Patents by Inventor Haley M. Steffen

Haley M. Steffen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for extreme performance die attach
    Patent number: 11373976
    Abstract: A method for fabricating semiconductor die with die-attach preforms is disclosed. In embodiments, the method includes: applying an uncured die-attach paste material to a surface of a forming substrate to form one or more die-attach preforms, the surface of the forming substrate formed from a hydrophobic material; curing the one or more die-attach preforms; performing one or more planarization processes on the one or more die-attach preforms; coupling a first surface of a semiconductor die to a handling tool; and bonding a second surface of the semiconductor die to at least one die-attach preform of the one or more die-attach preforms.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: June 28, 2022
    Assignee: Rockwell Collins, Inc.
    Inventors: Nathan P. Lower, Haley M. Steffen, Ross K. Wilcoxon, David L. Westergren, Brian K. Otis, Pete Sahayda
  • System and Method for Extreme Performance Die Attach
    Publication number: 20210202433
    Abstract: A method for fabricating semiconductor die with die-attach preforms is disclosed. In embodiments, the method includes: applying an uncured die-attach paste material to a surface of a forming substrate to form one or more die-attach preforms, the surface of the forming substrate formed from a hydrophobic material; curing the one or more die-attach preforms; performing one or more planarization processes on the one or more die-attach preforms; coupling a first surface of a semiconductor die to a handling tool; and bonding a second surface of the semiconductor die to at least one die-attach preform of the one or more die-attach preforms.
    Type: Application
    Filed: August 2, 2019
    Publication date: July 1, 2021
    Inventors: Nathan P. Lower, Haley M. Steffen, Ross K. Wilcoxon, David L. Westergren, Brian K. Otis, Pete Sahayda