Patents by Inventor Hakjin LEE

Hakjin LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260047226
    Abstract: An image sensor includes a stack structure including an active pixel region including a plurality of pixels, a pad region on at least one side of the active pixel region, and a first substrate having a first surface and a second surface that is opposite to the first surface, the first substrate including a plurality of photoelectric conversion regions respectively corresponding to the plurality of pixels, a meta-optical structure on the first surface of the first substrate and including a plurality of dielectric layers on the first surface of the first substrate, and nanoprism patterns in at least one dielectric layer of the plurality of dielectric layers and in the active pixel region, a pad opening in the meta-optical structure and a passivation layer at least partially covering a sidewall of the pad opening.
    Type: Application
    Filed: January 16, 2025
    Publication date: February 12, 2026
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sehoon YOO, Donghyun KIM, Woobin BAE, Seungjae LEE, Hakjin LEE, Minjun CHOI
  • Publication number: 20250331328
    Abstract: An image sensor includes: a substrate including a plurality of photoelectric conversion regions; capacitor structures on the substrate; a capacitor insulating layer in a spacing between the capacitor structures; and external via structures in the spacing between the capacitor structures and penetrating the capacitor insulating layer.
    Type: Application
    Filed: October 18, 2024
    Publication date: October 23, 2025
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hakjin Lee, Jieun Kim, Keosung Park, Jiwon Seo, Yeojin Lee, Younggu Jin
  • Publication number: 20220067532
    Abstract: According to an exemplary embodiment of the present disclosure, disclosed is a method to train a model. The method to train the model may include: computing an input image using a neural network model; computing an accuracy of a prediction box by comparing the prediction box output from the neural network model and a ground truth box; and training the neural network model by performing backpropagation on the neural network model based on the accuracy.
    Type: Application
    Filed: August 27, 2021
    Publication date: March 3, 2022
    Applicant: SI Analytics Co., Ltd
    Inventors: Hakjin LEE, Jamyoung KOO
  • Patent number: 9807907
    Abstract: An air conditioner is provided. The air conditioner may include an electronic device, which may include a control component to drive a refrigerant cycle, and a cooling tube through which a refrigerant to cool the electronic device may flow. The cooling tube may be coupled to one side of the electronic device. The electronic device may include an electronic case having at least one through hole, an electronic board to which the control component may be coupled, the electronic board being disposed in the electronic case, at least one heat transfer plate disposed to contact the control component, the at least one heat transfer plate being coupled to the electronic case, and at least one heat sink, to which the cooling tube may be coupled, the at least one heat sink contacting the at least one heat transfer plate through the at least one through hole.
    Type: Grant
    Filed: September 16, 2014
    Date of Patent: October 31, 2017
    Assignee: LG ELECTRONICS INC.
    Inventors: Hakjin Lee, Taegeol Kim, Seokhoon Jang
  • Publication number: 20150077939
    Abstract: An air conditioner is provided. The air conditioner may include an electronic device, which may include a control component to drive a refrigerant cycle, and a cooling tube through which a refrigerant to cool the electronic device may flow. The cooling tube may be coupled to one side of the electronic device. The electronic device may include an electronic case having at least one through hole, an electronic board to which the control component may be coupled, the electronic board being disposed in the electronic case, at least one heat transfer plate disposed to contact the control component, the at least one heat transfer plate being coupled to the electronic case, and at least one heat sink, to which the cooling tube may be coupled, the at least one heat sink contacting the at least one heat transfer plate through the at least one through hole.
    Type: Application
    Filed: September 16, 2014
    Publication date: March 19, 2015
    Inventors: Hakjin LEE, Taegeol KIM, Seokhoon JANG