Patents by Inventor Hal Kunkel, III

Hal Kunkel, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Curved two-dimensional array transducer
    Patent number: 7821180
    Abstract: A curved two-dimensional array transducer includes a layer of piezoelectric material overlaying a layer of ASICs which is attached to a backing wing. The piezoelectric material is diced in orthogonal azimuth and elevation directions to form a two-dimensional array of transducer elements, with the dicing cuts in the elevation direction extending through the ASIC layer so that the piezoelectric layer and the ASIC layer can be bent in the azimuth direction. The backing wing provides a flexible substrate which can be bent while supporting the ASIC layer and piezoelectric elements. In a second example the piezoelectric layer and ASIC layer are attached to opposite sides of flex circuit which provides the flexible substrate after the piezoelectric layer and ASIC layer are diced.
    Type: Grant
    Filed: July 24, 2006
    Date of Patent: October 26, 2010
    Assignee: Koninklijke Philips Electronics N.V.
    Inventor: Hal Kunkel, III
  • Curved Two-Dimensional Array Transducer
    Publication number: 20080315724
    Abstract: A curved two-dimensional array transducer includes a layer of piezoelectric material overlaying a layer of ASICs which is attached to a backing wing. The piezoelectric material is diced in orthogonal azimuth and elevation directions to form a two-dimensional array of transducer elements, with the dicing cuts in the elevation direction extending through the ASIC layer so that the piezoelectric layer and the ASIC layer can be bent in the azimuth direction. The backing wing provides a flexible substrate which can be bent while supporting the ASIC layer and piezoelectric elements. In a second example the piezoelectric layer and ASIC layer are attached to opposite sides of flex circuit which provides the flexible substrate after the piezoelectric layer and ASIC layer are diced.
    Type: Application
    Filed: July 24, 2006
    Publication date: December 25, 2008
    Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.
    Inventor: Hal Kunkel, III