Abstract: An embodiment of an integrated circuit chip includes a combination processing core and magnetoresistive random access memory (MRAM) circuitry integrated into the chip. The MRAM circuitry includes a plurality of MRAM cells. The MRAM cells are organized into a number of memories, including a cache memory, a main or working memory and an optional secondary storage memory. The cache memory includes multiple cache levels.

Abstract: A chip package device includes a substrate having a chip bonding area and at least one contact pad, a chip having an active surface and an inactive surface, at least one wire, an adhesive layer, a heat dissipation element, and an encapsulation. The chip is disposed on the chip bonding area with its inactive surface facing the substrate. The chip includes at least one bonding pad disposed on the active surface. The wire correspondingly connects the at least one bonding pad and the at least one contact pad. The adhesive layer covers the active surface of the chip and encloses a portion of the wire extending over the bonding pad. The heat dissipation element is attached to the adhesive layer and covers the chip. The encapsulation partially encloses the periphery of the assembly including the chip, the adhesive and the heat dissipation element, and has an indented opening to expose the surface of the heat dissipation element.

Abstract: A chip package device includes a substrate having a chip bonding area and at least one contact pad, a chip having an active surface and an inactive surface, at least one wire, an adhesive layer, a heat dissipation element, and an encapsulation. The chip is disposed on the chip bonding area with its inactive surface facing the substrate. The chip includes at least one bonding pad disposed on the active surface. The wire correspondingly connects the at least one bonding pad and the at least one contact pad. The adhesive layer covers the active surface of the chip and encloses a portion of the wire extending over the bonding pad. The heat dissipation element is attached to the adhesive layer and covers the chip. The encapsulation partially encloses the periphery of the assembly including the chip, the adhesive and the heat dissipation element, and has an indented opening to expose the surface of the heat dissipation element.

Abstract: A filter mainly includes a coil connecting frame, a plurality of coils received in the frame, and a first circuit board. The frame comprises a first surface with a plurality of first pins and a second surface, opposite to the first surface, with a plurality of second pins. The first pins are connected to the first circuit board, and the second pins are connected to an external electronic device while both the first and second pins are connected to the coils. The coil connecting frame further includes an electrical connecting portion between the first surface and the second surface with a plurality of conducting pins which penetrate through the first and second surfaces to connect to the circuit board and the second pins or external electronic device.

Abstract: A signal exchange system includes a circuit board, a transforming connector and a network port. The transforming connector is electrically connected to the circuit board and includes at least one connecting terminal. The connecting terminal is electrically connected to an external device. The network port is disposed on the circuit board and electrically connected to the transforming connector for receiving a power signal transmitted from the transforming connector and transmitting a data signal.

Abstract: A HomePlug apparatus is electrically connected to a power network and includes a HomePlug processing circuit and a surge protecting circuit. The HomePlug processing circuit is electrically connected to the surge protecting circuit. The surge protecting circuit has at least one inductor, at least one capacitor and at least one arrester. The inductor is electrically connected to the power network. The arrester is electrically connected to a ground. The inductor, the capacitor and the arrester are connected in series to guide a surge originated from the power network to the ground.

Abstract: A solar power converting package includes a power storage unit, a power detecting unit coupled to the power storage unit, a power converting unit coupled to the power detecting unit, and a molding body enclosing the power storage unit, the power detecting unit and the power converting unit.

Abstract: A transformer includes a first bobbin, a second bobbin, and an iron core set, wherein the first bobbin and the second bobbin further include a winding region and a through hole in the center of the bobbin, respectively. The winding region is wound by a winding. The iron core set is coupled to the first and second bobbins. The first and second bobbins are assembled together by a base.

Abstract: A connecting module includes at least a connector, a circuit board, a network element and a housing. The connector is electrically connected to a first side of the circuit board. The network element is electrically connected to a second side of the circuit board. The connector and the network element are accommodated in the housing.

Abstract: A connecting module includes a single housing including a front end, a first receiving hole and at least one second receiving hole. The first receiving hole is formed on the front end. The profile of the first receiving hole is used to receive a first external connecting plug. The second receiving hole is formed on the front end. The profile of the second receiving hole differs from that of the first receiving hole and is used to receive a second external connecting plug. The first and second receiving holes are arranged in a horizontal array.

Abstract: A connection module for connecting an external plug includes a body, a plurality of internal terminals and a holding device. The holding device is disposed in the body and includes a plate, a first support and a second support. When the external plug is fitted in the connection module, the external plug can be securely fixed in the corresponding connection module.

Abstract: A filter includes a first housing having a first signal input terminal and a first signal output terminal, and a second housing having a second signal input terminal and a second signal output terminal. The second housing is stacked on and against the first housing.

Abstract: A HomePlug apparatus is electrically connected to a power network and includes a HomePlug processing circuit and a surge protecting circuit. The HomePlug processing circuit is electrically connected to the surge protecting circuit. The surge protecting circuit has at least one inductor, at least one capacitor and at least one arrester. The inductor is electrically connected to the power network. The arrester is electrically connected to a ground. The inductor, the capacitor and the arrester are connected in series to guide a surge originated from the power network to the ground.

Abstract: A signal exchange system includes a circuit board, a transforming connector and a network port. The transforming connector is electrically connected to the circuit board and includes at least one connecting terminal. The connecting terminal is electrically connected to an external device. The network port is disposed on the circuit board and electrically connected to the transforming connector for receiving a power signal transmitted from the transforming connector and transmitting a data signal.

Abstract: A power line communication (PLC) device, which is electrically connected with a power line, a power transforming device and an electronic device, includes a transmission element, a power transmitting element and a data transmission element. The transmission element is electrically connected with the power line for receiving a power source and communicating a data through the power line. The power transmitting element, which is electrically connected with the transmission element and the power transforming device, transmits the power source to the power transforming device, so that the power transforming device generates a work power to the electronic device. The data transmission element is electrically connected with the transmission element and the electronic device for transmitting the data to the electronic device.

Abstract: An inductor is made of a flat conducting wire with a constant thickness. The inductor includes a coiled portion and two leg portions. The leg portions are end parts of the flat conducting wire that are processed with a specific process. In addition, each leg portion has a thickness smaller than that of the coiled portion.

Abstract: A packaged electronic component includes a body and a thermally conductive clip. The body is made of a molding material and accommodates at least one magnetic element therein. The thermally conductive clip securely mounts on the circumference of body, and covers a top surface and a side surface of the body. The packaged electronic component is a surface mounted device (SMD).

Abstract: A packaged electronic component includes a body, a plurality of magnetic elements and a silicon material, wherein the magnetic elements are disposed in the body, and the silicon material covers the surfaces of the magnetic elements. At least one side of the body has a hole to dissipate heat, and provides additional space to contain expanded silicon material after heating.

Abstract: A packaged electronic component capable of shielding electromagnetic interference (EMI) includes a case, at least one magnetic component, a circuit board, and an anti-noise clip. The magnetic component is electrically connected to the circuit board and is covered by the case. Further, the anti-noise clip is mounted on and is clipped to the exterior of the case and is electrically connected with the circuit board to form a grounded loop.

Abstract: A filter mainly includes a coil connecting frame, a plurality of coils received in the frame, and a first circuit board. The frame comprises a first surface with a plurality of first pins and a second surface, opposite to the first surface, with a plurality of second pins. The first pins are connected to the first circuit board, and the second pins are connected to an external electronic device while both the first and second pins are connected to the coils. The coil connecting frame further includes an electrical connecting portion between the first surface and the second surface with a plurality of conducting pins which penetrate through the first and second surfaces to connect to the circuit board and the second pins or external electronic device.