abstract: A semiconductor memory device has a hierarchical bit line structure. The semiconductor memory device may include first and second memory cell clusters, which share the same bit line pair and are divided operationally; third and fourth memory cell clusters, which are connected respectively corresponding to word lines coupled with the first and second memory cell clusters, and which share a bit line pair different from the bit line pair and are divided operationally; and a column pass gate for switching one of bit line pairs connected with the first to fourth memory cell clusters, to a common sense amplifier, in response to a column selection signal. Whereby an operating speed decrease caused by load of peripheral circuits connected to the bit line is improved, and the number of column pass gates is reduced substantially with a reduction of chip size.

Abstract: A semiconductor memory device has a hierarchical bit line structure. The semiconductor memory device may include first and second memory cell clusters, which share the same bit line pair and are divided operationally; third and fourth memory cell clusters, which are connected respectively corresponding to word lines coupled with the first and second memory cell clusters, and which share a bit line pair different from the bit line pair and are divided operationally; and a column pass gate for switching one of bit line pairs connected with the first to fourth memory cell clusters, to a common sense amplifier, in response to a column selection signal. Whereby an operating speed decrease caused by load of peripheral circuits connected to the bit line is improved, and the number of column pass gates is reduced substantially with a reduction of chip size.

Abstract: A semiconductor memory device has a hierarchical bit line structure. The semiconductor memory device may include first and second memory cell clusters, which share the same bit line pair and are divided operationally; third and fourth memory cell clusters, which are connected respectively corresponding to word lines coupled with the first and second memory cell clusters, and which share a bit line pair different from the bit line pair and are divided operationally; and a column pass gate for switching one of bit line pairs connected with the first to fourth memory cell clusters, to a common sense amplifier, in response to a column selection signal. Whereby an operating speed decrease caused by load of peripheral circuits connected to the bit line is improved, and the number of column pass gates is reduced substantially with a reduction of chip size.

Abstract: A data line layout structure comprises a plurality of first data lines, second data lines, a third data line, a first data line driver, and a second data line driver. The plurality of first data lines are connected to sub mats in a memory mat so that a predetermined number of first data lines are connected to each sub mat. The second data lines are disposed in a smaller quantity than the number of the first data lines so as to form a hierarchy with respect to the first data lines. The third data line is disposed to form a hierarchy with respect to the second data lines, and transfers data provided through the second data lines to a data latch. The first data line driver is connected between the first data lines and the second data lines, and performs a logical ORing operation for output of the first data lines so as to drive a corresponding second data line.

Abstract: A semiconductor memory device has a hierarchical bit line structure. The semiconductor memory device may include first and second memory cell clusters, which share the same bit line pair and are divided operationally; third and fourth memory cell clusters, which are connected respectively corresponding to word lines coupled with the first and second memory cell clusters, and which share a bit line pair different from the bit line pair and are divided operationally; and a column pass gate for switching one of bit line pairs connected with the first to fourth memory cell clusters, to a common sense amplifier, in response to a column selection signal. Whereby an operating speed decrease caused by load of peripheral circuits connected to the bit line is improved, and the number of column pass gates is reduced substantially with a reduction of chip size.

Abstract: A delay circuit in accordance with the present invention provides high-resolution changes in the time delay by utilizing a slope controller that generates an intermediate signal having sloping edges in response to edges in an input signal. A delay time controller generates an output signal having edges that begin when the level of the intermediate signal reaches a certain level. The overall time delay of the delay circuit can be varied by varying the slope of the edges of the intermediate signal, or by varying the level of the intermediate signal at which the delay time controller begins generating an edge in the output signal, or by varying both parameters. The slope controller and delay time controller can be realized with a plurality of tri-state inverters coupled in parallel for operating responsive to one or more select signals. By implementing the inverters with pull-up and pull-down transistors having different sizes, the overall time delay can be varied with very high resolution.

Abstract: A logic interface circuit and a semiconductor memory device to which the logic interface circuit is applied, the circuit comprising: logic gate means having pull up means and pull down means which respectively responds to one or more input signals to pull up and pull down an output terminal; reverse current preventing means connected between a first supply voltage and the pull up means for preventing current from reversing from the pull up means to the first supply voltage; pre-charging means connected in parallel to the reverse current preventing means for responding to the output signal generated from the output terminal to pre-charge a common point of the reverse current preventing means and the pull up means to the first supply voltage; and reverse current preventing and voltage boosting means connected between the second supply voltage and the output terminal for responding to the first supply voltage to turn off to prevent current from reversing from the output terminal to the second supply voltage if t

Abstract: Disclosed is a level shifter that can receive and convert a first signal that can have various voltage logic levels to a second signal having internal voltage logic levels. The level shifter includes first and second ascending/descending circuits, where the first ascend/descending circuit receives the first signal and the second ascend/descending circuit receives an inverted first signal. Each ascend/descending circuit is operable to descend a high logic level of the received signal to a low output voltage level and ascend a low logic level of the received signal to a high output voltage level. The output voltages from the first and second ascending/descending circuits are input to a sense amplifier that amplifies the difference between the output voltages in order to generate the internal voltage logic levels of the second signal. The first and second ascending/descending circuits buffer their respective received signals using the high logic level of the input signal as a supply voltage.

Abstract: A synchronous memory comprises a memory cell array having a plurality of memory cells; a clock control circuit for receiving a first clock signal, a second clock signal, and a third clock signal, and for generating an internal clock signal, a plurality of control signals, and a plurality of flag signals.

Abstract: A synchronous memory comprising: a memory cell array being comprised of a plurality of memory cells; a clock control circuit for receiving a first clock signal, a second clock signal, and a third clock signal, and for generating an internal clock signal, a plurality of control signals, and a plurality of flag signals; a first register circuit for storing a plurality of input data bits in response to the internal clock signal and the control signals; a second register circuit for storing the flag signals in response to the internal clock signal and the control signals; a write drive circuit for writing the input data bits passing through the first register circuit into the memory cell array in response to the flag signals during a write cycle; a sense amplifier circuit coupled to the memory cell array; an address comparator circuit for receiving read and write address signals and for generating a first, a second, and a third combination signals; and a switching circuit for transferring the input data bits pass

Abstract: A synchronous burst semiconductor memory device operating in synchronism with at least one external clock signal and capable of accessing data on every edge of the external clock signal is provided. The burst memory device includes a clock generator for generating a number of data output/input strobe clock signals synchronized with the external clock signal in response to a plurality of input information signals, and a data-out/in buffer for outputting/inputting internal/external data in synchronism with the data output/input strobe clock signals.

Abstract: A switch signal generator simultaneously sets every input and output data path in a high-speed synchronous SRAM. The switch signal generator receives control signals and a plurality of input signals, generates a plurality of switch signals, and sequentially enables other switch signals when a first switch signal of the plurality of switch signals is enabled. The synchronous SRAM includes an output data path/data storing portion, an input data path/data storing portion, and a path switch controlling portion. All burst orders are set simultaneously in the path switch controlling portion including the switch signal generator when a burst operation starts, and all data paths of the output data path/data storing portion and the input data path/data storing portion are simultaneously set by switch control signals which are provided by the path switch controlling portion.