Abstract: A lighting module, an electronic device, and a display panel are provided. The lighting module includes a carrier, a first metal circuit layer, a first transparent conductive layer, a first insulating layer, a second transparent conductive layer, a second metal circuit layer, a bonding structure layer, and a plurality of lighting units. The bonding structure layer is configured to allow the second metal circuit layer to be well bonded to the first insulating layer, so that a resistance value of the lighting module is decreased, and a pressure drop is reduced.

Abstract: An LED package structure includes a ceramic substrate, a ceramic board, a light-emitting unit, a first adhesive layer, a second adhesive layer, and a cover. The ceramic board having a thru-hole is disposed on the ceramic substrate. The light-emitting unit is disposed on the ceramic substrate and is arranged in the thru-hole of the ceramic board. The first and second adhesive layers are disposed on the ceramic board, and the second adhesive layer covers the first adhesive layer. The cover is fixed on the ceramic board by the first and second adhesive layers. Thus, the shearing force of the LED package structure of the instant disclosure is increased by having the first and second adhesive layers, which are connected to each other.

Abstract: A manufacturing method of an LED package structure includes the steps as follows: providing an LED package structure assembly, which has a substrate layer, an LED chip set located on the substrate layer, and an encapsulating gel layer covering the LED chip set; taking a first blade to saw the LED package structure assembly from the encapsulating gel layer to the substrate layer until a plurality of sawing grooves are formed on the substrate layer; and taking a second blade to saw the LED package structure assembly along each sawing groove until the second blade passes through the substrate layer, thereby forming a plurality of LED package structures separated from each other. Wherein a hardness of the first blade is greater than that of the second blade, and a thickness of the second blade is less than that of the first blade.

Abstract: A light emitting control system is provided. The light emitting control system includes a housing, an IR emitter having a central axis and a lens structure. The housing has a receiving space, and the IR emitter is disposed in the receiving space of the housing. The lens structure is disposed on the reflector, the lens structure includes a lens facing the IR emitter, and a cross-sectional shape of the lens along a first cross-sectional line is asymmetric with respect to the central axis of the IR emitter.

Abstract: A manufacturing method of an LED package structure includes the steps as follows: providing an LED package structure assembly, which has a substrate layer, an LED chip set located on the substrate layer, and an encapsulating gel layer covering the LED chip set; taking a first blade to saw the LED package structure assembly from the encapsulating gel layer to the substrate layer until a plurality of sawing grooves are formed on the substrate layer; and taking a second blade to saw the LED package structure assembly along each sawing groove until the second blade passes through the substrate layer, thereby forming a plurality of LED package structures separated from each other. Wherein a hardness of the first blade is greater than that of the second blade, and a thickness of the second blade is less than that of the first blade.

Abstract: A manufacturing method of an LED package structure includes the steps as follows: providing an LED package structure assembly, which has a substrate layer, an LED chip set located on the substrate layer, and an encapsulating gel layer covering the LED chip set; taking a first blade to saw the LED package structure assembly from the encapsulating gel layer to the substrate layer until a plurality of sawing grooves are formed on the substrate layer; and taking a second blade to saw the LED package structure assembly along each sawing groove until the second blade passes through the substrate layer, thereby forming a plurality of LED package structures separated from each other. Wherein a hardness of the first blade is greater than that of the second blade, and a thickness of the second blade is less than that of the first blade.

Abstract: A UV light-emitting unit includes a carrier, a UV LED chip, a side lens, and a water-resistant layer. The UV LED chip is disposed on the carrier, and the UV LED chip has a top surface and a surrounding side surface arranged adjacent to the top surface. The top surface has a center region and an external region arranged around the center region and connected to the surrounding side surface. The side lens is disposed on the carrier. The surrounding side surface of the UV LED chip is covered by the side lens. The water-resistant layer covers an outer surface of the side lens and the external region of the top surface of the UV LED chip. In addition, the present disclosure also discloses a UV LED package structure and a method for manufacturing a UV light-emitting unit.

Abstract: A light emitting control system is provided. The light emitting control system includes a housing, an IR emitter having a central axis and a lens structure. The housing has a receiving space, and the IR emitter is disposed in the receiving space of the housing. The lens structure is disposed on the reflector, the lens structure includes a lens facing the IR emitter, and a cross-sectional shape of the lens along a first cross-sectional line is asymmetric with respect to the central axis of the IR emitter.

Abstract: A UV light-emitting unit includes a carrier, a UV LED chip, a side lens, and a water-resistant layer. The UV LED chip is disposed on the carrier, and the UV LED chip has a top surface and a surrounding side surface arranged adjacent to the top surface. The top surface has a center region and an external region arranged around the center region and connected to the surrounding side surface. The side lens is disposed on the carrier. The surrounding side surface of the UV LED chip is covered by the side lens. The water-resistant layer covers an outer surface of the side lens and the external region of the top surface of the UV LED chip. In addition, the present disclosure also discloses a UV LED package structure and a method for manufacturing a UV light-emitting unit.

Abstract: An LED package structure includes a ceramic substrate, a ceramic board, a light-emitting unit, a first adhesive layer, a second adhesive layer, and a cover. The ceramic board having a thru-hole is disposed on the ceramic substrate. The light-emitting unit is disposed on the ceramic substrate and is arranged in the thru-hole of the ceramic board. The first and second adhesive layers are disposed on the ceramic board, and the second adhesive layer covers the first adhesive layer. The cover is fixed on the ceramic board by the first and second adhesive layers. Thus, the shearing force of the LED package structure of the instant disclosure is increased by having the first and second adhesive layers, which are connected to each other.

Abstract: An LED package structure includes a ceramic substrate, a ceramic board, a light-emitting unit, a first adhesive layer, a second adhesive layer, and a cover. The ceramic board having a thru-hole is disposed on the ceramic substrate. The light-emitting unit is disposed on the ceramic substrate and is arranged in the thru-hole of the ceramic board. The first and second adhesive layers are disposed on the ceramic board, and the second adhesive layer covers the first adhesive layer. The cover is fixed on the ceramic board by the first and second adhesive layers. Thus, the shearing force of the LED package structure of the instant disclosure is increased by having the first and second adhesive layers, which are connected to each other.

Abstract: A lens of an LED package structure includes a square-shaped base layer, a first light-guiding portion integrally connected to the base layer, a second light-guiding portion taperedly extended from the first light-guiding portion. The second light-guiding portion has an apex located away from the first light-guiding portion. The lens includes four side curved surfaces and four boundary curved surfaces connected to the apex. Four first projecting regions are defined by orthogonally projecting the four boundary curved surfaces onto the base layer, and the four first projecting regions are arranged on two diagonals of the base layer. Any two adjacent boundary curved surfaces are provided with one of the side curved surfaces there-between. Each boundary curved surface has a first radius of curvature (R1), a portion of each side curved surface arranged on the second light-guiding portion has a second radius of curvature (R2), wherein R1/R2=M?{square root over (2)} and M=0.8˜1.2.

Abstract: A lens of an LED package structure includes a square-shaped base layer, a first light-guiding portion integrally connected to the base layer, a second light-guiding portion taperedly extended from the first light-guiding portion. The second light-guiding portion has an apex located away from the first light-guiding portion. The lens includes four side curved surfaces and four boundary curved surfaces connected to the apex. Four first projecting regions are defined by orthogonally projecting the four boundary curved surfaces onto the base layer, and the four first projecting regions are arranged on two diagonals of the base layer. Any two adjacent boundary curved surfaces are provided with one of the side curved surfaces there-between. Each boundary curved surface has a first radius of curvature (R1), a portion of each side curved surface arranged on the second light-guiding portion has a second radius of curvature (R2), wherein R1/R2=M?{square root over ( )}2 and M=0.8˜1.2.

Abstract: An LED package structure includes a ceramic substrate, a ceramic board, a light-emitting unit, a first adhesive layer, a second adhesive layer, and a cover. The ceramic board having a thru-hole is disposed on the ceramic substrate. The light-emitting unit is disposed on the ceramic substrate and is arranged in the thru-hole of the ceramic board. The first and second adhesive layers are disposed on the ceramic board, and the second adhesive layer covers the first adhesive layer. The cover is fixed on the ceramic board by the first and second adhesive layers. Thus, the shearing force of the LED package structure of the instant disclosure is increased by having the first and second adhesive layers, which are connected to each other.

Abstract: A manufacturing method of an LED package structure includes the steps as follows: providing an LED package structure assembly, which has a substrate layer, an LED chip set located on the substrate layer, and an encapsulating gel layer covering the LED chip set; taking a first blade to saw the LED package structure assembly from the encapsulating gel layer to the substrate layer until a plurality of sawing grooves are formed on the substrate layer; and taking a second blade to saw the LED package structure assembly along each sawing groove until the second blade passes through the substrate layer, thereby forming a plurality of LED package structures separated from each other. Wherein a hardness of the first blade is greater than that of the second blade, and a thickness of the second blade is less than that of the first blade.

Abstract: A light-emitting structure for providing a predetermined whiteness includes a substrate and a light-emitting unit. The light-emitting unit includes a plurality of first and second light-emitting groups disposed on the substrate. Each first light-emitting group includes a plurality of first LED chips having a first predetermined wavelength. Each second light-emitting group includes a plurality of second LED chips having a second predetermined wavelength. When surface areas of the first and the second LED chips are substantially the same or currents passing through the first and the second LED chips are substantially the same in advance, the light-emitting structure can provide a predetermined whiteness according to different requirements by adjusting the current ratio or the surface area ratio of the first and the second LED chips, respectively.