Abstract: A method for making iridium oxide nanoparticles includes dissolving an iridium salt to obtain a salt-containing solution, mixing a complexing agent with the salt-containing solution to obtain a blend solution, and adding an oxidating agent to the blend solution to obtain a product mixture. A molar ratio of a complexing compound of the complexing agent to the iridium salt is controlled in a predetermined range so as to permit the product mixture to include iridium oxide nanoparticles.

Abstract: A cooling liquid flow control device includes a heat dissipation bottom plate, a fixing holder, a cooling module, and a temperature control element. The heat dissipation bottom plate has a bottom surface configured to be in contact with a heating element on a substrate. The fixing holder is connected to the heat dissipation bottom plate and configured to be fixed with the substrate. The cooling module is connected to a top surface of the heat dissipation bottom plate to form a cavity. The cavity is configured to circulate a cooling liquid. The temperature control element is connected to the cooling module and includes a valve. The valve is configured to rotate based on a temperature of the heating element, thereby adjusting a flow rate of the cooling liquid in and out of the cavity.

Abstract: A cooling liquid flow control device includes a heat dissipation bottom plate, a fixing holder, a cooling module, and a temperature control element. The heat dissipation bottom plate has a bottom surface configured to be in contact with a heating element on a substrate. The fixing holder is connected to the heat dissipation bottom plate and configured to be fixed with the substrate. The cooling module is connected to a top surface of the heat dissipation bottom plate to form a cavity. The cavity is configured to circulate a cooling liquid. The temperature control element is connected to the cooling module and includes a valve. The valve is configured to reciprocally move based on a temperature of the heating element, thereby adjusting a flow rate of the cooling liquid in and out of the cavity.

Abstract: A cooling liquid flow control device includes a heat dissipation bottom plate, a fixing holder, a cooling module, and a temperature control element. The heat dissipation bottom plate has a bottom surface configured to be in contact with a heating element on a substrate. The fixing holder is connected to the heat dissipation bottom plate and configured to be fixed with the substrate. The cooling module is connected to a top surface of the heat dissipation bottom plate to form a cavity. The cavity is configured to circulate a cooling liquid. The temperature control element is disposed in the cavity and is configured to deform based on a temperature of the cooling liquid in the cavity, thereby adjusting a flow rate of the cooling liquid in and out of the cavity.

Abstract: A cooling liquid flow control device includes a heat dissipation bottom plate, a fixing holder, a cooling module, and a temperature control element. The heat dissipation bottom plate has a bottom surface configured to be in contact with a heating element on a substrate. The fixing holder is connected to the heat dissipation bottom plate and configured to be fixed with the substrate. The cooling module is connected to a top surface of the heat dissipation bottom plate to form a cavity. The cavity is configured to circulate a cooling liquid. The temperature control element is connected to the cooling module and includes a valve. The valve is configured to rotate based on a temperature of the heating element, thereby adjusting a flow rate of the cooling liquid in and out of the cavity.

Abstract: A cooling liquid flow control device includes a heat dissipation bottom plate, a fixing holder, a cooling module, and a temperature control element. The heat dissipation bottom plate has a bottom surface configured to be in contact with a heating element on a substrate. The fixing holder is connected to the heat dissipation bottom plate and configured to be fixed with the substrate. The cooling module is connected to a top surface of the heat dissipation bottom plate to form a cavity. The cavity is configured to circulate a cooling liquid. The temperature control element is connected to the cooling module and includes a valve. The valve is configured to reciprocally move based on a temperature of the heating element, thereby adjusting a flow rate of the cooling liquid in and out of the cavity.

Abstract: A cooling liquid flow control device includes a heat dissipation bottom plate, a fixing holder, a cooling module, and a temperature control element. The heat dissipation bottom plate has a bottom surface configured to be in contact with a heating element on a substrate. The fixing holder is connected to the heat dissipation bottom plate and configured to be fixed with the substrate. The cooling module is connected to a top surface of the heat dissipation bottom plate to form a cavity. The cavity is configured to circulate a cooling liquid. The temperature control element is disposed in the cavity and is configured to deform based on a temperature of the cooling liquid in the cavity, thereby adjusting a flow rate of the cooling liquid in and out of the cavity.

Abstract: A vibration absorbing assembly is adapted to be disposed on a cable. The vibration absorbing assembly includes a mount frame and a flexible covering component. The mount frame includes a first part and a second part. The second part is detachably assembled with the first part, and the first part and the second part together form an accommodation space. The flexible covering component is located in the accommodation space and pressed by the first part and the second part so as to surround a covering space. The covering space is configured to accommodate the cable.

Abstract: The disclosure provides a fixing assembly including a cage, a circuit board, a mount seat, and a fastener. The cage has an accommodation space, a first opening, a second opening, and a mount portion. The accommodation space is configured to accommodate a data storage device. The first opening and the second opening are connected to the accommodation space, and the mount portion protrudes from the first opening. The circuit board is fixed on the mount portion. The circuit board has a first electrical connector and a second electrical connector located at opposite surfaces of the circuit board and having different interfaces, and the first electrical connector is configured for an insertion of the data storage device. The mount seat has a first guiding portion, the cage has a second guiding portion mating with the first guiding portion. The fastener is configured to fix the cage to the mount seat.

Abstract: A riser assembly and an electronic device. Riser assembly configured to install expansion card on chassis and electrically connected to motherboard. The riser assembly includes first mounting frame and riser card. First mounting frame is configured to be mounted on chassis. Riser card includes plate body, riser card connector and expansion card connector. Plate body includes first surface and second surface that face away from each other. Riser card connector is disposed on first surface of plate body and protrudes from plate body. Expansion card connector is disposed on second surface of plate body and protrudes from plate body. Plate body is fixed to first mounting frame. Riser card connector is configured to be electrically connected to motherboard via cable, and expansion card connector is configured to be electrically connected to expansion card.

Abstract: A removable hard disk carrier includes an L-shaped support, a flexible support, and a side support. The flexible support is fixedly connected to an end portion of the L-shaped support. The side support is fixedly connected to an end portion of the flexible support and is detachably engaged with another end portion of the L-shaped support. Therein, after the side support is detachably engaged with the L-shaped support, the L-shaped support, the flexible support, and the side support form an accommodating space therebetween and can fix a hard disk in the accommodating space. When the side support and the L-shaped support are not engaged, the side support can move away from the L-shaped support due to the resilient deformation of the flexible support, so that the hard disk can be detached from the removable hard disk carrier.