Abstract: A method of forming a semiconductor package includes: surrounding a die with a molding material; and forming a redistribution structure (RDS) over the molding material and electrically coupled to the die, which includes: depositing a first dielectric layer over the molding material; patterning the first dielectric layer to form first openings in the first dielectric layer; performing a first descum process to clean the first openings; after performing the first descum process, forming a first redistribution layer (RDL) on the first dielectric layer; depositing a second dielectric layer over the molding material; patterning the second dielectric layer to form second openings in the second dielectric layer; performing a second descum process to clean the second openings, where the first and second descum processes are performed under different process conditions; and after performing the second descum process, forming a second RDL on the second dielectric layer.

Abstract: An electronic device may be provided with an antenna module having a substrate. An antenna may be disposed on the substrate. The antenna may have a directly fed patch and parasitic patches. The antenna may be fed by a feed via. The parasitic patches may include a first layer of parasitic patches separated by a gap overlapping the directly fed patch. The parasitic patches may include an additional parasitic patch formed in a second layer. The additional parasitic patch may overlap the gap. A floating ground via may couple a center of the additional parasitic patch and a center of the directly fed patch to a landing pad in a ground layer. The landing pad may short the via to the ground layer at the radiating frequency of the antenna. The landing pad may be electrically floating at DC frequencies.

Abstract: Provided are a precursor solution, and a modified layer and a lithium-based battery prepared by using the same. The modified layer is formed on the negative electrode, the positive electrode and/or the separator of the lithium-based battery by using the precursor solution through photo-polymerization reaction or thermal curing. The lithium-based battery comprising the modified layer effectively promotes the charge and discharge capability, cycling life, and safety. The modified layer can be applied to a roll-to-roll process. The formation of lithium dendrites in the lithium-based battery comprising the modified layer is significantly suppressed or reduced during the charge-discharge cycles. The shuttle effect is effectively suppressed or reduced in lithium sulfur batteries and lithium iodine batteries. All the above effects are beneficial to increasing the product value of lithium ion batteries, lithium metal batteries, anode-free lithium batteries, lithium sulfur batteries, and lithium iodine batteries.

Abstract: Embodiments of the present disclosure provide an electrical device, a method for controlling a solid state circuit breaker electrical device, and a computer-readable storage medium. The method comprises: in a closed state of a mechanical switch of the electrical device, closing one of a plurality of electronic switches of the electrical device within a predetermined time period before a zero-crossing point of an input voltage of a bus circuit to which the electrical device is connected; acquiring a current value or a voltage value of a sampling resistor in the electrical device within the predetermined time period; and in response to determining that the current value or the voltage value as acquired is less than or equal to a predetermined threshold, causing an indication component to indicate that there is no short circuit fault in the bus circuit.

Abstract: A residual current circuit breaker and a system including the residual current circuit breaker are provided. The residual current circuit breaker includes: a first switch connected in series between a power supply of the residual current circuit breaker and a load; a second switch connected in series between a standby power supply and the load; and a control means that controls to open the first switch and close the second switch in response to a residual current of a main loop of the residual current circuit breaker exceeding a predetermined threshold, wherein a voltage of the standby power supply is higher than a lowest value of a voltage required for the load to operate and lower than a highest value of a safe voltage, and wherein the first switch and the second switch are mutually exclusive.

Abstract: A backlight module includes first and second light guide plates, an anti-peeping film, and first and second light sources. The anti-peeping film is located on a first light exit surface of the first light guide plates. The second light guide plate is located on a side of the anti-peeping film away from the first light guide plate. The first light source is opposite a first light incident surface of the first light guide plate. The second light source includes a first portion extending along the direction perpendicular to the reference plane and opposite a second light incident surface of the second light guide plate. A side of the first light source proximate to the fist light guide plate is staggered from a side of the second light source proximate to the second light guide plate, and closer to center of the first light guide plate than the second light source.

Abstract: A pressure sensing device, comprising: a frame work; a capacitive pressure sensor layer, surrounding the frame work; a capacitive touch sensor layer; and a flexible material layer, located between the pressure sensor layer and the touch sensor layer and surrounding the capacitive pressure sensor layer. The capacitive touch sensor layer is above the flexible material layer when the capacitive pressure sensor layer is below the flexible material layer. The capacitive touch sensor layer has a first driving electrode and a first sensing electrode. The capacitive pressure sensor layer has a second driving electrode and a second sensing electrode. A 3D gesture control system and a vehicle control system applying the pressure sensing device are also disclosed. Via the pressure sensing device, the 3D gesture control system and the vehicle control system can generate control commands according to a touch or a pressure provided by a user.

Abstract: A Kriging model-based optimal design method and device for a bulk acoustic resonator, and a storage medium are provided. The Kriging model-based optimal design method includes: determining a structure and a material of a resonator, establishing a corresponding MASON model, and performing one-dimensional simulation on the MASON model to obtain a simulation result; determining, based on the simulation result, a design variable for optimizing the resonator, and constructing a Kriging surrogate model; determining an optimization goal, constructing an optimization problem model based on the optimization goal and the Kriging surrogate model, and solving the optimization problem model to obtain an optimal solution; and reducing upper and lower limits of the design variable to improve optimization accuracy.

Abstract: Apparatus and methods for handling semiconductor part carriers are disclosed. In one example, an apparatus for handling semiconductor part carriers is disclosed. The apparatus includes a mechanical arm and an imaging system coupled to the mechanical arm. The mechanical arm is configured for holding a semiconductor part carrier. The imaging system is configured for automatically locating a goal position on a surface onto which the semiconductor part carrier is to be placed.

Abstract: A light-emitting substrate, a display panel and a display device are disclosed. The light-emitting substrate includes: a base substrate; a first power line disposed on the base substrate; an auxiliary electrode pattern disposed on a side of the first power supply line away from the base substrate and electrically connected with the first power supply line; an organic material layer disposed on a surface of the auxiliary electrode pattern and having a first via hole exposing part of a surface of the auxiliary electrode pattern at the bottom, wherein the part of the surface of the auxiliary electrode pattern exposed at the bottom of the first via hole is a non-planar surface; and a first electrode layer disposed on a side of the organic material layer away from the base substrate and electrically connected with the auxiliary electrode pattern through the first via hole.

Abstract: A fan-out package includes a molding compound die frame laterally surrounding at least one semiconductor die; and an organic interposer including redistribution dielectric layers embedding redistribution wiring interconnects and located on a first horizontal surface of the molding compound die frame. An alignment mark region including a localized recess region is located within an opening in a second horizontal surface of the molding compound die frame. The localized recess region extends from the second horizontal surface toward the organic interposer.

Abstract: An apparatus and a method for effectively exhausting evaporated material are provided. In an embodiment the apparatus includes a hot plate and an exhaust hood assembly suspended over the hot plate. The exhaust hood assembly includes a trench plate, a cover plate over the trench plate and a single exhaust pipe header over and attached to a single exhaust opening of the cover plate. During operation, the exhaust hood assembly reduces the amount of condensation and also collects any remaining condensation in order to help prevent condensation from impacting further manufacturing steps.

Abstract: A method of fabricating a redistribution circuit structure including the following steps is provided. A conductive via is formed. A photosensitive dielectric layer is formed to cover the conductive via. The photosensitive dielectric layer is partially removed to reveal the conductive via at least through an exposure and development process. A redistribution wiring is formed on the photosensitive dielectric layer and the revealed conductive via.

Abstract: A method of complementing a map of a scene with 3D reference points including four steps. In a first step, data is collected and recorded based on samples of at least one of an optical sensor, a GNSS, and an IMU. A second step includes initial pose generation by processing of the collected sensor data to provide a track of vehicle poses. A pose is based on a specific data set, on at least one data set recoded before that dataset and on at least one data set recorded after that data set. A third step includes SLAM processing of the initial poses and collected optical sensor data to generate keyframes with feature points. In a fourth step 3D reference points are generated by fusion and optimization of the feature points by using future and past feature points together with a feature point at a point of processing. This second and fourth steps provides significantly better results than SLAM or VIO methods known from prior art, as the second and the fourth steps are based on recorded data.

Abstract: A display module includes a back plate, a light guide plate, a rubber frame and a display panel, the light guide plate is fixed on a bearing surface, a connecting line between two end portions of the bearing surface forms a first curve. The first curve includes a circular arc segment and a transition curve segment, and bends in a direction away from the display panel; the circular arc segment is located at the middle, at least one end of the circular arc segment is provided with the transition curve segment; the transition curve segment is located at a first position, the first position being a position of the bearing surface opposite to a second position, the second position being a position where light leaks from the display panel, the radius of curvature of the transition curve increases along a direction close to an end portion of the first curve.

Abstract: A curved optical plate includes a curved light exit surface including at least one curved edge and at least one uncurved edge, and at least one first side surface connected to the at least one uncurved edge of the light exit surface; a first side surface includes a first surface, and the first surface extends toward an interior of the curved optical plate.

Abstract: A display device and a control method therefor are disclosed. The display device includes: a first backlight module; a second backlight module located at a light emergent side of the first backlight module; and a display panel located at a side of the second backlight module facing away from the first backlight module; where the first backlight module includes a first light board, and the first light board emits light to a side of the second backlight module; the second backlight module includes at least one second light board, second light boards of the at least one second light board are stacked, and the second light boards transmit the light emitted by the first backlight module and emit light to the display panel; the first light board includes a plurality of first light sources, each second light board of the second light boards includes a plurality of second light sources.

Abstract: A semiconductor device includes a semiconductor substrate, a plurality of semiconductor dies, a dielectric layer, a connector, and a passivation layer. The plurality of semiconductor dies are stacked on one another and disposed over the semiconductor substrate. The dielectric layer cover a top surface and a side surface of the each of the plurality of semiconductor dies. The connector is disposed over a topmost one of the plurality of semiconductor dies. The passivation layer is disposed over the dielectric layer and laterally surrounds the connector, wherein, from a cross sectional view, an acute angle is included between an outermost side surface of the passivation layer and a bottom surface of the passivation layer.

Abstract: A method includes forming a metal post over a first redistribution structure; attaching a first device die to the first redistribution structure, the first device die comprising a through via embedded in a semiconductor substrate; encapsulating the metal post and the first device die in an encapsulant, a first top surface of the encapsulant being level with a second top surface of the semiconductor substrate; recessing the second top surface to expose the through via; forming a dielectric isolation layer around the through via; forming a dielectric layer over the dielectric isolation layer; etching the dielectric layer to form a first opening and a second opening in the dielectric layer; forming a first metal via in the first opening and a second metal via in the second opening; and forming a second redistribution structure over the dielectric layer.