Abstract: An electronic module with a dual contact and contactless communication interface, has, on a first face, an electric contact terminal for contact with corresponding contacts of a smart card reader, and, on a second face, an antenna with a coil and a microelectronic chip coated with insulating resin and provided with a contactless communication interface. The antenna has a proximal connection pad and a distal connection pad to be connected to the corresponding terminals of the contactless communication interface of the chip. The proximal connection pad and distal connection pad of the antenna are arranged inside the encapsulation area by an insulating resin, in such a way as to produce a conductive bridge between each proximal connection pad or distal connection pad and the corresponding terminal of the chip, directly via connection wires between said connection pads and the corresponding terminals of the chip, without using vias.