Abstract: A field effect transistor having at least one structure configured to redistribute and/or reduce an electric field from gate finger ends is disclosed. Embodiments of the field effect transistor include a substrate, an active region disposed on the substrate, at least one source finger in contact with the active region, at least one drain finger in contact with the active region, and at least one gate finger in rectifying contact with the active region. One embodiment has at least one end of the at least one gate finger extending outside of the active region. Another embodiment includes at least one source field plate integral with the at least one source finger. The at least one source field plate extends over the at least one gate finger that includes a portion outside of the active region. Either embodiment can also include a sloped gate foot to further improve high voltage operation.

Abstract: A semiconductor device with reduced leakage current and a method of making the same is disclosed. The semiconductor device includes a substrate having a device layer, a dielectric layer, and a gate metal opening within the dielectric layer between a source contact and a gate contact. A first metal layer is disposed within the gate metal opening, and a second metal layer is disposed directly onto the second metal layer, wherein the second metal layer is oxidized and has a thickness that ranges from about 4 Angstroms to about 20 Angstroms to limit a leakage current of a total gate periphery to between around 0.1 ?A/mm and around 50 ?A/mm. A current carrying layer is disposed on the second metal layer. In one embodiment, the first metal layer is nickel (Ni), the second metal layer is palladium (Pd), and the current carrying layer is gold (Au).

Abstract: A field effect transistor having at least one structure configured to redistribute and/or reduce an electric field from gate finger ends is disclosed. Embodiments of the field effect transistor include a substrate, an active region disposed on the substrate, at least one source finger in contact with the active region, at least one drain finger in contact with the active region, and at least one gate finger in rectifying contact with the active region. One embodiment has at least one end of the at least one gate finger extending outside of the active region. Another embodiment includes at least one source field plate integral with the at least one source finger. The at least one source field plate extends over the at least one gate finger that includes a portion outside of the active region. Either embodiment can also include a sloped gate foot to further improve high voltage operation.

Abstract: A field effect transistor having at least one structure configured to redistribute and/or reduce an electric field from gate finger ends is disclosed. Embodiments of the field effect transistor include a substrate, an active region disposed on the substrate, at least one source finger in contact with the active region, at least one drain finger in contact with the active region, and at least one gate finger in rectifying contact with the active region. One embodiment has at least one end of the at least one gate finger extending outside of the active region. Another embodiment includes at least one source field plate integral with the at least one source finger. The at least one source field plate extends over the at least one gate finger that includes a portion outside of the active region. Either embodiment can also include a sloped gate foot to further improve high voltage operation.

Abstract: A semiconductor device with reduced leakage current and a method of making the same is disclosed. The semiconductor device includes a substrate having a device layer, a dielectric layer, and a gate metal opening within the dielectric layer between a source contact and a gate contact. A first metal layer is disposed within the gate metal opening, and a second metal layer is disposed directly onto the second metal layer, wherein the second metal layer is oxidized and has a thickness that ranges from about 4 Angstroms to about 20 Angstroms to limit a leakage current of a total gate periphery to between around 0.1 ?A/mm and around 50 ?A/mm. A current carrying layer is disposed on the second metal layer. In one embodiment, the first metal layer is nickel (Ni), the second metal layer is palladium (Pd), and the current carrying layer is gold (Au).

Abstract: Embodiments include methods of making semiconductor devices with low leakage Schottky contacts. An embodiment includes providing a partially completed semiconductor device including a substrate, a semiconductor on the substrate, and a passivation layer on the semiconductor, and using a first mask, locally etching the passivation layer to expose a portion of the semiconductor. Without removing the first mask, a Schottky contact is formed of a first material on the exposed portion of the semiconductor, and the mask is removed. Using a further mask, a step-gate conductor of a second material electrically coupled to the Schottky contact is formed overlying parts of the passivation layer adjacent to the Schottky contact. By minimizing the process steps between opening the Schottky contact window in the passivation layer and forming the Schottky contact material in this window, the gate leakage of a resulting field effect device having a Schottky gate may be substantially reduced.

Abstract: Methods for fabricating a field effect transistor having at least one structure configured to redistribute and/or reduce an electric field from gate finger ends are disclosed. The methods provide field effect transistors that each include a substrate, an active region disposed on the substrate, at least one source finger in contact with the active region, at least one drain finger in contact with the active region, and at least one gate finger in rectifying contact with the active region. One embodiment has at least one end of the at least one gate finger extending outside of the active region. At least one method includes etching at least one gate channel into the passivation layer with a predetermined slope that reduces electric fields at a gate edge. Other methods include steps for fabricating a sloped gate foot, a round end, and/or a chamfered end to further improve high voltage operation.

Abstract: Semiconductor devices are provided with dual passivation layers. A semiconductor layer is formed on a substrate and covered by a first passivation layer (PL-1). PL-1 and part of the semiconductor layer are etched to form a device mesa. A second passivation layer (PL-2) is formed over PL-1 and exposed edges of the mesa. Vias are etched through PL-1 and PL-2 to the semiconductor layer where source, drain and gate are to be formed. Conductors are applied in the vias for ohmic contacts for the source-drain and a Schottky contact for the gate. Interconnections over the edges of the mesa couple other circuit elements. PL-1 avoids adverse surface states near the gate and PL-2 insulates edges of the mesa from overlying interconnections to avoid leakage currents. An opaque alignment mark is desirably formed at the same time as the device to facilitate alignment when using transparent semiconductors.

Abstract: Embodiments include methods of making semiconductor devices with low leakage Schottky contacts. An embodiment includes providing a partially completed semiconductor device including a substrate, a semiconductor on the substrate, and a passivation layer on the semiconductor, and using a first mask, locally etching the passivation layer to expose a portion of the semiconductor. Without removing the first mask, a Schottky contact is formed of a first material on the exposed portion of the semiconductor, and the mask is removed. Using a further mask, a step-gate conductor of a second material electrically coupled to the Schottky contact is formed overlying parts of the passivation layer adjacent to the Schottky contact. By minimizing the process steps between opening the Schottky contact window in the passivation layer and forming the Schottky contact material in this window, the gate leakage of a resulting field effect device having a Schottky gate may be substantially reduced.

Abstract: Embodiments include semiconductor devices with low leakage Schottky contacts. An embodiment is formed by providing a partially completed semiconductor device including a substrate, a semiconductor on the substrate, and a passivation layer on the semiconductor, and using a first mask, locally etching the passivation layer to expose a portion of the semiconductor. Without removing the first mask, a Schottky contact is formed of a first material on the exposed portion of the semiconductor, and the first mask is removed. Using a further mask, a step-gate conductor of a second material electrically coupled to the Schottky contact is formed overlying parts of the passivation layer adjacent to the Schottky contact. By minimizing the process steps between opening the Schottky contact window in the passivation layer and forming the Schottky contact material in this window, the gate leakage of a resulting field effect device having a Schottky gate may be substantially reduced.

Abstract: A field effect transistor having at least one structure configured to redistribute and/or reduce an electric field from gate finger ends is disclosed. Embodiments of the field effect transistor include a substrate, an active region disposed on the substrate, at least one source finger in contact with the active region, at least one drain finger in contact with the active region, and at least one gate finger in rectifying contact with the active region. One embodiment has at least one end of the at least one gate finger extending outside of the active region. Another embodiment includes at least one source field plate integral with the at least one source finger. The at least one source field plate extends over the at least one gate finger that includes a portion outside of the active region. Either embodiment can also include a sloped gate foot to further improve high voltage operation.

Abstract: Methods for fabricating a field effect transistor having at least one structure configured to redistribute and/or reduce an electric field from gate finger ends are disclosed. The methods provide field effect transistors that each include a substrate, an active region disposed on the substrate, at least one source finger in contact with the active region, at least one drain finger in contact with the active region, and at least one gate finger in rectifying contact with the active region. One embodiment has at least one end of the at least one gate finger extending outside of the active region. At least one method includes etching at least one gate channel into the passivation layer with a predetermined slope that reduces electric fields at a gate edge. Other methods include steps for fabricating a sloped gate foot, a round end, and/or a chamfered end to further improve high voltage operation.

Abstract: Semiconductor devices are provided with dual passivation layers. A semiconductor layer is formed on a substrate and covered by a first passivation layer (PL-1). PL-1 and part of the semiconductor layer are etched to form a device mesa. A second passivation layer (PL-2) is formed over PL-1 and exposed edges of the mesa. Vias are etched through PL-1 and PL-2 to the semiconductor layer where source, drain and gate are to be formed. Conductors are applied in the vias for ohmic contacts for the source-drain and a Schottky contact for the gate. Interconnections over the edges of the mesa couple other circuit elements. PL-1 avoids adverse surface states near the gate and PL-2 insulates edges of the mesa from overlying interconnections to avoid leakage currents. An opaque alignment mark is desirably formed at the same time as the device to facilitate alignment when using transparent semiconductors.

Abstract: Semiconductor devices (61) and methods (80-89, 100) are provided with dual passivation layers (56, 59). A semiconductor layer (34) is formed on a substrate (32) and covered by a first passivation layer (PL-1) (56). PL-1 (56) and part (341) of the semiconductor layer (34) are etched to form a device mesa (35). A second passivation layer (PL-2) (59) is formed over PL-1 (56) and exposed edges (44) of the mesa (35). Vias (90, 92, 93) are etched through PL-1 (56) and PL-2 (59) to the semiconductor layer (34) where source (40), drain (42) and gate are to be formed. Conductors (41, 43, 39) are applied in the vias (90, 92, 93) for ohmic contacts for the source-drain (40, 42) and a Schottky contact (39) for the gate. Interconnections (45, 47) over the edges (44) of the mesa (35) couple other circuit elements. PL-1 (56) avoids adverse surface states (52) near the gate and PL-2 (59) insulates edges (44) of the mesa (35) from overlying interconnections (45, 47) to avoid leakage currents (46).

Abstract: Embodiments include semiconductor devices with low leakage Schottky contacts. An embodiment is formed by providing a partially completed semiconductor device including a substrate, a semiconductor on the substrate, and a passivation layer on the semiconductor, and using a first mask, locally etching the passivation layer to expose a portion of the semiconductor. Without removing the first mask, a Schottky contact is formed of a first material on the exposed portion of the semiconductor, and the first mask is removed. Using a further mask, a step-gate conductor of a second material electrically coupled to the Schottky contact is formed overlying parts of the passivation layer adjacent to the Schottky contact. By minimizing the process steps between opening the Schottky contact window in the passivation layer and forming the Schottky contact material in this window, the gate leakage of a resulting field effect device having a Schottky gate may be substantially reduced.

Abstract: Methods and apparatus are described for semiconductor devices. A method comprises providing a partially completed semiconductor device including a substrate, a semiconductor on the substrate, and a passivation layer on the semiconductor, and using a first mask, locally etching the passivation layer to expose a portion of the semiconductor, and without removing the first mask, forming a Schottky contact of a first material on the exposed portion of the semiconductor, then removing the first mask, and using a further mask, forming a step-gate conductor of a second material electrically coupled to the Schottky contact and overlying parts of the passivation layer adjacent to the Schottky contact. By minimizing the process steps between opening the Schottky contact window in the passivation layer and forming the Schottky contact material in this window, the gate leakage of a resulting field effect device having a Schottky gate may be substantially reduced.

Abstract: Method and apparatus are described for semiconductor devices. The method (100) comprises, providing a partially completed semiconductor device (31-1) including a substrate (21), a semiconductor (22) on the substrate (21) and a passivation layer (25) on the semiconductor (22), and using a first mask (32), locally etching the passivation layer (25) to expose a portion (36) of the semiconductor (22), and without removing the first mask (32) forming a Schottky contact (42-1) of a first material on the exposed portion (36) of the semiconductor (22), then removing the first mask (32) and using a further mask (44), forming a step-gate conductor (48-1) of a second material electrically coupled to the Schottky contact (42-1) and overlying parts (25-1) of the passivation layer (25) adjacent to the Schottky contact (42-1).

Abstract: An electronic component includes a substrate (110) and an airbridge (890) located over the substrate. The airbridge has at least a first layer and a second layer over the first layer. The airbridge is electrically conductive where the first layer of the airbridge is less resistive than the second layer of the airbridge.

Abstract: A method of manufacturing a semiconductor component includes forming a first capacitor electrode (126) over a substrate (110), forming a capacitor dielectric layer (226) over the first capacitor electrode, and forming a second capacitor electrode (326) over the capacitor dielectric layer. The capacitor dielectric layer is made of aluminum.