Patents by Inventor Hal Canter

Hal Canter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for dissipating heat from an integrated circuit
    Publication number: 20070210820
    Abstract: An apparatus (100) is provided for dispersing heat from an integrated circuit (202) to a heat sink (404). The apparatus (100) is formed on a nonconductive body (102) having at least two conductive surfaces (110, 112) disposed thereon. One of the conductive surfaces (110) is reflowed to a heat generating lead of the integrated circuit (202), and the other conductive surface (112) provides a surface for contacting a heat sink (404). The apparatus (100) and integrated circuit provide a package (200) which can be tape and reeled (300) for easy mounting to a printed circuit board (402) of a communication device (400).
    Type: Application
    Filed: March 8, 2006
    Publication date: September 13, 2007
    Inventors: Justin Wodrich, Michael Beard, Hal Canter, Anbuselvan Kuppusamy, Zalman Schwartzman, James Stephens, Kevin Farrell, Kathleen Farrell
  • Apparatus for immobilizing a solid solder element to a contact surface of interest
    Publication number: 20050121496
    Abstract: A solid solder element (106), such as a solder perform, is attached onto a contact surface of interest (102), such as a heat sink using and adhesive material (104). Placement of the adhesive material overcomes alignment and registration issues that may interfere with good contact to components (108), such as transistors, during the manufacturing/assembly process, such as a reflow process.
    Type: Application
    Filed: February 23, 2004
    Publication date: June 9, 2005
    Inventors: Kevin Farrell, Edwin Bradley, Hal Canter, Gene Kim, David McClintock