Patents by Inventor Hakan Bygdo

Hakan Bygdo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7965520
    Abstract: An electronic device is provided that includes a main printed circuit board (PCB) having a top surface, a bottom surface, and a hole extending between the top surface and the bottom surface. The electronic device further includes a module PCB having at least one electrical component mounted on a top surface of the module PCB, wherein the module PCB is inverted and assembled adjacent the main PCB such that the top surface of the module PCB faces the top surface of the main PCB, and the at least one electrical component extends into the hole. In addition, the electronic device includes a cover on the bottom surface of the main PCB that substantially covers the hole.
    Type: Grant
    Filed: January 22, 2007
    Date of Patent: June 21, 2011
    Assignee: Sony Ericsson Mobile Communications AB
    Inventors: Håkan Bygdö, Per Holmberg
  • Publication number: 20080174972
    Abstract: An electronic device is provided that includes a main printed circuit board (PCB) having a top surface, a bottom surface, and a hole extending between the top surface and the bottom surface. The electronic device further includes a module PCB having at least one electrical component mounted on a top surface of the module PCB, wherein the module PCB is inverted and assembled adjacent the main PCB such that the top surface of the module PCB faces the top surface of the main PCB, and the at least one electrical component extends into the hole. In addition, the electronic device includes a cover on the bottom surface of the main PCB that substantially covers the hole.
    Type: Application
    Filed: January 22, 2007
    Publication date: July 24, 2008
    Inventors: Hakan Bygdo, Per Holmberg
  • Publication number: 20020040808
    Abstract: The invention relates to: A method of making a gasket (1) on a PCB (Printed Circuit Board) (2) and a PCB comprising a gasket. The object of the present invention is to provide a method of making a high quality gasket that may be conveniently customized to individual needs and which is easily integrated in a normal assembly process. The problem is solved in that the gasket (1) is made by screen printing techniques. This method has the advantage of using a technique that is already commonly used in an electronics assembly environment, and which method may implement relatively complex patterns with a relatively high precision in the layout of feature dimensions and which is relatively economic in use. The invention may e.g. be used for making customized gaskets for EMI shields on a PCB.
    Type: Application
    Filed: October 10, 2001
    Publication date: April 11, 2002
    Inventors: Andreas Wilson, Hakan Bygdo