Patents by Inventor Hamid Norrbakhsh

Hamid Norrbakhsh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6575622
    Abstract: The invention solves the problem of continuously monitoring wafer temperature during processing using an optical or fluoro-optical temperature sensor including an optical fiber having an end next to and facing the backside of the wafer. This optical fiber is accommodated without disturbing plasma processing by providing in one of the wafer lift pins an axial void through which the optical fiber passes. The end of the fiber facing the wafer backside is coincident with the end of the hollow lift pin. The other end is coupled via an “external” optical fiber to temperature probe electronics external of the reactor chamber. The invention uses direct wafer temperature measurements with a test wafer to establish a data base of wafer temperature behavior as a function of coolant pressure and a data base of wafer temperature behavior as a function of wafer support or “puck” temperature.
    Type: Grant
    Filed: December 7, 2001
    Date of Patent: June 10, 2003
    Assignee: Applied Materials Inc.
    Inventors: Hamid Norrbakhsh, Mike Welch, Paul Luscher, Siamak Salimian, Brad Mays
  • Publication number: 20020048311
    Abstract: The invention solves the problem of continuously monitoring wafer temperature during processing using an optical or fluoro-optical temperature sensor including an optical fiber having an end next to and facing the backside of the wafer. This optical fiber is accommodated without disturbing plasma processing by providing in one of the wafer lift pins an axial void through which the optical fiber passes. The end of the fiber facing the wafer backside is coincident with the end of the hollow lift pin. The other end is coupled via an “external” optical fiber to temperature probe electronics external of the reactor chamber. The invention uses direct wafer temperature measurements with a test wafer to establish a data base of wafer temperature behavior as a function of coolant pressure and a data base of wafer temperature behavior as a function of wafer support or “puck” temperature.
    Type: Application
    Filed: December 7, 2001
    Publication date: April 25, 2002
    Applicant: Applied Materials, Inc.
    Inventors: Hamid Norrbakhsh, Mike Welch, Paul E. Luscher, Siamak Salimian, Brad Mays
  • Patent number: 6353210
    Abstract: The invention solves the problem of continuously monitoring wafer temperature during processing using an optical or fluoro-optical temperature sensor including an optical fiber having an end next to and facing the backside of the wafer. This optical fiber is accommodated without disturbing plasma processing by providing in one of the wafer lift pins an axial void through which the optical fiber passes. The end of the fiber facing the wafer backside is coincident with the end of the hollow lift pin. The other end is coupled via an “external” optical fiber to temperature probe electronics external of the reactor chamber. The invention uses direct wafer temperature measurements with a test wafer to establish a data base of wafer temperature behavior as a function of coolant pressure and a data base of wafer temperature behavior as a function of wafer support or “puck” temperature.
    Type: Grant
    Filed: April 11, 2000
    Date of Patent: March 5, 2002
    Assignee: Applied Materials Inc.
    Inventors: Hamid Norrbakhsh, Mike Welch, Paul Luscher, Siamak Salimian, Brad Mays