Patents by Inventor Han-Ching SHIH
Han-Ching SHIH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240144056Abstract: A method includes: obtaining impact values for characteristic conditions; selecting training data subsets respectively from training data sets according to the impact values; obtaining a candidate model and an evaluation value based on the training data subsets; supplementing the training data subsets according to the impact values; obtaining another candidate model and another evaluation value based on training data subsets thus supplemented; repeating the step of supplementing the training data subset, and the step of obtaining another candidate model and another evaluation value based on the training data subsets thus supplemented; and selecting one of the candidate models as a prediction model based on the evaluation values.Type: ApplicationFiled: August 2, 2023Publication date: May 2, 2024Applicants: TAIPEI VETERANS GENERAL HOSPITALInventors: Chin-Chou Huang, Ming-Hui Hung, Ling-Chieh Shih, Yu-Ching Wang, Han Cheng, Yu-Chieh Shiao, Yu-Hsuan Tseng
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Publication number: 20240049401Abstract: A semi-flex printed circuit board with cover-opening opening is disclosed. An inner side of the core substrate surrounds a cover-opening opening. The two metal dam structures are arranged on a side surface of the core substrate; and the two metal dam structures and the core substrate jointly surround the cover-opening opening. The core board is arranged on a side surface of the bonding sheet away from the core substrate. Two sides of a bottom of the core substrate surrounding the cover-opening opening are provided with two laser cutting sidewalls respectively. Sidewalls of the two metal dam structures surrounding the cover-opening opening are connected with the two laser cutting sidewalls respectively and each defined as a metal dam sidewall. An obtuse angle presents between the metal dam sidewall and the laser cutting sidewall.Type: ApplicationFiled: August 2, 2023Publication date: February 8, 2024Applicant: TRIPOD (WUXI) ELECTRONIC CO., LTD.Inventors: Cheng Ming LU, Han-Ching SHIH, Hsu TU, Wen-Che CHEN, Wu-Chiang MA
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Publication number: 20240049396Abstract: A method for manufacturing a semi-flex printed circuit board is provided, including: forming two convex metal dam structures and two concave laser cut grooves on a side surface of the core substrate; wherein inner sides of the two metal dam structures form a printing area at the side surface of the core substrate, and the positions of the two laser cut grooves correspond to the printing area; printing a strippable printing ink in the printing area on the core substrate; laminating a build-up board structure on the side surface of the core substrate; and forming two blind routing openings on another side surface of the core substrate, which correspond to the two laser cut grooves in position respectively; removing a cover-opening structure of the core substrate between the two blind routing openings, so as to form a cover-opening opening.Type: ApplicationFiled: August 2, 2023Publication date: February 8, 2024Applicant: TRIPOD (WUXI) ELECTRONIC CO., LTD.Inventors: Cheng Ming LU, Han-Ching SHIH, Hsu TU, Wen-Che CHEN, Wu-Chiang MA
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Patent number: 9743523Abstract: A printed circuit board package structure includes a substrate, plural ring-shaped magnetic elements, a support layer, and first conductive layers. The substrate has two opposite first and second surfaces, first ring-shaped recesses, and first grooves. Each of the first ring-shaped recesses is communicated with another first ring-shaped recess through at least one of the first grooves, and at least two of the first ring-shaped recesses are communicated with a side surface of the substrate through the first grooves to form at least two openings. The ring-shaped magnetic elements are respectively located in the first ring-shaped recesses. The support layer is located on the first surface, and covers the first ring-shaped recesses and the first grooves. The support layer and the substrate have through holes. The first conductive layers are respectively located on surfaces of support layer and substrate facing the through holes.Type: GrantFiled: October 13, 2014Date of Patent: August 22, 2017Assignee: TRIPOD TECHNOLOGY CORPORATIONInventors: Bo-Shiung Huang, Wei-Hsiung Yang, Han-Ching Shih, Cheng-Feng Lin
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Patent number: 9258888Abstract: A printed circuit board package structure includes a substrate having a first surface and a second surface, a ring-shaped magnetic element, an adhesive layer, conductive portions and conductive channels. The first and second surfaces respectively have first and second metal portions. A ring-shaped concave portion is formed on a position not covered by the first metal portions of the first surface. The ring-shaped magnetic element is placed in the ring-shaped concave portion. The adhesive layer covers the first metal portions and the ring-shaped magnetic element. The conductive portions are formed on the adhesive layer. The conductive channels penetrate the conductive portions, the adhesive layer, and the substrate, and are respectively located in an inner wall and outside an outer wall of the ring-shaped concave portion. Each of the conductive channels includes a conductive film electrically connects to the aligned conductive portion and second metal portion.Type: GrantFiled: March 11, 2014Date of Patent: February 9, 2016Assignee: TRIPOD TECHNOLOGY CORPORATIONInventors: Bo-Shiung Huang, Wei-Hsiung Yang, Han-Ching Shih, Cheng-Feng Lin
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Patent number: 9101072Abstract: A method of embedding a magnetic component in a substrate is disclosed. Holes are formed in a substrate by mechanically drilling. Each of the holes includes a top opening, a bottom and sidewall, wherein an area of the top opening is larger than that of the bottom. The sidewall extends from the top opening vertically downwards to a predetermined depth, and then is slanted inwardly to the bottom to form a sloped sidewall at the bottom of the hole. A predetermined region is defined along a portion of an edge of the top opening, and a portion of the substrate material under the predetermined region is removed by routing to form a component accommodation trench with a portion of the sloped sidewall at the bottom. Then, a magnetic component is placed into the component accommodation trench.Type: GrantFiled: May 22, 2012Date of Patent: August 4, 2015Assignee: TRIPOD TECHNOLOGY CORPORATIONInventors: Bo-Shiung Huang, Han-Ching Shih, Tzu-Yuan Fan, Wei-Hsiung Yang, Kai-Hsiang Chen
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Publication number: 20150107883Abstract: A printed circuit board package structure includes a substrate, plural ring-shaped magnetic elements, a support layer, and first conductive layers. The substrate has two opposite first and second surfaces, first ring-shaped recesses, and first grooves. Each of the first ring-shaped recesses is communicated with another first ring-shaped recess through at least one of the first grooves, and at least two of the first ring-shaped recesses are communicated with a side surface of the substrate through the first grooves to form at least two openings. The ring-shaped magnetic elements are respectively located in the first ring-shaped recesses. The support layer is located on the first surface, and covers the first ring-shaped recesses and the first grooves. The support layer and the substrate have through holes. The first conductive layers are respectively located on surfaces of support layer and substrate facing the through holes.Type: ApplicationFiled: October 13, 2014Publication date: April 23, 2015Inventors: Bo-Shiung Huang, Wei-Hsiung Yang, Han-Ching Shih, Cheng-Feng Lin
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Publication number: 20140266549Abstract: A printed circuit board package structure includes a substrate having a first surface and a second surface, a ring-shaped magnetic element, an adhesive layer, conductive portions and conductive channels. The first and second surfaces respectively have first and second metal portions. A ring-shaped concave portion is formed on a position not covered by the first metal portions of the first surface. The ring-shaped magnetic element is placed in the ring-shaped concave portion. The adhesive layer covers the first metal portions and the ring-shaped magnetic element. The conductive portions are formed on the adhesive layer. The conductive channels penetrate the conductive portions, the adhesive layer, and the substrate, and are respectively located in an inner wall and outside an outer wall of the ring-shaped concave portion. Each of the conductive channels includes a conductive film electrically connects to the aligned conductive portion and second metal portion.Type: ApplicationFiled: March 11, 2014Publication date: September 18, 2014Applicant: TRIPOD TECHNOLOGY CORPORATIONInventors: Bo-Shiung HUANG, Wei-Hsiung YANG, Han-Ching SHIH, Cheng-Feng LIN
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Publication number: 20130104365Abstract: A method of embedding a magnetic component in a substrate is disclosed. Holes are formed in a substrate by mechanically drilling. Each of the holes includes a top opening, a bottom and sidewall, wherein an area of the top opening is larger than that of the bottom. The sidewall extends from the top opening vertically downwards to a predetermined depth, and then is slanted inwardly to the bottom to form a sloped sidewall at the bottom of the hole. A predetermined region is defined along a portion of an edge of the top opening, and a portion of the substrate material under the predetermined region is removed by routing to form a component accommodation trench with a portion of the sloped sidewall at the bottom. Then, a magnetic component is placed into the component accommodation trench.Type: ApplicationFiled: May 22, 2012Publication date: May 2, 2013Inventors: Bo-Shiung HUANG, Han-Ching SHIH, Tzu-Yuan FAN, Wei-Hsiung YANG, Kai-Hsiang CHEN