Abstract: A semiconductor device and method by which a device chip with a micromachine is directly surface mounted to a circuit board. A capping chip is bonded to the device chip and encloses the micromachine. The capping chip has a first surface facing the device chip, an oppositely-disposed second surface, and electrical interconnects through the capping chip between the first and second surfaces. The electrical interconnects electrically communicate with runners on the device chip that are electrically connected to the micromachine, thereby providing a signal path from the micromachine to the exterior of the device. The capping chip further includes bond pads for electrical communication with the electrical interconnects. With the bond pads, the capping chip can be surface mounted to a circuit board by reflowing solder bumps formed on the bond pads.

Abstract: An improved weight estimation apparatus includes a closed elastomeric bladder filled with fluid and installed in the foam cushion of a vehicle seat bottom, with at least one pressure sensor installed in a closed exit port of the bladder. A temperature sensor disposed in proximity to the bladder provides a temperature signal, and a controller estimates the weight of the occupant based on the temperature and pressure signals. The pressure sensor is preferably configured to sense the gage pressure--that is, the differential pressure between the fluid and atmospheric pressure--at the center of gravity of the fluid in order to provide a stable output independent of changing atmospheric pressure and changing orientation of the bladder due to vehicle pitch and roll.