Abstract: Systems and methods of the present invention allow to determine ambient gas temperature in harsh environments such as in a steam autoclave chamber during a sterilization process. In certain embodiments of the invention, temperature data is gathered using a sensor that is placed in an enclosed electronics-based temperature logging device. A capsule seals the temperature logging device except for a through hole that, during regular operation, allows gas to directly contact a surface of the temperature logging device in order to reduce a time lag between the data logging device and an ambient gas. As a result, the data logging device accurately can track temperature variations when placed, for example, inside a chamber.

Abstract: Systems and methods of the present invention allow to determine ambient gas temperature in harsh environments such as in a steam autoclave chamber during a sterilization process. In certain embodiments of the invention, temperature data is gathered using a sensor that is placed in an enclosed electronics-based temperature logging device. A capsule seals the temperature logging device except for a through hole that, during regular operation, allows gas to directly contact a surface of the temperature logging device in order to reduce a time lag between the data logging device and an ambient gas. As a result, the data logging device accurately can track temperature variations when placed, for example, inside a chamber.

Abstract: Various embodiments of the invention provide for secure data communication in industrial process control architectures that employ a network of sensors and actuators. In various embodiments, data is secured by a secure serial transmission system that detects and authenticates IO-Link devices that are equipped with secure transceivers circuits, thereby, ensuring that non-trusted or non-qualified hardware is prevented from connecting to a network and potentially compromising system behavior.

Abstract: Various embodiments of the invention achieve optimal data security by adding a security layer to data at the point of generation. Some embodiments add a security feature to data that controls or configures a device at a physical interface.

Abstract: An integrated circuit package comprising an enclosure including a dielectric housing, a first electrical contact, and a second electrical contact. The dielectric housing, the first electrical contact, and the second electrical contact are configured to form a contact side of the enclosure. In addition, the first and second electrical contacts are sized to be substantially alignment insensitive for electro-mechanical connection to corresponding contacts of an end-use equipment. The enclosure encapsulates an integrated circuit die which is electrically coupled to the first and second electrical contacts. The alignment insensitive first and second electrical contacts may be electro-mechanically connected to corresponding contacts of an end-use equipment (e.g., a printer). Further, the integrated circuit package may be hosted by a peripheral device (e.g., a printer cartridge).

Abstract: An integrated circuit includes a sensing module, a measuring module, a comparing module, and memory. The sensing module senses radiation incident on the integrated circuit. The measuring module communicates with the sensing module and measures an amount of the radiation incident on the integrated circuit. The comparing module communicates with the measuring module and compares the amount of the radiation to a predetermined threshold and generates an indication that the amount of the radiation is less than the predetermined threshold or that the amount of the radiation is greater than or equal to the predetermined threshold. The memory stores the indication.

Abstract: Various embodiments of the invention provide for secure data communication in industrial process control architectures that employ a network of sensors and actuators. In various embodiments, data is secured by a secure serial transmission system that detects and authenticates IO-Link devices that are equipped with secure transceivers circuits, thereby, ensuring that non-trusted or non-qualified hardware is prevented from connecting to a network and potentially compromising system behavior.

Abstract: An integrated circuit includes a sensing module, a measuring module, a comparing module, and memory. The sensing module senses radiation incident on the integrated circuit. The measuring module communicates with the sensing module and measures an amount of the radiation incident on the integrated circuit. The comparing module communicates with the measuring module and compares the amount of the radiation to a predetermined threshold and generates an indication that the amount of the radiation is less than the predetermined threshold or that the amount of the radiation is greater than or equal to the predetermined threshold. The memory stores the indication.

Abstract: An integrated circuit package comprising an enclosure including a dielectric housing, a first electrical contact, and a second electrical contact. The dielectric housing, the first electrical contact, and the second electrical contact are configured to form a contact side of the enclosure. In addition, the first and second electrical contacts are sized to be substantially alignment insensitive for electro-mechanical connection to corresponding contacts of an end-use equipment. The enclosure encapsulates an integrated circuit die which is electrically coupled to the first and second electrical contacts. The alignment insensitive first and second electrical contacts may be electro-mechanically connected to corresponding contacts of an end-use equipment (e.g., a printer). Further, the integrated circuit package may be hosted by a peripheral device (e.g., a printer cartridge).

Abstract: An integrated circuit package comprising an enclosure including a dielectric housing, a first electrical contact, and a second electrical contact. The dielectric housing, the first electrical contact, and the second electrical contact are configured to form a contact side of the enclosure. In addition, the first and second electrical contacts are sized to be substantially alignment insensitive for electro-mechanical connection to corresponding contacts of an end-use equipment. The enclosure encapsulates an integrated circuit die which is electrically coupled to the first and second electrical contacts. The alignment insensitive first and second electrical contacts may be electro-mechanically connected to corresponding contacts of an end-use equipment (e.g., a printer). Further, the integrated circuit package may be hosted by a peripheral device (e.g., a printer cartridge).

Abstract: An integrated circuit package comprising an enclosure including a dielectric housing, a first electrical contact, and a second electrical contact. The dielectric housing, the first electrical contact, and the second electrical contact are configured to form a contact side of the enclosure. In addition, the first and second electrical contacts are sized to be substantially alignment insensitive for electro-mechanical connection to corresponding contacts of an end-use equipment. The enclosure encapsulates an integrated circuit die which is electrically coupled to the first and second electrical contacts. The alignment insensitive first and second electrical contacts may be electro-mechanically connected to corresponding contacts of an end-use equipment (e.g., a printer). Further, the integrated circuit package may be hosted by a peripheral device (e.g., a printer cartridge).

Abstract: An integrated circuit package comprising an enclosure including a dielectric housing, a first electrical contact, and a second electrical contact. The dielectric housing, the first electrical contact, and the second electrical contact are configured to form a contact side of the enclosure. In addition, the first and second electrical contacts are sized to be substantially alignment insensitive for electro-mechanical connection to corresponding contacts of an end-use equipment. The enclosure encapsulates an integrated circuit die which is electrically coupled to the first and second electrical contacts. The alignment insensitive first and second electrical contacts may be electro-mechanically connected to corresponding contacts of an end-use equipment (e.g., a printer). Further, the integrated circuit package may be hosted by a peripheral device (e.g., a printer cartridge).

Abstract: A security device is disclosed. In one embodiment, the security device includes a memory device comprising having a first memory portion configured to store a device ID; and a second memory portion configured to store a device secret. The security device further includes a processor connected to the memory device wherein the processor is configured to read the stored device ID from the first memory portion and the stored device secret from the second memory portion and perform a nonreversible computation using the stored device ID, the stored device secret, and a challenge as seeds. Additionally, the security device includes a communication circuit connected to the processor, the communication circuit configured to receive the challenge from a host device and to communicate a result of the nonreversible computation performed by the processor.

Abstract: A security device is disclosed. In one embodiment, the security device includes a memory device comprising having a first memory portion configured to store a device ID; and a second memory portion configured to store a device secret. The security device further includes a processor connected to the memory device wherein the processor is configured to read the stored device ID from the first memory portion and the stored device secret from the second memory portion and perform a nonreversible computation using the stored device ID, the stored device secret, and a challenge as seeds. Additionally, the security device includes a communication circuit connected to the processor, the communication circuit configured to receive the challenge from a host device and to communicate a result of the nonreversible computation performed by the processor.

Abstract: A device and method for measuring temperature is disclosed. The device, for example, can include a thermocouple configured to generate a voltage indicative of a junction temperature; a memory device configured to store a unique device ID and to store data; a logic unit connected to the thermocouple and the memory device; an I/O interface connected to the logic unit, the I/O interface configured to communicate with a computer system; and an internal temperature sensor connected to the logic unit, the internal temperature sensor configured to determine a cold junction temperature.

Abstract: A device and method for measuring temperature is disclosed. The device, for example, can include a thermocouple configured to generate a voltage indicative of a junction temperature; a memory device configured to store a unique device ID and to store data; a logic unit connected to the thermocouple and the memory device; an I/O interface connected to the logic unit, the I/O interface configured to communicate with a computer system; and an internal temperature sensor connected to the logic unit, the internal temperature sensor configured to determine a cold junction temperature.

Abstract: A device and method for measuring temperature is disclosed. The device, for example, can include a thermocouple configured to generate a voltage indicative of a junction temperature; a memory device configured to store a unique device ID and to store data; a logic unit connected to the thermocouple and the memory device; an I/O interface connected to the logic unit, the I/O interface configured to communicate with a computer system; and an internal temperature sensor connected to the logic unit, the internal temperature sensor configured to determine a cold junction temperature.

Abstract: Serial bus modules with unique multibit identifications that may be searched with multiple modules on a single bus. Modules may contain temperature history per integrated Arrhenius temperature dependent signal. Modules may be packaged as tokens or as two or three lead plastic plastic, also with the three lead packages further functionality as sensors or switches may be incorporated into the modules.

Abstract: A temperature-controlled counter/clock arrangement is provided where th rate or frequency of the counting is temperature dependent. This allows for a measuring of thermal accumulation and/or history. The temperature sensing is based upon the use of the varying current that will flow through a toward biased semiconductor diode. In one embodiment a constant voltage source is used so that the current variation will follow Arrhenius's law.

Abstract: A method of communicating information between a host device and a potentially portable module device which measures thermal accumulation over time via a temperature controlled counter. The temperature controlled counter may operate using substantially Arrhenius' law. The host device communicates with the portable module via a single wire bidirectional data bus. The single wire bus and one-wire communication protocol allows data flow between a host and a plurality of devices connected to the single wire bus. The single wire bus allows for a great versatility of uses for the portable module.