Abstract: A sensor module is provided having a compact housing containing a sensor. A low temperature co-fired ceramic substrate is located on the housing. The sensor and signal processing circuitry are located on the low temperature co-fired ceramic substrate. The sensor module further includes a metal shield substantially encapsulating the sensor.

Abstract: A leak-testing technique and apparatus for differential pressure sensor arrays is provided. A reference pressure sensor array is provided, wherein a seal is disposed between the reference pressure sensor array and a target differential pressure sensor array. A probe socket is utilized to communicate with each individual sensor in the reference pressure sensor array. The target pressure sensor array and the reference pressure sensor array are sealed via a pressure plate and plunger assembly. The target pressure sensor array, seal, and reference pressure sensor array are exposed to a first pressure. The target differential pressure sensor array, seal, and reference pressure sensor array are then exposed to a second pressure. The probe socket verifies that all reference pressure sensors continue to output the first pressure. If the probe socket identifies a reference pressure sensor that reads the second pressure, then the corresponding target pressure sensor is identified as being defective because of leakage.

Abstract: A technique for manufacturing an integrated pressure sensor includes a number of steps. Initially, a substrate with conductive electrical traces located on first and second sides of the substrate is provided. A plurality of compensation circuits are positioned in an array on the first side of the substrate in electrical contact with one or more of the conductive electrical traces on the first side of the substrate. A plurality of pressure sensors are positioned on the second side of the substrate in electrical contact with one or more of the conductive electrical traces on the second side of the substrate. Each one of the sensors is associated with one of the compensation circuits to form a plurality of pressure sensor-compensation circuit pairs. The substrate includes conductive vias to electrically connect each of the sensor-compensation circuit pairs. Each of the compensation circuits provides temperature compensation for an associated one of the sensors.

Abstract: A sensor and method are provided for transmitting sensor generated output signals in a pulse width modulated output signal. The sensor includes a pressure sensing element for sensing pressure and temperature sensing circuitry for sensing temperature. Output circuitry outputs a pulse width modulated signal containing an indication of the pressure and temperature. The pressure is transmitted as a function of duty cycle of the pulse width modulated output signal, and the temperature is transmitted as a function of frequency of the pulse width modulated output signal.

Abstract: An infrared sensor including an absorber for absorbing incident infrared power to produce a signal representing the temperature of a target object, a frame supporting a membrane which carries the absorber, the frame including a plurality of reflecting surfaces disposed about the circumference of an opening over which the membrane spans for reflecting incident infrared power toward the absorber. By concentrating incident infrared power through reflection, the temperature difference between the absorber and the surrounding frame is increased, thereby producing an increased electrical output from the sensor.

Abstract: A pressure sensor module is provided with an isolation platform which isolates stress. The pressure sensor module includes a base structure and a cantilever member formed in the base structure by an isolation gap. A pressure sensing element is located on the cantilever member such that the cantilever member provides stress isolation to the pressure sensing element.