Patents by Inventor Hamid MOHIUDDIN

Hamid MOHIUDDIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11560913
    Abstract: Methods of forming a metallic-ceramic brazed joint are disclosed herein. The method of forming the brazed joint includes deoxidizing the surface of metallic components, assembling the joint, heating the joint to fuse the joint components, and cooling the joint. In certain embodiments, the brazed joint includes a conformal layer. In further embodiments, the brazed joint has features in order to reduce stress concentrations within the joint.
    Type: Grant
    Filed: January 16, 2019
    Date of Patent: January 24, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Govinda Raj, Tom K. Cho, Hamid Mohiuddin, Ian Widlow
  • Publication number: 20190226512
    Abstract: Methods of forming a metallic-ceramic brazed joint are disclosed herein. The method of forming the brazed joint includes deoxidizing the surface of metallic components, assembling the joint, heating the joint to fuse the joint components, and cooling the joint. In certain embodiments, the brazed joint includes a conformal layer. In further embodiments, the brazed joint has features in order to reduce stress concentrations within the joint.
    Type: Application
    Filed: January 16, 2019
    Publication date: July 25, 2019
    Inventors: Govinda RAJ, Tom K. CHO, Hamid MOHIUDDIN, Ian WIDLOW
  • Patent number: 10005025
    Abstract: Embodiments disclosed herein include a plasma source, and an abatement system for abating compounds produced in semiconductor processes. In one embodiment, a plasma source is disclosed. The plasma source includes a body having an inlet and an outlet, and the inlet and the outlet are fluidly coupled within the body. The body further includes inside surfaces, and the inside surfaces are coated with yttrium oxide or diamond-like carbon. The plasma source further includes a flow splitter disposed in the body in a position that formed two flow paths between the inlet and the outlet, and a plasma generator disposed in a position operable to form a plasma within the body between the flow splitter and inside surfaces of the body.
    Type: Grant
    Filed: October 7, 2015
    Date of Patent: June 26, 2018
    Assignee: Applied Materials, Inc
    Inventors: Govinda Raj, Monika Agarwal, Hamid Mohiuddin, Kadthala R. Narendrnath
  • Publication number: 20160107117
    Abstract: Embodiments disclosed herein include a plasma source, and an abatement system for abating compounds produced in semiconductor processes. In one embodiment, a plasma source is disclosed. The plasma source includes a body having an inlet and an outlet, and the inlet and the outlet are fluidly coupled within the body. The body further includes inside surfaces, and the inside surfaces are coated with yttrium oxide or diamond-like carbon. The plasma source further includes a flow splitter disposed in the body in a position that formed two flow paths between the inlet and the outlet, and a plasma generator disposed in a position operable to form a plasma within the body between the flow splitter and inside surfaces of the body.
    Type: Application
    Filed: October 7, 2015
    Publication date: April 21, 2016
    Inventors: Govinda RAJ, Monika AGARWAL, Hamid MOHIUDDIN, Kadthala R. NARENDRNATH