Patents by Inventor Hakima Smail

Hakima Smail has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130059132
    Abstract: A laminate includes two substrates that are connected by means of a bonding layer, the bonding layer enabling a one-dimensional composite structure. This enables a purely inorganic compound of different materials and a significantly improved connection when using adhesives.
    Type: Application
    Filed: May 25, 2011
    Publication date: March 7, 2013
    Applicant: Leibniz-Institut fuer neue Materialien gemeinnuetzige GmbH
    Inventors: Oral Cenk Aktas, Michael Veith, Juseok Lee, Hakima Smail, Marina Martinez MirĂ³