Patents by Inventor Han-Chieh Chang
Han-Chieh Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11964881Abstract: A method for making iridium oxide nanoparticles includes dissolving an iridium salt to obtain a salt-containing solution, mixing a complexing agent with the salt-containing solution to obtain a blend solution, and adding an oxidating agent to the blend solution to obtain a product mixture. A molar ratio of a complexing compound of the complexing agent to the iridium salt is controlled in a predetermined range so as to permit the product mixture to include iridium oxide nanoparticles.Type: GrantFiled: July 27, 2020Date of Patent: April 23, 2024Assignee: NATIONAL YANG MING CHIAO TUNG UNIVERSITYInventors: Pu-Wei Wu, Yi-Chieh Hsieh, Han-Yi Wang, Kuang-Chih Tso, Tzu-Ying Chan, Chung-Kai Chang, Chi-Shih Chen, Yu-Ting Cheng
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Patent number: 11940848Abstract: An electronic device display may have pixels formed from crystalline semiconductor light-emitting diode dies, organic light-emitting diodes, or other pixel structures. The pixels may be formed on a display panel substrate. A display panel may extend continuously across the display or multiple display panels may be tiled in two dimensions to cover a larger display area. Interconnect substrates may have outwardly facing contacts that are electrically shorted to corresponding inwardly facing contacts such as inwardly facing metal pillars associated with the display panels. The interconnect substrates may be supported by glass layers. Integrated circuits may be embedded in the display panels and/or in the interconnect substrates. A display may have an active area with pixels that includes non-spline pixels in a non-spline display portion located above a straight edge of the display and spline pixel in a spline display portion located above a curved edge of the display.Type: GrantFiled: August 2, 2021Date of Patent: March 26, 2024Assignee: Apple Inc.Inventors: Elmar Gehlen, Zhen Zhang, Francois R. Jacob, Paul S. Drzaic, Han-Chieh Chang, Abbas Jamshidi Roudbari, Anshi Liang, Hopil Bae, Mahdi Farrokh Baroughi, Marc J. DeVincentis, Paolo Sacchetto, Tiffany T. Moy, Warren S. Rieutort-Louis, Yong Sun, Jonathan P. Mar, Zuoqian Wang, Ian D. Tracy, Sunggu Kang, Jaein Choi, Steven E. Molesa, Sandeep Chalasani, Jui-Chih Liao, Xin Zhao, Izhar Z. Ahmed
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Publication number: 20230409082Abstract: An electronic device may have a display overlapped by a display cover layer. Portions of the surface of the display and cover layer may have curved profiles. For example, a display cover layer may have transparent sidewall portions with curved surface profiles. The transparent sidewall portions of the display cover layer may include rounded corners having areas of compound curvature. A flexible display panel may be pressed over a mold to impart desired curvature (such as compound curvature) to the flexible display panel. To mitigate wrinkling in a flexible display panel molded to have compound curvature, a film may be included that absorbs force in the display panel. The film may have a coefficient of thermal expansion that is different than that of the display panel. Instead or in addition, the film may have portions with different Young's modulus magnitudes or different thickness magnitudes.Type: ApplicationFiled: March 15, 2023Publication date: December 21, 2023Inventors: Bulong Wu, Zhen Zhang, Paul S. Drzaic, Yong Sun, Izhar Z. Ahmed, Kuan H. Lu, Han-Chieh Chang, Mingjing Ha, Yung-Yu Hsu
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Publication number: 20230352497Abstract: A display may have one or more bent portions. To increase the magnitude of curvature in a display and/or to allow for compound curvature in the display, a display panel may be partially formed in a planar state. The partial display panel is then bent to have desired curvature. After the partial display panel is bent, additional display components that are susceptible to damage during the bending process may be added to complete the display panel. A flexible printed circuit may be formed directly on the display panel using precise deposition of conductive material. By forming the flexible printed circuit layer-by-layer directly on the display panel, no substantive pressure needs to be applied to the display panel. Electrical connections may therefore be made to the display panel in regions of the display with high levels of curvature and/or with compound curvature without causing front-of-screen artifacts for the display panel.Type: ApplicationFiled: March 1, 2023Publication date: November 2, 2023Inventors: Meng-Tse Chen, Anshi Liang, Arnoldus A Barlian, Bayu A Thedjoisworo, Boris A Russ, Chun-Hsien Lee, Chun-Lan Wu, Han-Chieh Chang, Jiming Yu, Marc J DeVincentis, Nathan K Gupta, Paolo Sacchetto, Paul S Drzaic, Zhen Zhang, Ziyang Zhang
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Publication number: 20230343914Abstract: Conductive traces may be conformally wrapped around the side of a display panel that includes an array of display pixels. The conductive traces may electrically connect contacts on an upper surface of the display panel to corresponding contacts on a flexible printed circuit that is attached to a lower surface of the display panel. The side-wrapped conductive traces may be interposed between first and second insulating layers. The flexible printed circuit may have a multi-step interface that is electrically connected to the side-wrapped conductive traces. A system-in-package including a display driver integrated circuit may be mounted to the flexible printed circuit. The system-in-package may include a plurality of redistribution layers that electrically connect contacts on the display driver integrated circuit to contacts on the flexible printed circuit.Type: ApplicationFiled: March 16, 2023Publication date: October 26, 2023Inventors: Han-Chieh Chang, Anshi Liang, Arnoldus A Barlian, Bayu A Thedjoisworo, Boris A Russ, Chun-Lan Wu, Ken Hsuan Liao, Marc J DeVincentis, Meng-Tse Chen, Nathan K Gupta, Paolo Sacchetto, Paul S Drzaic, Po-Jui Chen, Ying-Chih Wang, Yong Sun, Zhen Zhang, Ziyang Zhang
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Patent number: 11599145Abstract: An electronic device display may have pixels formed from crystalline semiconductor light-emitting diode dies, organic light-emitting diodes, or other pixel structures. The pixels may be formed in a display panel having a single substrate or an array of display panel tiles. The display panel has inwardly facing display panel contacts that mate with corresponding outwardly facing interconnect substrate contacts on an interconnect substrate. The interconnect substrate may have areas with compound curvature that are overlapped by the display panel. To enhance flexibility of the interconnect substrate, the interconnect substrate may have flexibility enhancement openings and/or may be formed from a material with a low elastic modulus such as silicone or other elastomeric material.Type: GrantFiled: February 18, 2021Date of Patent: March 7, 2023Assignee: Apple Inc.Inventors: Mingjing Ha, Kuan H. Lu, Paul S. Drzaic, Yung-Yu Hsu, Yong Sun, Zhen Zhang, Bulong Wu, Marc J. DeVincentis, Paolo Sacchetto, Han-Chieh Chang, Anshi Liang
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Patent number: 11442503Abstract: An electronic device such as a wearable electronic device may have a band. The band may form a stand-alone device or a strap for a wristwatch unit or other device. Electrical components may be mounted on flexible printed circuit substrates. A substrate may be encapsulated by elastomeric polymer material or other material forming the band. The elastomeric polymer material may form cavities that receive the electrical components. Components such as light-emitting diodes may be mounted to the flexible printed circuit substrates so that the light-emitting diodes are located in the cavities. Reflective sidewalls in the cavities may reflect light from the light-emitting diodes outwardly through a thinned portion of the band. Light-diffusing material in the cavities may be formed from clear polymer with light-scattering particles.Type: GrantFiled: May 17, 2018Date of Patent: September 13, 2022Assignee: Apple Inc.Inventors: Yung-Yu Hsu, Shubham A. Gandhi, Mingjing Ha, Paul S. Drzaic, Chang-Chia Huang, Han-Chieh Chang, Bryce T. Bradford, David W. Lum, Bhaskar Banerjee, Adam Adjiwibawa, David A. Doyle, Hong Luo, Michael J. Brown
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Publication number: 20220097203Abstract: A calibration system, a calibration method, and a calibration device configured to determine base information of a polish head to polish a workpiece through the polish head are provided. The base information comprises a first position. The calibration system includes the polish head, a controller, and a sensor group. The controller is coupled to the polish head and controls the polish head to move along a first direction. The sensor group detects a force that at least one of the polish head and the workpiece senses to generate a first pressure value. The controller determines whether the first pressure value is greater than a predetermined value. According to that the first pressure value is greater than the predetermined value, the first position is determined.Type: ApplicationFiled: September 24, 2021Publication date: March 31, 2022Inventors: YUAN-KUN YANG, HAN-CHIEH CHANG, CHUN-MING ZHONG, HAI-JUN LI
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Publication number: 20220097204Abstract: A polishing system for polishing a workpiece includes a sensor group detecting pressure information of the workpiece and generating a pressure sequence; a processor coupled to the sensor group and configured to: receive the pressure sequence; generate indication information including a predetermined track of a polishing head to polish the workpiece; based on the pressure sequence and the indication information, generate a deviation sequence of the pressure sequence; and based on the deviation sequence, generate an adjustment instruction, to adjust a position of the polishing head. A polishing method, an assistant polishing device, an assistant polishing system, and an assistant polishing method are also disclosed.Type: ApplicationFiled: September 24, 2021Publication date: March 31, 2022Inventors: YUAN-KUN YANG, XIAO-MING XU, HAN-CHIEH CHANG, BO LONG, HAI-JUN LI, CHUN-MING ZHONG
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Publication number: 20220050506Abstract: An electronic device display may have pixels formed from crystalline semiconductor light-emitting diode dies, organic light-emitting diodes, or other pixel structures. The pixels may be formed on a display panel substrate. A display panel may extend continuously across the display or multiple display panels may be tiled in two dimensions to cover a larger display area. Interconnect substrates may have outwardly facing contacts that are electrically shorted to corresponding inwardly facing contacts such as inwardly facing metal pillars associated with the display panels. The interconnect substrates may be supported by glass layers. Integrated circuits may be embedded in the display panels and/or in the interconnect substrates. A display may have an active area with pixels that includes non-spline pixels in a non-spline display portion located above a straight edge of the display and spline pixel in a spline display portion located above a curved edge of the display.Type: ApplicationFiled: August 2, 2021Publication date: February 17, 2022Inventors: Elmar Gehlen, Zhen Zhang, Francois R. Jacob, Paul S. Drzaic, Han-Chieh Chang, Abbas Jamshidi Roudbari, Anshi Liang, Hopil Bae, Mahdi Farrokh Baroughi, Marc J. DeVincentis, Paolo Sacchetto, Tiffany T. Moy, Warren S. Rieutort-Louis, Yong Sun, Jonathan P. Mar, Zuoqian Wang, Ian D. Tracy, Sunggu Kang, Jaein Choi, Steven E. Molesa, Sandeep Chalasani, Jui-Chih Liao, Xin Zhao, Izhar Z. Ahmed
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Publication number: 20210318715Abstract: An electronic device display may have pixels formed from crystalline semiconductor light-emitting diode dies, organic light-emitting diodes, or other pixel structures. The pixels may be formed in a display panel having a single substrate or an array of display panel tiles. The display panel has inwardly facing display panel contacts that mate with corresponding outwardly facing interconnect substrate contacts on an interconnect substrate. The interconnect substrate may have areas with compound curvature that are overlapped by the display panel. To enhance flexibility of the interconnect substrate, the interconnect substrate may have flexibility enhancement openings and/or may be formed from a material with a low elastic modulus such as silicone or other elastomeric material.Type: ApplicationFiled: February 18, 2021Publication date: October 14, 2021Inventors: Mingjing Ha, Kuan H. Lu, Paul S. Drzaic, Yung-Yu Hsu, Yong Sun, Zhen Zhang, Bulong Wu, Marc J. DeVincentis, Paolo Sacchetto, Han-Chieh Chang, Anshi Liang
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Publication number: 20200192423Abstract: An electronic device such as a wearable electronic device may have a band. The band may form a stand-alone device or a strap for a wristwatch unit or other device. Electrical components may be mounted on flexible printed circuit substrates. A substrate may be encapsulated by elastomeric polymer material or other material forming the band. The elastomeric polymer material may form cavities that receive the electrical components. Components such as light-emitting diodes may be mounted to the flexible printed circuit substrates so that the light-emitting diodes are located in the cavities. Reflective sidewalls in the cavities may reflect light from the light-emitting diodes outwardly through a thinned portion of the band. Light-diffusing material in the cavities may be formed from clear polymer with light-scattering particles.Type: ApplicationFiled: May 17, 2018Publication date: June 18, 2020Inventors: Yung-Yu Hsu, Shubham A. Gandhi, Mingjing Ha, Paul S. Drzaic, Chang-Chia Huang, Han-Chieh Chang, Bryce T. Bradford, David W. Lum, Bhaskar Banerjee, Adam Adjiwibawa, David A. Doyle, Hong Luo, Michael J. Brown
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Patent number: 10617011Abstract: Methods, and devices produced by the methods, for electroplating a multitude of micro-scale electrodes that are electrically isolated from each other on a cable or other device is described. A localized area of connections on another end of the cable is shorted together by depositing a metal sheet or other conductive material over the localized area. The metal sheet is connected to a terminal of a power supply, and the electrode end of the cable is immersed in an electrolyte solution for electrodeposition by electroplating. After the electrodes are electroplated, the metal sheet is removed from the cable in order to re-isolate the electrodes.Type: GrantFiled: December 18, 2015Date of Patent: April 7, 2020Assignee: CALIFORNIA INSTITUTE OF TECHNOLOGYInventors: Yu-Chong Tai, Han-Chieh Chang, Xiaoxiao Zhang
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Publication number: 20180366394Abstract: The invention provides chip packaging and processes for the assembly of retinal prosthesis devices. Advantageously, photo-patternable adhesive or epoxy such as photoresist is used as glue to attach a chip to the targeted thin-film (e.g., parylene) substrate so that the chip is used as an attachment to prevent delamination.Type: ApplicationFiled: June 14, 2018Publication date: December 20, 2018Applicant: California Institute of TechnologyInventors: Yu-Chong Tai, Han-Chieh Chang
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Patent number: 10008443Abstract: The invention provides chip packaging and processes for the assembly of retinal prosthesis devices. Advantageously, photo-patternable adhesive or epoxy such as photoresist is used as glue to attach a chip to the targeted thin-film (e.g., parylene) substrate so that the chip is used as an attachment to prevent delamination.Type: GrantFiled: August 28, 2015Date of Patent: June 26, 2018Assignee: California Institute of TechnologyInventors: Yu-Chong Tai, Han-Chieh Chang
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Patent number: 9980388Abstract: A biocompatible, micro-fabricated ribbon cable is described in which at least one set of conductors diverges laterally into a bypass wing that forms an aperture through the ribbon cable. The bypass wing is folded in a line through the aperture and over a central portion of the ribbon cable, resulting in a ribbon cable with a narrow, stacked region. The narrow region can fit through small incisions in membranes, such as through an incision in a sclera of an eyeball. The ribbon cable can have an integrally-formed electrode array for attaching to a retina of an eyeball and other electronics for sending signals to the electrode array.Type: GrantFiled: December 18, 2015Date of Patent: May 22, 2018Assignee: California Institute of TechnologyInventors: Yu-Chong Tai, Han-Chieh Chang
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Patent number: 9781842Abstract: The present invention provides a micropackaged device comprising: a substrate for securing a device; a corrosion barrier affixed to said substrate; optionally at least one feedthrough disposed in said substrate to permit at least one input and or at least one output line into said micropackaged device; and an encapsulation material layer configured to encapsulate the micropackaged device.Type: GrantFiled: December 27, 2013Date of Patent: October 3, 2017Assignee: California Institute of TechnologyInventors: Yu-Chong Tai, Han-Chieh Chang
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Patent number: 9773715Abstract: The present invention provides a micropackaged device comprising: a substrate for securing a device with a corrosion barrier affixed to the substrate, wherein the corrosion barrier comprises a first thin-film layer, a metal film coating the thin-film layer and a second thin-film layer to provide a sandwich layer; and optionally at least one feedthrough disposed in the substrate to permit at least one input and or at least one output line into the micropackaged device, wherein the micropackaged device is encapsulated by the corrosion barrier. Methods of producing the micropackaged device are also disclosed.Type: GrantFiled: December 28, 2015Date of Patent: September 26, 2017Assignee: California Institute of TechnologyInventors: Yu-Chong Tai, Han-Chieh Chang
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Publication number: 20160133540Abstract: The present invention provides a micropackaged device comprising: a substrate for securing a device with a corrosion barrier affixed to the substrate, wherein the corrosion barrier comprises a first thin-film layer, a metal film coating the thin-film layer and a second thin-film layer to provide a sandwich layer; and optionally at least one feedthrough disposed in the substrate to permit at least one input and or at least one output line into the micropackaged device, wherein the micropackaged device is encapsulated by the corrosion barrier. Methods of producing the micropackaged device are also disclosed.Type: ApplicationFiled: December 28, 2015Publication date: May 12, 2016Applicant: California Institute of TechnologyInventors: Yu-Chong Tai, Han-Chieh Chang
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Publication number: 20160105968Abstract: A biocompatible, micro-fabricated ribbon cable is described in which at least one set of conductors diverges laterally into a bypass wing that forms an aperture through the ribbon cable. The bypass wing is folded in a line through the aperture and over a central portion of the ribbon cable, resulting in a ribbon cable with a narrow, stacked region. The narrow region can fit through small incisions in membranes, such as through an incision in a sclera of an eyeball. The ribbon cable can have an integrally-formed electrode array for attaching to a retina of an eyeball and other electronics for sending signals to the electrode array.Type: ApplicationFiled: December 18, 2015Publication date: April 14, 2016Applicant: California Institute of TechnologyInventors: Yu-Chong Tai, Han-Chieh Chang