Abstract: A lead-frame structure and a magnetic core structure combined with lead-frame structure are described. The lead-frame structure includes a frame, a first metal terminal assembly, and a second metal terminal assembly. The frame includes a first assembling portion and a second assembling portion spaced apart from each other. The first metal terminal assembly is formed on the first assembling portion and includes first terminals. The second metal terminal assembly is formed on the second assembling portion and includes second terminals. A top surface of each first terminal, a top surface of each second terminal, a top surface of the first assembling portion, and a top surface of the second assembling portion are coplanar. The magnetic core structure includes a body combined with the above-described lead-frame structure. The body provides convex beds to improve a positional accuracy of the first terminals and the second terminals.

Abstract: A magnetic core includes a winding core portion and two flange portions. The winding core portion is an octagonal cylinder. Two flange portions are respectively provided to two ends of the octagonal cylinder. Each of two flange portions has a top surface. One end of each of plural winding wires is connected to the top surface of one of two flange portions, and the other end of each of the winding wires is connected to the top surface of the other one of two flange portions. The octagonal cylinder has a first lateral surface and a second lateral surface adjacent to each other. The first lateral surface of the octagonal cylinder is parallel to the top surface of each of two flange portions. The area of the first lateral surface of the octagonal cylinder is less than the area of the second lateral surface of the octagonal cylinder.

Abstract: A patch type transformer includes a magnetic core and four coils wound around a winding portion of the magnetic core. A first flange portion and a second flange portion of the magnetic core are respectively connected to two ends of the winding portion. First to fourth pads are sequentially arranged on the first flange portion along a first direction. Fifth to eighth pads are sequentially arranged on the second flange portion along a second direction opposite to the first direction. Two ends of the first coil are respectively connected to the first pad and the seventh pad. Two ends of the second coil are respectively connected to the third pad and the fifth pad. Two ends of the third coil are respectively connected to the second pad and the eighth pad. Two ends of the fourth coil are respectively connected to the fourth pad and the sixth pad.

Abstract: An improved low cost and highly consistent inductive apparatus. In one embodiment, the low cost and highly consistent inductive apparatus addresses concerns with so called conductive anodic filament (CAF) that occurs within these laminate structures. These conditions include high humidity, high bias voltage (i.e. a large voltage differential), high-moisture content, surface and resin ionic impurities, glass to resin bond weakness and exposure to high assembly temperatures that can occur, for example, during lead free solder bonding application. In a variant, mixed mode coupling techniques are utilized in order to extend the underlying operating bandwidth of the substrate inductive device. Methods of manufacturing and using the aforementioned substrate inductive devices are also disclosed.

Abstract: An improved low cost and highly consistent inductive apparatus. In one embodiment, the low cost and highly consistent inductive apparatus addresses concerns with so called conductive anodic filament (CAF) that occurs within these laminate structures by incorporating surface mountable chip chokes in the underlying circuit design, These conditions that result in undesirable CAF include high humidity, high bias voltage (i.e. a large voltage differential), high-moisture content, surface and resin ionic impurities, glass to resin bond weakness and exposure to high assembly temperatures that can occur, for example, during lead free solder bonding application. Methods of manufacturing and using the aforementioned substrate inductive devices are also disclosed.

Abstract: An improved low cost and highly consistent inductive apparatus. In one embodiment, the low cost and highly consistent inductive apparatus addresses concerns with so called conductive anodic filament (CAF) that occurs within these laminate structures. These conditions include high humidity, high bias voltage (i.e. a large voltage differential), high-moisture content, surface and resin ionic impurities, glass to resin bond weakness and exposure to high assembly temperatures that can occur, for example, during lead free solder bonding application. In a variant, mixed mode coupling techniques are utilized in order to extend the underlying operating bandwidth of the substrate inductive device. Methods of manufacturing and using the aforementioned substrate inductive devices are also disclosed.

Abstract: An improved low cost and highly consistent inductive apparatus. In one embodiment, the low cost and highly consistent inductive apparatus addresses concerns with so called conductive anodic filament (CAF) that occurs within these laminate structures. These conditions include high humidity, high bias voltage (i.e. a large voltage differential), high-moisture content, surface and resin ionic impurities, glass to resin bond weakness and exposure to high assembly temperatures that can occur, for example, during lead free solder bonding application. Methods of manufacturing and using the aforementioned substrate inductive devices are also disclosed.

Abstract: A low cost, low profile, small size and high performance electronic device for use in, e.g., electronic circuits where a transformer, inductor, or mixer is required. In one exemplary embodiment, the device includes a “binocular” ferrite core comprising a plurality of core apertures and windings. The core is shaped with one or more channels which are at least partly plated (metallized) so as to allow bonding of the winding terminations directly to the core. The placement of these plated areas allows simplified surface mounting. The plated areas also obviate a termination header, thereby simplifying the manufacture of the device and reducing its cost. Methods for manufacturing the device are also disclosed.

Abstract: A low cost, low profile, small size and high performance electronic device for use in, e.g., electronic circuits where a transformer, inductor, or mixer is required. In one exemplary embodiment, the device includes a “binocular” ferrite core comprising a plurality of core apertures and windings. The core is shaped with one or more channels which are at least partly plated (metallized) so as to allow bonding of the winding terminations directly to the core. The placement of these plated areas allows simplified surface mounting. The plated areas also obviate a termination header, thereby simplifying the manufacture of the device and reducing its cost. Methods for manufacturing the device are also disclosed.