Abstract: The invention provides a method and apparatus to process and assemble optical subsystems. In one aspect, the optical subsystems are placed on a carrier apparatus adapted to support a plurality of the optical subsystems in a desired process orientation and with a desired spacing to provide high process throughput. In one aspect of the invention, optical components are assembled and sequentially processed in various steps, such as component installation, optical fiber preparation, component attachment, fiber trim, optical fiber polishing, and optical component testing to produce a finished optical subsystem.

Abstract: Methods and compositions are provided for planarizing a substrate with selective removal rates and low dishing, wherein the substrate comprises multiple dielectric materials, such as silicon oxide and a thin underlayer of silicon nitride used as a stop layer. One aspect of the method includes using a fixed abrasive polishing pad and at least one amino acid as a polishing fluid additive capable of significantly enhancing the polishing process. Amino acid addition in combination with fixed abrasive polishing of shallow trench isolation structures offers high topography and oxide to nitride selectivity.

Abstract: The invention provides a method and apparatus to process and assemble optical subsystems. In one aspect, the optical subsystems are placed on a carrier apparatus adapted to support a plurality of the optical subsystems in a desired process orientation and with a desired spacing to provide high process throughput. In one aspect of the invention, optical components are assembled and sequentially processed in various steps, such as component installation, optical fiber preparation, component attachment, fiber trim, optical fiber polishing, and optical component testing to produce a finished optical subsystem.