Patents by Inventor Halvar Young Loken

Halvar Young Loken has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composite panels having improved fluid impermeability
    Patent number: 8206808
    Abstract: A prepreg composite material that includes a fiber layer and a resin comprising a thermoset resin component, a curing agent and a fibrous micropulp. The micropulp component is an aramid fiber having a volume average length of from 0.01 to 100 micrometers. The prepreg is useful in composite panel construction for minimizing fluid permeation into the cured structure. This prepreg is particularly suitable for making honeycomb sandwich panels. Film adhesives, liquid and paste resins containing aramid fiber micropulp are also disclosed.
    Type: Grant
    Filed: June 2, 2011
    Date of Patent: June 26, 2012
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Subhotosh Khan, Halvar Young Loken
  • COMPOSITE PANELS HAVING IMPROVED FLUID IMPERMEABILITY
    Publication number: 20110274873
    Abstract: A prepreg composite material that includes a fiber layer and a resin comprising a thermoset resin component, a curing agent and a fibrous micropulp. The micropulp component is an aramid fiber having a volume average length of from 0.01 to 100 micrometers. The prepreg is useful in composite panel construction for minimizing fluid permeation into the cured structure. This prepreg is particularly suitable for making honeycomb sandwich panels. Film adhesives, liquid and paste resins containing aramid fiber micropulp are also disclosed.
    Type: Application
    Filed: June 2, 2011
    Publication date: November 10, 2011
    Applicant: E. I. DU PONT DE NEMOURS AND COMPANY
    Inventors: SUBHOTOSH KHAN, HALVAR YOUNG LOKEN
  • Film adhesive of thermoset resin, curing agent and fibrous micropulp
    Patent number: 7927691
    Abstract: A prepreg composite material that includes a fiber layer and a resin comprising a thermoset resin component, a curing agent and a fibrous micropulp. The micropulp component is an aramid fiber having a volume average length of from 0.01 to 100 micrometers. The prepreg is useful in composite panel construction for minimizing fluid permeation into the cured structure. This prepreg is particularly suitable for making honeycomb sandwich panels. Film adhesives, liquid and paste resins containing aramid fiber micropulp are also disclosed.
    Type: Grant
    Filed: April 3, 2009
    Date of Patent: April 19, 2011
    Assignee: E.I. du Pont de Nemours and Company
    Inventors: Subhotosh Khan, Halvar Young Loken
  • COMPOSITE PANELS HAVING IMPROVED FLUID IMPERMEABILITY
    Publication number: 20090252920
    Abstract: A prepreg composite material that includes a fiber layer and a resin comprising a thermoset resin component, a curing agent and a fibrous micropulp. The micropulp component is an aramid fiber having a volume average length of from 0.01 to 100 micrometers. The prepreg is useful in composite panel construction for minimizing fluid permeation into the cured structure. This prepreg is particularly suitable for making honeycomb sandwich panels. Film adhesives, liquid and paste resins containing aramid fiber micropulp are also disclosed.
    Type: Application
    Filed: April 3, 2009
    Publication date: October 8, 2009
    Applicant: E.I. DU PONT DE NEMOURS AND COMPANY
    Inventors: Subhotosh Khan, Halvar Young Loken