Abstract: A Multi-layer Ceramic Capacitor (MLCC) device of a low self-inductance is disclosed. The MLCC device includes a plurality of ceramic sheets arranged in parallel to each other, a plurality of inner metal electrodes, and a plurality of outer electrodes including a pair of positive terminals and a pair of negative terminals. The plurality of inner metal electrodes and the plurality of ceramic sheets are stacked alternately to form a plurality of capacitors. The plurality of outer electrodes is disposed on corners of the plurality of ceramic sheets such that the pair of positive terminals is disposed on adjacent corners of the plurality of ceramic sheets and the pair of negative terminals is disposed on other set of adjacent corners of the plurality of ceramic sheets. An MLCC device having the plurality of outer electrodes disposed on middle portions of the edges of the plurality of ceramic sheets is also disclosed.

Abstract: A semiconductor device package, for example a flip-chip package, having a solder bump mounted above a polymer layer for use in flip-chip mounting of a semiconductor device to a circuit board. A polymer layer such as polybenzoxazole is formed overlying a wafer passivation layer. Solder bumps are attached to an under-bump metallization layer and electrically coupled to conductive bond pads exposed by openings in the wafer passivation layer.