Patents by Inventor Hak Yong WOO

Hak Yong WOO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SILAZANE-BASED COMPOUND, COATING COMPOSITION COMPRISING SAME, LIGHT-TRANSMITTING FILM HAVING COATING LAYER, AND DISPLAY DEVICE COMPRISING LIGHT-TRANSMITTING FILM
    Publication number: 20230147233
    Abstract: Disclosed are a silazane-based compound represented by Formula 1, a coating composition containing the silazane-based compound, a light-transmitting film including a first coating layer containing the silazane-based compound, and a display apparatus including the light-transmitting film.
    Type: Application
    Filed: June 22, 2021
    Publication date: May 11, 2023
    Inventors: Geun Su LEE, Hak-Yong WOO, Jong Hyeon CHEON
  • Polyimide cover substrate
    Patent number: 11040522
    Abstract: Disclosed is a polyimide cover substrate, which is configured such that a device protection layer is formed of a urethane acrylate compound on at least one side of a polyimide film, thereby exhibiting not only high flexural properties and impact resistance but also superior solvent resistance, optical properties and scratch resistance and low water vapor transmission rate, and thus can be effectively utilized as a cover substrate for a flexible electronic device.
    Type: Grant
    Filed: March 31, 2014
    Date of Patent: June 22, 2021
    Assignee: KOLON INDUSTRIES, INC.
    Inventors: Hak Yong Woo, Hak Gee Jung, Ki Il Hong
  • RESIN COMPOSITION FOR HARD COATING, AND HARD-COATING FILM COMPRISING CURED FORM OF SAME AS COATING LAYER
    Publication number: 20180010012
    Abstract: This invention relates to a resin composition for a hard coating, including a siloxane resin configured such that compounds including an alkoxysilane and an alkoxy metal compound are chemically bound, and to a hard coating film including a hard coating layer formed using the resin composition.
    Type: Application
    Filed: December 31, 2015
    Publication date: January 11, 2018
    Applicant: KOLON INDUSTRIES, INC.
    Inventors: Sang Hyun AHN, Hak Yong WOO, Hak Gee JUNG, Dong Hee LEE, Byung Joon AN, Hang Geun KIM
  • POLYIMIDE COVER SUBSTRATE
    Publication number: 20160040027
    Abstract: Disclosed is a polyimide cover substrate, which is configured such that a device protection layer is formed of a urethane acrylate compound on at least one side of a polyimide film, thereby exhibiting not only high flexural properties and impact resistance but also superior solvent resistance, optical properties and scratch resistance and low water vapor transmission rate, and thus can be effectively utilized as a cover substrate for a flexible electronic device.
    Type: Application
    Filed: March 31, 2014
    Publication date: February 11, 2016
    Applicant: KOLON INDUSTRIES, INC.
    Inventors: Hak Yong WOO, Hak Gee JUNG, Ki ll HONG
  • TRANSPARENT POLYIMIDE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20150337100
    Abstract: Disclosed herein is a transparent polyimide substrate, including: a transparent polyimide film; and a silicon oxide layer which is formed on one side or both sides of the transparent polyimide film and which includes a silicon oxide.
    Type: Application
    Filed: June 25, 2012
    Publication date: November 26, 2015
    Applicant: KOLON INDUSTRIES, INC
    Inventors: Hak Yong WOO, Hak Gee JUNG, Sang Yoon PARK