Patents by Inventor Han-Chen CHEN

Han-Chen CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11488870
    Abstract: A method for fabricating semiconductor device includes the steps of: providing a substrate having a first region, a second region, and a third region; forming a first gate structure on the first region, a second gate structure on the second region, and a third gate structure on the third region; forming an interlayer dielectric (ILD) layer around the first gate structure, the second gate structure, and the third gate structure; removing the first gate structure, the second gate structure, and the third gate structure to form a first recess, a second recess, and a third recess; forming a first interfacial layer in the first recess, the second recess, and the third recess; removing the first interfacial layer in the second recess; and forming a second interfacial layer in the second recess.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: November 1, 2022
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Tien-Yu Hsieh, Kuan-Ti Wang, Han-Chen Chen, Kun-Hsien Lee
  • Publication number: 20210287942
    Abstract: A method for fabricating semiconductor device includes the steps of: providing a substrate having a first region, a second region, and a third region; forming a first gate structure on the first region, a second gate structure on the second region, and a third gate structure on the third region; forming an interlayer dielectric (ILD) layer around the first gate structure, the second gate structure, and the third gate structure; removing the first gate structure, the second gate structure, and the third gate structure to form a first recess, a second recess, and a third recess; forming a first interfacial layer in the first recess, the second recess, and the third recess; removing the first interfacial layer in the second recess; and forming a second interfacial layer in the second recess.
    Type: Application
    Filed: April 8, 2020
    Publication date: September 16, 2021
    Inventors: Tien-Yu Hsieh, Kuan-Ti Wang, Han-Chen Chen, Kun-Hsien Lee
  • Publication number: 20210013517
    Abstract: A battery is provided. A first conducting pole is disposed on a first outer layer and extends partially on a first sealing layer, and a first electrode is disposed on the first conducting pole and separate from the first sealing layer. A second conducting pole is disposed on a second outer layer and extends partially on the second sealing layer, and a second electrode is disposed on the second conducting pole and separate from the second sealing layer. An isolation membrane is attached to the first and second electrodes. One of two binding layers bound together is interposed between the first conducting pole and a part of the first outer layer protrusive beyond the second outer layer, the other of the two binding layers being interposed between the second conducting pole and a part of the first outer layer protrusive beyond the second outer layer.
    Type: Application
    Filed: July 7, 2020
    Publication date: January 14, 2021
    Inventors: Lun-Chieh HO, Yi-Ting GAU, Han-Chen CHEN
  • Publication number: 20120264000
    Abstract: A hybrid battery module of the present invention includes a lithium iron battery pack and a lithium manganese battery pack. The lithium iron battery pack includes at least one lithium iron battery which is electrically connected in series, and the lithium iron battery has an anode and a cathode. The lithium manganese battery pack includes at least one lithium manganese battery which is electrically connected in series, and the lithium manganese battery has an anode and a cathode. The lithium iron battery pack and the lithium manganese battery pack are electrically connected in parallel to each other. Thereby, the hybrid battery module has high discharge efficiency, high electric capacity, a small volume and a light weight. Furthermore, the production cost of the present invention is lower than a complete lithium iron battery pack, and the hybrid battery module is much safer to be used than a complete lithium manganese battery pack.
    Type: Application
    Filed: April 15, 2011
    Publication date: October 18, 2012
    Inventors: Han-Chen CHEN, Lun-Chieh HO, Fang-Hui CHAO
  • Publication number: 20120088142
    Abstract: A connecting assembly of the present invention is used for connecting a first battery to a second battery. The connecting assembly includes a base plate, two side plates and two fixation plates. The base plate is provided for being placed on a top surface of the first battery. The side plates extend from the base plate and extend away from the first battery. The fixation plates extend lateral from the side plates. A predetermined distance is defined between the fixation plates and the base plate. The fixation plates are provided for the second battery to be connected therewith. As such, the second battery can be firmly assembled on the first battery by the connecting assembly. Batteries can be gathered up so as to be easily assembled.
    Type: Application
    Filed: October 12, 2010
    Publication date: April 12, 2012
    Inventors: Yihsong JAN, Fang-Hui CHAO, Han-Chen CHEN, Hsi-Hsing CHEN, Hsiu-Kuan LIN, Fang-Shu KO