Abstract: Two types of blue light blocking contact lenses are provided and are formed by curing different compositions. The first composition includes a blue light blocking component formed by mixing or reacting a first hydrophilic monomer and a yellow dye, a first colored dye component formed by mixing or reacting a second hydrophilic monomer and a first colored dye, at least one third hydrophilic monomer, a crosslinker, and an initiator. The first colored dye includes a green dye, a cyan dye, a blue dye, an orange dye, a red dye, a black dye, or combinations thereof. The second composition includes a blue light blocking component, at least one hydrophilic monomer, a crosslinker, and an initiator. The blue light blocking component is formed by mixing or reacting glycerol monomethacrylate and a yellow dye. Further, methods for preparing the above contact lenses are provided.

Abstract: Embodiments of the present disclosure generally relate to planarization of surfaces on substrates and on layers formed on substrates. More specifically, embodiments of the present disclosure relate to planarization of surfaces on substrates for advanced packaging applications, such as surfaces of polymeric material layers. In one implementation, the method includes mechanically grinding a substrate surface against a polishing surface in the presence of a grinding slurry during a first polishing process to remove a portion of a material formed on the substrate; and then chemically mechanically polishing the substrate surface against the polishing surface in the presence of a polishing slurry during a second polishing process to reduce any roughness or unevenness caused by the first polishing process.

Abstract: Various embodiments of the present disclosure are directed towards a semiconductor processing system including an overlay (OVL) shift measurement device. The OVL shift measurement device is configured to determine an OVL shift between a first wafer and a second wafer, where the second wafer overlies the first wafer. A photolithography device is configured to perform one or more photolithography processes on the second wafer. A controller is configured to perform an alignment process on the photolithography device according to the determined OVL shift. The photolithography device performs the one or more photolithography processes based on the OVL shift.

Abstract: The present disclosure provides a package stack structure and a method for manufacturing the same. The method is characterized by stacking coreless circuit portions on the board of an electronic component to reduce the overall thickness of the package stack structure.

Abstract: An electronic package and a method for fabricating the same are provided. The method includes stacking an antenna board on a circuit board, and disposing between the antenna board and the circuit board a supporting body securing the antenna board and the circuit board. As such, during a packaging process, the distance between the antenna board and the circuit board is kept unchanged due to the supporting body, thus ensuring that the antenna board operates properly and improving the product yield.

Abstract: An electronic package is disclosed. An antenna board is stacked on a circuit board. A frame is formed on the circuit board. A supporter disposed between the antenna board and the circuit board is secured in the frame. In a packaging process, the frame ensures that the antenna board and the circuit board are separated at a distance that complies with a requirement, and that the antenna function of the antenna board can function normally.

Abstract: An electronic package and a method for fabricating the same are provided. A resist layer and a support are formed on a first substrate having a first antenna installation area. A second substrate having a second antenna installation area is laminated on the resist layer and the support. The resist layer is then removed. The support keeps the first substrate apart from the second substrate at a distance to ensure that the antenna transmission between the first antenna installation area and the second antenna installation area can function normally.

Abstract: An electronic package is disclosed. An antenna board is stacked on a circuit board. A frame is formed on the circuit board. A supporter disposed between the antenna board and the circuit board is secured in the frame. In a packaging process, the frame ensures that the antenna board and the circuit board are separated at a distance that complies with a requirement, and that the antenna function of the antenna board can function normally.

Abstract: An electronic package and a method for fabricating the same are provided. A resist layer and a support are formed on a first substrate having a first antenna installation area. A second substrate having a second antenna installation area is laminated on the resist layer and the support. The resist layer is then removed. The support keeps the first substrate apart from the second substrate at a distance to ensure that the antenna transmission between the first antenna installation area and the second antenna installation area can function normally.

Abstract: An electronic package and a method for fabricating the same are provided. A resist layer and a support are formed on a first substrate having a first antenna installation area. A second substrate having a second antenna installation area is laminated on the resist layer and the support. The resist layer is then removed. The support keeps the first substrate apart from the second substrate at a distance to ensure that the antenna transmission between the first antenna installation area and the second antenna installation area can function normally.

Abstract: The present disclosure provides a package stack structure and a method for manufacturing the same. The method is characterized by stacking coreless circuit portions on the board of an electronic component to reduce the overall thickness of the package stack structure.

Abstract: A package stacked structure and a method for fabricating the same are provided. The method includes providing a wiring structure disposed with a carrier and a carrier structure provided with an electronic component. The wiring structure is bonded to the carrier structure via a plurality of conductive elements. An encapsulating layer is formed between the wiring structure and the carrier structure and encapsulates the conductive elements and the electronic component. The carrier is then removed. With the arrangement of the carrier, the structural strength of the wiring structure is improved, and warpage of the wiring structure is prevented before stacking the wiring structure onto the carrier structure.

Abstract: An electronic package and a method for fabricating the same are provided. A resist layer and a support are formed on a first substrate having a first antenna installation area. A second substrate having a second antenna installation area is laminated on the resist layer and the support. The resist layer is then removed. The support keeps the first substrate apart from the second substrate at a distance to ensure that the antenna transmission between the first antenna installation area and the second antenna installation area can function normally.

Abstract: The disclosure provides a substrate construction applicable to a 3D package, including a silicon substrate for carrying a chip on an upper side thereof, and a circuit structure formed underneath the silicon substrate for being connected to solder balls via conductive pads of the circuit structure, thereby obtaining the same specification of the conductive pads as ball-planting pads of conventional package substrates and avoiding the manufacturing and use of conventional package substrates.

Abstract: An electronic package and a method for fabricating the same are provided. The method includes stacking an antenna board on a circuit board, and disposing between the antenna board and the circuit board a supporting body securing the antenna board and the circuit board. As such, during a packaging process, the distance between the antenna board and the circuit board is kept unchanged due to the supporting body, thus ensuring that the antenna board operates properly and improving the product yield.

Abstract: The present disclosure provides a package stack structure and a method for manufacturing the same. The method is characterized by stacking coreless circuit portions on the board of an electronic component to reduce the overall thickness of the package stack structure.

Abstract: The disclosure provides a substrate construction applicable to a 3D package, including a silicon substrate for carrying a chip on an upper side thereof, and a circuit structure formed underneath the silicon substrate for being connected to solder balls via conductive pads of the circuit structure, thereby obtaining the same specification of the conductive pads as ball-planting pads of conventional package substrates and avoiding the manufacturing and use of conventional package substrates.