Patents by Inventor Han-Chen Lee

Han-Chen Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240148999
    Abstract: A patient interface including a plenum chamber, a first seal-forming structure for forming a seal around the patient's mouth, and a second seal-forming structure for forming a seal around the patient's nares. The patient interface further includes at least one stopper rib disposed in the cavity of the plenum chamber spaced apart from the first seal-forming structure in a rest position. The first seal-forming structure configured to contact the at least one stopper rib in an operational position. The at least one stopper rib configured to oppose compression of the first seal-forming structure in an anterior direction. The second seal-forming structure is not configured to contact the at least one stopper rib.
    Type: Application
    Filed: March 9, 2022
    Publication date: May 9, 2024
    Inventors: Marvin Sugi HARTONO, Kyi Thu MAUNG, Lik Tze SEET, Jing CHEN, Beng Hai TAN, Han Cheng LIN, Chuan Foong LEE, Xiang Yu ONG, Shiva Kumar SHANMUGA SUNDARA, Hugh Francis Stewart THOMAS, Sebastien DEUBEL, Chee Keong ONG, Andrew James BATE, Matthew Robin WELLS, Paul Derrick WATSON, Shannon William PRIOR
  • Publication number: 20240150699
    Abstract: An electroporation system including one or more of a pipette, a pipette tip, a pipette docking assembly, and a pulse generator. The pipette docking assembly includes a pipette station, a pipette station guard, and a reservoir (e.g., a buffer tube). A method for transfecting a cell with a payload including providing an electroporation system, providing the cell, providing the payload, introducing the cell and the payload into a pipette tip, and electroporating the cell within the pipette tip by operating the electroporation system.
    Type: Application
    Filed: September 15, 2023
    Publication date: May 9, 2024
    Inventors: Han WEI, Chee Wai CHAN, Wui Khen LIAW, Shan Hua DONG, See Chen GOH, Huei Steven YEO, Harmon Cosme SICAT, JR., Mio Xiu Lu LING, Josh M. MEAD, Mikko MAKINEN, Beng Heng LIM, Kuan Moon BOO, Justina Linkai BONG, Chye Sin NG, Wee Liam LIM, Li Yang LIM, Way Xuang LEE
  • Publication number: 20240088042
    Abstract: A semiconductor structure includes a dielectric layer over a substrate, a via conductor over the substrate and in the dielectric layer, and a first graphene layer disposed over the via conductor. In some embodiments, a top surface of the via conductor and a top surface of the dielectric layer are level. In some embodiments, the first graphene layer overlaps the via conductor from a top view. In some embodiments, the semiconductor structure further includes a second graphene layer under the via conductor and a third graphene layer between the dielectric layer and the via conductor. In some embodiments, the second graphene layer is between the substrate and the via conductor.
    Type: Application
    Filed: January 11, 2023
    Publication date: March 14, 2024
    Inventors: SHU-WEI LI, HAN-TANG HUNG, YU-CHEN CHAN, CHIEN-HSIN HO, SHIN-YI YANG, MING-HAN LEE, SHAU-LIN SHUE
  • Publication number: 20240079784
    Abstract: An electronic device may be provided with an antenna having a resonating element and a light source module mounted to a flexible printed circuit and a metal cowling. The module may emit light through a rear housing wall. The printed circuit may be interposed between the metal cowling and a conductive support plate in the rear housing wall. The printed circuit may include a ground trace coupled to the resonating element. A dimpled pad may couple the ground trace to the support plate. Compressive foam may be used to exert a force against the flexible printed circuit that presses the dimpled pad against the conductive support plate. The ground trace and the dimpled pad may form a return path to ground for the resonating element. The dimpled pad may occupy less height within the device than other structures such as metal springs.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 7, 2024
    Inventors: Han Wang, Victor C. Lee, Jingni Zhong, Ming Chen, Bhaskara R. Rupakula, Yiren Wang, Yuan Tao, Christopher Q. Ma, Zhiheng Zhou, Sherry Cao, Kevin M. Froese, Hao Xu, Hongfei Hu, Mattia Pascolini
  • Publication number: 20240071822
    Abstract: A method for manufacturing a semiconductor structure includes forming a first interconnect feature in a first dielectric feature, the first interconnect feature including a first conductive element exposed from the first dielectric feature; forming a first cap feature over the first conductive element, the first cap feature including a first cap element which includes a two-dimensional material; forming a second dielectric feature with a first opening that exposes the first cap element; forming a barrier layer over the second dielectric feature while exposing the first cap element from the barrier layer; removing a portion of the first cap element exposed from the barrier layer; and forming a second conductive element in the first opening.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chin-Lung CHUNG, Shin-Yi YANG, Yu-Chen CHAN, Han-Tang HUNG, Shu-Wei LI, Ming-Han LEE
  • Patent number: 5534260
    Abstract: A percutaneous drug delivery method and enhancement composition are disclosed. The method comprises applying an enzyme preparation containing suitable amounts of non-enzyme permeation enhancers, such as lactam compounds (e.g. 1-substituted-azacycloheptan-2-one), and propylene glycol to a localized area of skin for a predetermined amount of time to enhance that area of skin's permeability to selected drug(s); occluding the area of skin during the application; and then applying the selected drug(s) to the area of skin to allow the drug to penetrate through the skin and into the circulatory system of the animal. Greatly enhanced penetration of chemicals through the skin results from the described treatment.
    Type: Grant
    Filed: March 21, 1994
    Date of Patent: July 9, 1996
    Assignee: University of Utah
    Inventors: Robert V. Petersen, Tsung-Min Hsu, Han-Chen Lee, Don Christy
  • Patent number: 5296222
    Abstract: A percutaneous drug delivery method and enhancement composition are disclosed. The method comprises applying an enzyme preparation containing suitable amounts of non-enzyme permeation enhancers, such as lactam compounds (e.g. 1-substituted-azacycloheptan-2-one), and propylene glycol to a localized area of skin for a predetermined amount of time to enhance that area of skin's permeability to selected drug(s); occluding the area of skin during the application; and then applying the selected drug(s) to the area of skin to allow the drug to penetrate through the skin and into the circulatory system of the animal. Greatly enhanced penetration of chemicals through the skin results from the described treatment.
    Type: Grant
    Filed: March 24, 1992
    Date of Patent: March 22, 1994
    Assignee: University of Utah
    Inventors: Robert V. Petersen, Tsung-Min Hsu, Han-Chen Lee, Don Christy