Patents by Inventor Hal Mitchell

Hal Mitchell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias
    Patent number: 6358439
    Abstract: A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: March 19, 2002
    Assignee: International Business Machines Corporation
    Inventors: Farid Youssif Aoude, Lawrence Daniel David, Renuka Shastri Divakaruni, Shaji Farooq, Lester Wynn Herron, Hal Mitchell Lasky, Anthony Mastreani, Govindarajan Natarajan, Srinivasa S. N. Reddy, Vivek Madan Sura, Rao Venkateswara Vallabhaneni, Donald Rene Wall
  • Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias
    Patent number: 6124041
    Abstract: A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.
    Type: Grant
    Filed: March 11, 1999
    Date of Patent: September 26, 2000
    Assignee: International Business Machines Corporation
    Inventors: Farid Youssif Aoude, Lawrence Daniel David, Renuka Shastri Divakaruni, Shaji Farooq, Lester Wynn Herron, Hal Mitchell Lasky, Anthony Mastreani, Govindarajan Natarajan, Srinivasa S. N. Reddy, Vivek Madan Sura, Rao Venkateswara Vallabhaneni, Donald Rene Wall
  • Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias
    Patent number: 5925443
    Abstract: A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.
    Type: Grant
    Filed: September 10, 1991
    Date of Patent: July 20, 1999
    Assignee: International Business Machines Corporation
    Inventors: Farid Youssif Aoude, Lawrence Daniel David, Renuka Shastri Divakaruni, Shaji Farooq, Lester Wynn Herron, Hal Mitchell Lasky, Anthony Mastreani, Govindarajan Natarajan, Srinivasa S. N. Reddy, Vivek Madan Sura, Rao Venkateswara Vallabhaneni, Donald Rene Wall
  • Junction box for quick release mounting of electrical circuit components
    Patent number: 5415564
    Abstract: Improvements in wiring assemblies using an electrical junction box assembly having preset electrical terminals. Such present terminals are hard-wired to certain electrical connection devices near the outer periphery of the box. Electrical components, such as a switch, a receptacle and the like can be quickly and easily mounted in place in the box in electrical contact with respective preset terminals. The selective electrical component can be provided with a number of pins at predetermined locations for electrical contact with certain of the preset terminals. One or more power-receiving members, such as a light fixture, can be coupled to respective outer peripheral electrical connection devices for receiving the three or four individual wires of an electrical line from each power-receiving member.
    Type: Grant
    Filed: January 14, 1994
    Date of Patent: May 16, 1995
    Inventors: Craig Winter, Hal Mitchell, Robert J. M. Curmpton