Abstract: A heat converter according to one embodiment of the present invention comprises: a plurality of unit modules respectively arranged in a first direction and a second direction that intersects the first direction; and a frame, which supports the plurality of unit modules, allows cooling water to flow in through one surface arranged in the first direction, and allows the cooling water to be discharged through the other surface arranged in the first direction, wherein each unit module includes: a cooling water passage chamber having first and second surfaces arranged to be spaced in the first direction, third and fourth surfaces arranged to be spaced in a third direction that intersects the first direction and the second direction, a fifth surface arranged to be spaced in the second direction such that cooing water flows therein, and a sixth surface from which cooling water is discharged; a first thermoelectric module arranged on the first surface; and a second thermoelectric module arranged on the second surface

Abstract: A method for manufacturing a vehicle wheel includes: a casting process of manufacturing the wheel in a one-piece body having a forming end and a temporary flange protruding at inner and outer sides of the wheel, respectively, wherein the one-piece body further includes a resonance chamber forming groove; a primary shape machining process of forming a stepped part at an outer circumferential side of the resonance chamber forming groove; a flow forming process of bending the forming end to be seated on the stepped part; a friction stir welding process of integrally bonding a portion where the forming end and the stepped part are in close contact with each other; a fine machining process of removing the temporary flange; and a sound-absorbing hole machining process of forming a sound-absorbing hole for communicating between the resonance chamber and an interior space of a tire in the forming end.

Abstract: The present invention relates to a method for increasing the productivity of 2?-fucosyllactose through various changes in culture medium composition and culturing on the basis of lactose, which is a substrate, wherein 2-fucosyllactose can be continuously produced in a high-yield at an optimum lactose concentration discovered by a culturing method of the present invention.

Abstract: An electronic device is provided that includes a first display and a second display. The electronic device also includes a processor configured to allocate a first set of resources to the first display and a second set of resources to the second display. The first set of resources is different from the second set of resources. Each of the first set of resources and the second set of resources includes one or more of at least one available hardware resource and at least one available software resource.

Abstract: A method for manufacturing a vehicle wheel includes: a casting process of manufacturing the wheel in a one-piece body having a forming end and a temporary flange protruding at inner and outer sides of the wheel, respectively, wherein the one-piece body further includes a resonance chamber forming groove; a primary shape machining process of forming a stepped part at an outer circumferential side of the resonance chamber forming groove; a flow forming process of bending the forming end to be seated on the stepped part; a friction stir welding process of integrally bonding a portion where the forming end and the stepped part are in close contact with each other; a fine machining process of removing the temporary flange; and a sound-absorbing hole machining process of forming a sound-absorbing hole for communicating between the resonance chamber and an interior space of a tire in the forming end.

Abstract: Provided is a system for predicting disease based on biosignal data and medical knowledge base convergence. The system includes a first system unit configured to receive, from a user terminal, biosignal data collected from at least one sensor for sensing a biosignal, and calculate a disease score from the biosignal data based on a pre-trained prediction model, a second system unit configured to provide medical knowledge data for the first system unit, analyze a query input from the user terminal to provide a corresponding response, and augment the medical knowledge data based on the query and response; and a unified distributed repository that includes a database for enqueuing the biosignal data, a manager database for storing additional information of a user, and a medical knowledge base for storing predetermined medical knowledge data.

Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.

Abstract: Provided is a system for predicting disease based on biosignal data and medical knowledge base convergence. The system includes a first system unit configured to receive, from a user terminal, biosignal data collected from at least one sensor for sensing a biosignal, and calculate a disease score from the biosignal data based on a pre-trained prediction model, a second system unit configured to provide medical knowledge data for the first system unit, analyze a query input from the user terminal to provide a corresponding response, and augment the medical knowledge data based on the query and response; and a unified distributed repository that includes a database for enqueuing the biosignal data, a manager database for storing additional information of a user, and a medical knowledge base for storing predetermined medical knowledge data.

Abstract: A locking structure for a rectilinear center rail is provided. The locking structure includes a rectilinear center rail mounted on a sliding door, a center roller unit rollably connected to the center rail, and a center swing arm rotatably connected to the center roller unit and a vehicle body. The center roller unit includes a first lever and a second lever that are configured to rotate about rotation axes formed in a width direction of the center rail. The locking structure is configured to switch between a first posture in which the first lever is configured to be caught by a catching portion formed on the center rail, rotated, and then locked with the second lever and a second posture in which the second lever is configured to be caught by a catching portion formed on the center swing arm, rotated, and then locked with the first lever.

Abstract: A spindle structure includes a lower rail mounted at a lower side of a vehicle body, a lower rail roller unit rollably connected to the lower rail, a lower rail swing arm rotatably connected to the lower rail roller unit and a door, a lower guide rail mounted on the door and configured to form a lower guide route, and a spindle assembly positioned at one end of the lower rail, the spindle assembly including a spindle connected to a fixing unit fixed to the vehicle body, the spindle having one end rollably connected to the lower guide rail, having a threaded portion formed on an outer circumferential surface thereof, and being configured to be movable in a threaded manner between the vehicle body and the door.

Abstract: A link type structure includes a lower rail mounted in a longitudinal direction at a lower side of a vehicle body, a lower rail roller unit rollably connected to the lower rail, a lower rail swing arm rotatably connected to the lower rail roller unit and a door, a first link member having a first end rotatably connected to the door and a second end connected to a link hinge, a second link member having a first end rotatably connected to the lower rail roller unit and a second end connected to the link hinge, and a spring provided on the link hinge. The spring is configured to supply elastic force such that one end of the first link member applies force to the door in a direction toward outside of the vehicle body.

Abstract: A method for manufacturing a vehicle wheel includes: a casting process of manufacturing the wheel in a one-piece body having a forming end and a temporary flange protruding at inner and outer sides of the wheel, respectively, wherein the one-piece body further includes a resonance chamber forming groove; a primary shape machining process of forming a stepped part at an outer circumferential side of the resonance chamber forming groove; a flow forming process of bending the forming end to be seated on the stepped part; a friction stir welding process of integrally bonding a portion where the forming end and the stepped part are in close contact with each other; a fine machining process of removing the temporary flange; and a sound-absorbing hole machining process of forming a sound-absorbing hole for communicating between the resonance chamber and an interior space of a tire in the forming end.

Abstract: A locking structure for a rectilinear center rail is provided. The locking structure includes a rectilinear center rail mounted on a sliding door, a center roller unit rollably connected to the center rail, and a center swing arm rotatably connected to the center roller unit and a vehicle body. The center roller unit includes a first lever and a second lever that are configured to rotate about rotation axes formed in a width direction of the center rail. The locking structure is configured to switch between a first posture in which the first lever is configured to be caught by a catching portion formed on the center rail, rotated, and then locked with the second lever and a second posture in which the second lever is configured to be caught by a catching portion formed on the center swing arm, rotated, and then locked with the first lever.

Abstract: A spindle type structure includes a lower rail mounted in a longitudinal direction at a lower side of a vehicle body, a lower rail roller unit rollably connected to the lower rail, a lower rail swing arm rotatably connected to the lower rail roller unit and a door, a lower guide rail mounted on the door and configured to form a lower guide route in the longitudinal direction, and a spindle assembly positioned at one side of the lower rail, the spindle assembly including a spindle connected in the longitudinal direction to a fixing unit fixed to the vehicle body, having one end rollably connected to the lower guide rail, having a threaded portion formed on an outer circumferential surface thereof, and being configured to be movable in a threaded manner between the vehicle body and the door.

Abstract: A link type structure includes a lower rail mounted in a longitudinal direction at a lower side of a vehicle body, a lower rail roller unit rollably connected to the lower rail, a lower rail swing arm rotatably connected to the lower rail roller unit and a door, a first link member having a first end rotatably connected to the door and a second end connected to a link hinge, a second link member having a first end rotatably connected to the lower rail roller unit and a second end connected to the link hinge, and a spring provided on the link hinge. The spring is configured to supply elastic force such that one end of the first link member applies force to the door in a direction toward outside of the vehicle body.

Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.

Abstract: A vehicle tailgate locking device may include a latch assembly configured to engage or disengage a striker, wherein the latch assembly includes a housing, a latch member disposed in the housing and configured to engage or disengage the striker by rotation, a pawl member rotatably disposed in the housing to restrain or release the latch member, a driving device configured to rotate the pawl member to release restraint of the latch member, an engaging member configured to restrain the pawl member by engaging the pawl member when the pawl member rotates to a position releasing restraint of the latch member, and a releasing portion configured to press the engaging member to release the restraint of the pawl member when the latch member is rotated to a position releasing the engagement of the striker.

Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.

Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.

Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.