Abstract: A thin film deposition method may include preparing a substrate structure having an opening region formed in a vertical direction and a plurality of holes formed in a horizontal direction in each of two side portions exposed by the opening region, and adsorbing an inhibitor to surfaces of the substrate structure so that an adsorption density of the inhibitor outside of the plurality of holes is higher than an adsorption density inside of the plurality of holes by adsorbing the inhibitor in a deposition environment in which a gas diffusivity is larger in the vertical direction than in the horizontal direction. A deposition process of a material film on the inside and outside of the plurality of holes is then performed, wherein a deposition rate of the material film may vary according to the adsorption density of the inhibitor.

Abstract: A thin film deposition method and a method of fabricating an electronic device using the same are disclosed. The thin film deposition method may include preparing a substrate structure having a pattern portion including a hole, adsorbing a reaction inhibitor to inside and outside of the hole in the substrate structure, wherein an adsorption density of the reaction inhibitor may be lower in the inside than the outside, and depositing a metal layer on the inside and outside the hole by an atomic layer deposition (ALD) process, wherein a deposition rate of the depositing may vary depending on regions by the reaction inhibitor, and wherein the reaction inhibitor may include a metal atom and a ligand for reaction inhibition bonded to the metal atom, and the metal atom may remain on the substrate structure in the depositing the metal layer.

Abstract: A method and an apparatus for filling a gap by using an atomic layer deposition (ALD) method are provided. The method includes forming a first reaction inhibition layer on a side wall of the gap; forming a first precursor layer by adsorbing a first reactant into a bottom of the gap and the side wall of the gap around the bottom of the gap; and forming a first atomic layer on the bottom of the gap and the side wall of the gap around the bottom of the gap by adsorbing a second reactant into the first precursor layer. The forming of the first reaction inhibition layer may include adsorbing a first reaction inhibitor into the side wall of the gap; and forming a second reaction inhibitor by removing a specific ligand from the first reaction inhibitor.

Abstract: Provided are method for healing defect of conductive layer, method for forming metal-carbon compound layer, 2D nano materials, and transparent electrode and method for manufacturing the same. According to an embodiment of present invention, the method for healing defect of conductive layer comprises: forming a conductive layer on a first metal substrate; contacting the first metal substrate with a salt solution containing a second metal in an ionic form, and forming a second metal particle at least in a portion of a conductive area, the second metal having greater reduction potential than a first metal.

Abstract: The present disclosure relates to a superhydrophobic coating material and a method for manufacturing the superhydrophobic coating material. The superhydrophobic coating material according to the present disclosure includes a substrate provided with a three-dimensional nano structure; and a coating layer comprising a rare earth metal oxide formed on the three-dimensional nano structure. The method for manufacturing the superhydrophobic coating material according to the present disclosure includes preparing a substrate provided with a three-dimensional nano structure; and forming a coating layer comprising a rare earth metal oxide on the three-dimensional nano structure by supplying a precursor including a rare earth metal and an oxidant one by one onto the substrate, and the temperature of the substrate is controlled in the forming step so that an atomic ratio of a carbon element in the coating layer is less than 1% to form the coating layer with superhydrophobic property.

Abstract: Provided are method for healing defect of conductive layer, method for forming metal-carbon compound layer, 2D nano materials, and transparent electrode and method for manufacturing the same. According to an embodiment of present invention, the method for healing defect of conductive layer comprises: forming a conductive layer on a first metal substrate; contacting the first metal substrate with a salt solution containing a second metal in an ionic form, and forming a second metal particle at least in a portion of a conductive area, the second metal having greater reduction potential than a first metal.

Abstract: The present invention relates to a semiconductor device and a method for manufacturing the same. Disclosed is a semiconductor device including a substrate, a conductive line on the substrate, and a seed layer between the substrate and the conductive line, the seed layer including cobalt titanium nitride.

Abstract: The present invention relates to a semiconductor device and a method for manufacturing the same. Disclosed is a semiconductor device including a substrate, a conductive line on the substrate, and a seed layer between the substrate and the conductive line, the seed layer including cobalt titanium nitride.

Abstract: The present disclosure relates to a method for forming a coating layer and a coating material having waterproof property, and the method for forming a coating layer according to the present disclosure includes (a) supplying a precursor comprising a rare earth metal onto a substrate; (b) purging impurities of remaining precursor after combination of the rare earth metal onto the substrate; (c) supplying an oxidant onto the substrate; and (d) purging remaining impurities after forming a coating layer including a rare earth oxide on the substrate. According to the method for forming a coating layer of the present disclosure, a coating layer with hydrophobic or superhydrophobic property may be formed by controlling a temperature of the substrate so that an atomic ratio of a carbon element in the coating layer is less than 1% to form the coating layer with hydrophobic or superhydrophobic property.

Abstract: The present disclosure relates to a superhydrophobic coating material and a method for manufacturing the superhydrophobic coating material. The superhydrophobic coating material according to the present disclosure includes a substrate provided with a three-dimensional nano structure; and a coating layer comprising a rare earth metal oxide formed on the three-dimensional nano structure. The method for manufacturing the superhydrophobic coating material according to the present disclosure includes preparing a substrate provided with a three-dimensional nano structure; and forming a coating layer comprising a rare earth metal oxide on the three-dimensional nano structure by supplying a precursor including a rare earth metal and an oxidant one by one onto the substrate, and the temperature of the substrate is controlled in the forming step so that an atomic ratio of a carbon element in the coating layer is less than 1% to form the coating layer with superhydrophobic property.