Patents by Inventor Han-Jen Yang
Han-Jen Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11380673Abstract: An Electro-Static Discharge (ESD) includes a first well having a first conductivity type on a substrate. The device further includes a second well within the first well. The second well has a second conductivity type. The device further includes a third well within the first well. The third well has the second conductivity type. The device further includes a first gate device disposed over the first well, a plurality of active regions between the first gate device and the dummy gate, and a dummy gate disposed within a space between the active regions. The dummy gate is positioned over a space between the second and third wells.Type: GrantFiled: November 30, 2020Date of Patent: July 5, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Wun-Jie Lin, Han-Jen Yang, Yu-Ti Su
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Publication number: 20210082907Abstract: An Electro-Static Discharge (ESD) includes a first well having a first conductivity type on a substrate. The device further includes a second well within the first well. The second well has a second conductivity type. The device further includes a third well within the first well. The third well has the second conductivity type. The device further includes a first gate device disposed over the first well, a plurality of active regions between the first gate device and the dummy gate, and a dummy gate disposed within a space between the active regions. The dummy gate is positioned over a space between the second and third wells.Type: ApplicationFiled: November 30, 2020Publication date: March 18, 2021Inventors: Wun-Jie Lin, Han-Jen Yang, Yu-Ti Su
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Publication number: 20200411506Abstract: An electrostatic discharge (ESD) protection device having a source region coupled to a first electrical node, a first drain region coupled to a second electrical node different from the first electrical node, and an extended drain region between the source region and the first drain region. The extended drain region includes a number N of electrically floating doped regions and a number M of gate regions coupled to the second electrical node, where N and M are integers greater than 1 and N is equal to M. Each electrically floating doped region of the N number of floating doped regions alternates with each gate region of the M number of gate regions.Type: ApplicationFiled: September 14, 2020Publication date: December 31, 2020Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Po-Lin Peng, Han-Jen Yang, Jam-Wem Lee, Li-Wei Chu
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Patent number: 10854595Abstract: An Electro-Static Discharge (ESD) includes a first well having a first conductivity type on a substrate. The device further includes a second well within the first well. The second well has a second conductivity type. The device further includes a third well within the first well. The third well has the second conductivity type. The device further includes a first gate device disposed over the first well, a plurality of active regions between the first gate device and the dummy gate, and a dummy gate disposed within a space between the active regions. The dummy gate is positioned over a space between the second and third wells.Type: GrantFiled: December 13, 2018Date of Patent: December 1, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Wun-Jie Lin, Han-Jen Yang, Yu-Ti Su
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Patent number: 10790274Abstract: An Electro-Static Discharge (ESD) protection circuit includes a plurality of groups of p-type heavily doped semiconductor strips (p+ strips) and a plurality of groups of n-type heavily doped semiconductor strips (n+ strips) forming an array having a plurality of rows and columns. In each of the rows and the columns, the plurality of groups of p+ strips and the plurality of groups of n+ strips are allocated in an alternating layout. The ESD protection circuit further includes a plurality of gate stacks, each including a first edge aligned to an edge of a group in the plurality of groups of p+ strips, and a second edge aligned to an edge of a group in the plurality of groups of n+ strips.Type: GrantFiled: October 19, 2017Date of Patent: September 29, 2020Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Ti Su, Wun-Jie Lin, Han-Jen Yang, Shui-Ming Cheng, Ming-Hsiang Song
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Patent number: 10777546Abstract: An electrostatic discharge (ESD) protection device having a source region coupled to a first electrical node, a first drain region coupled to a second electrical node different from the first electrical node, and an extended drain region between the source region and the first drain region. The extended drain region includes a number N of electrically floating doped regions and a number M of gate regions coupled to the second electrical node, where N and M are integers greater than 1 and N is equal to M. Each electrically floating doped region of the N number of floating doped regions alternates with each gate region of the M number of gate regions.Type: GrantFiled: December 29, 2016Date of Patent: September 15, 2020Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Po-Lin Peng, Han-Jen Yang, Jam-Wem Lee, Li-Wei Chu
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Patent number: 10546850Abstract: A semiconductor device includes semiconductor fins on semiconductor strips on a substrate. The semiconductor fins are parallel to each other. A gate stack is over the semiconductor fins, and a drain epitaxy semiconductor region is disposed laterally from a side of the gate stack and on the semiconductor strips. A first dielectric layer is over the substrate, and the first dielectric layer has a first metal layer. A second dielectric layer is over the first dielectric layer, and the second dielectric layer has a second metal layer. Vias extend from the second metal layer and through the first dielectric layer, and the vias are electrically coupled to the drain epitaxy semiconductor region.Type: GrantFiled: December 24, 2018Date of Patent: January 28, 2020Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Wun-Jie Lin, Ching-Hsiung Lo, Jen-Chou Tseng, Han-Jen Yang, Arabinda Das
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Publication number: 20190148357Abstract: A semiconductor device includes semiconductor fins on semiconductor strips on a substrate. The semiconductor fins are parallel to each other. A gate stack is over the semiconductor fins, and a drain epitaxy semiconductor region is disposed laterally from a side of the gate stack and on the semiconductor strips. A first dielectric layer is over the substrate, and the first dielectric layer has a first metal layer. A second dielectric layer is over the first dielectric layer, and the second dielectric layer has a second metal layer. Vias extend from the second metal layer and through the first dielectric layer, and the vias are electrically coupled to the drain epitaxy semiconductor region.Type: ApplicationFiled: December 24, 2018Publication date: May 16, 2019Inventors: Wun-Jie Lin, Ching-Hsiung Lo, Jen-Chou Tseng, Han-Jen Yang, Arabinda Das
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Publication number: 20190131293Abstract: An Electro-Static Discharge (ESD) includes a first well having a first conductivity type on a substrate. The device further includes a second well within the first well. The second well has a second conductivity type. The device further includes a third well within the first well. The third well has the second conductivity type. The device further includes a first gate device disposed over the first well, a plurality of active regions between the first gate device and the dummy gate, and a dummy gate disposed within a space between the active regions. The dummy gate is positioned over a space between the second and third wells.Type: ApplicationFiled: December 13, 2018Publication date: May 2, 2019Inventors: Wun-Jie Lin, Han-Jen Yang, Yu-Ti Su
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Patent number: 10163894Abstract: A semiconductor device includes semiconductor fins on semiconductor strips on a substrate. The semiconductor fins are parallel to each other. A gate stack is over the semiconductor fins, and a drain epitaxy semiconductor region is disposed laterally from a side of the gate stack and on the semiconductor strips. A first dielectric layer is over the substrate, and the first dielectric layer has a first metal layer. A second dielectric layer is over the first dielectric layer, and the second dielectric layer has a second metal layer. Vias extend from the second metal layer and through the first dielectric layer, and the vias are electrically coupled to the drain epitaxy semiconductor region.Type: GrantFiled: February 12, 2018Date of Patent: December 25, 2018Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wun-Jie Lin, Ching-Hsiung Lo, Jen-Chou Tseng, Han-Jen Yang, Arabinda Das
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Patent number: 10157905Abstract: An integrated circuit device includes at least two epitaxially grown active regions grown onto a substrate, the active regions being placed between a first gate device and a second gate device. The integrated circuit device includes at least one dummy gate between the two epitaxially grown active regions and between the first gate device and the second gate device, wherein each active region is substantially uniform in length. The first gate device and the second device are formed over a first well having a first conductivity type and the dummy gate is formed over a second well having a second conductivity type.Type: GrantFiled: August 7, 2017Date of Patent: December 18, 2018Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Wun-Jie Lin, Han-Jen Yang, Yu-Ti Su
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Publication number: 20180166437Abstract: A semiconductor device includes semiconductor fins on semiconductor strips on a substrate. The semiconductor fins are parallel to each other. A gate stack is over the semiconductor fins, and a drain epitaxy semiconductor region is disposed laterally from a side of the gate stack and on the semiconductor strips. A first dielectric layer is over the substrate, and the first dielectric layer has a first metal layer. A second dielectric layer is over the first dielectric layer, and the second dielectric layer has a second metal layer. Vias extend from the second metal layer and through the first dielectric layer, and the vias are electrically coupled to the drain epitaxy semiconductor region.Type: ApplicationFiled: February 12, 2018Publication date: June 14, 2018Inventors: Wun-Jie Lin, Ching-Hsiung Lo, Jen-Chou Tseng, Han-Jen Yang, Arabinda Das
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Publication number: 20180151554Abstract: An electrostatic discharge (ESD) protection device having a source region coupled to a first electrical node, a first drain region coupled to a second electrical node different from the first electrical node, and an extended drain region between the source region and the first drain region. The extended drain region includes a number N of electrically floating doped regions and a number M of gate regions coupled to the second electrical node, where N and M are integers greater than 1 and N is equal to M. Each electrically floating doped region of the N number of floating doped regions alternates with each gate region of the M number of gate regions.Type: ApplicationFiled: December 29, 2016Publication date: May 31, 2018Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Po-Lin PENG, Han-Jen YANG, Jam-Wem LEE, Li-Wei CHU
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Patent number: 9893052Abstract: A semiconductor device includes semiconductor fins on semiconductor strips on a substrate. The semiconductor fins are parallel to each other. A gate stack is over the semiconductor fins, and a drain epitaxy semiconductor region is disposed laterally from a side of the gate stack and on the semiconductor strips. A first dielectric layer is over the substrate, and the first dielectric layer has a first metal layer. A second dielectric layer is over the first dielectric layer, and the second dielectric layer has a second metal layer. Vias extend from the second metal layer and through the first dielectric layer, and the vias are electrically coupled to the drain epitaxy semiconductor region.Type: GrantFiled: July 18, 2016Date of Patent: February 13, 2018Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wun-Jie Lin, Ching-Hsiung Lo, Jen-Chou Tseng, Han-Jen Yang, Arabinda Das
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Publication number: 20180040603Abstract: An Electro-Static Discharge (ESD) protection circuit includes a plurality of groups of p-type heavily doped semiconductor strips (p+ strips) and a plurality of groups of n-type heavily doped semiconductor strips (n+ strips) forming an array having a plurality of rows and columns. In each of the rows and the columns, the plurality of groups of p+ strips and the plurality of groups of n+ strips are allocated in an alternating layout. The ESD protection circuit further includes a plurality of gate stacks, each including a first edge aligned to an edge of a group in the plurality of groups of p+ strips, and a second edge aligned to an edge of a group in the plurality of groups of n+ strips.Type: ApplicationFiled: October 19, 2017Publication date: February 8, 2018Inventors: Yu-Ti Su, Wun-Jie Lin, Han-Jen Yang, Shui-Ming Cheng, Ming-Hsiang Song
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Patent number: 9876005Abstract: An Electro-Static Discharge (ESD) protection circuit includes a plurality of groups of p-type heavily doped semiconductor strips (p+ strips) and a plurality of groups of n-type heavily doped semiconductor strips (n+ strips) forming an array having a plurality of rows and columns. In each of the rows and the columns, the plurality of groups of p+ strips and the plurality of groups of n+ strips are allocated in an alternating layout. The ESD protection circuit further includes a plurality of gate stacks, each including a first edge aligned to an edge of a group in the plurality of groups of p+ strips, and a second edge aligned to an edge of a group in the plurality of groups of n+ strips.Type: GrantFiled: June 2, 2016Date of Patent: January 23, 2018Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Ti Su, Han-Jen Yang, Wun-Jie Lin, Li-Wei Chu
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Publication number: 20170358569Abstract: An integrated circuit device includes at least two epitaxially grown active regions grown onto a substrate, the active regions being placed between a first gate device and a second gate device. The integrated circuit device includes at least one dummy gate between the two epitaxially grown active regions and between the first gate device and the second gate device, wherein each active region is substantially uniform in length. The first gate device and the second device are formed over a first well having a first conductivity type and the dummy gate is formed over a second well having a second conductivity type.Type: ApplicationFiled: August 7, 2017Publication date: December 14, 2017Inventors: Wun-Jie LIN, Han-Jen Yang, Yu-Ti Su
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Patent number: 9812436Abstract: An Electro-Static Discharge (ESD) protection circuit includes a plurality of groups of p-type heavily doped semiconductor strips (p+ strips) and a plurality of groups of n-type heavily doped semiconductor strips (n+ strips) forming an array having a plurality of rows and columns. In each of the rows and the columns, the plurality of groups of p+ strips and the plurality of groups of n+ strips are allocated in an alternating layout. The ESD protection circuit further includes a plurality of gate stacks, each including a first edge aligned to an edge of a group in the plurality of groups of p+ strips, and a second edge aligned to an edge of a group in the plurality of groups of n+ strips.Type: GrantFiled: September 3, 2015Date of Patent: November 7, 2017Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Ti Su, Wun-Jie Lin, Han-Jen Yang, Shui-Ming Cheng, Ming-Hsiang Song
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Patent number: 9728531Abstract: An integrated circuit device includes at least two epitaxially grown active regions grown onto a substrate, the active regions being placed between a first gate device and a second gate device. The integrated circuit device includes at least one dummy gate between the two epitaxially grown active regions and between the first gate device and the second gate device, wherein each active region is substantially uniform in length. The first gate device and the second device are formed over a first well having a first conductivity type and the dummy gate is formed over a second well having a second conductivity type.Type: GrantFiled: September 12, 2016Date of Patent: August 8, 2017Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Wun-Jie Lin, Han-Jen Yang, Yu-Ti Su
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Publication number: 20170098645Abstract: An Electro-Static Discharge (ESD) protection circuit includes a plurality of groups of p-type heavily doped semiconductor strips (p+ strips) and a plurality of groups of n-type heavily doped semiconductor strips (n+ strips) forming an array having a plurality of rows and columns. In each of the rows and the columns, the plurality of groups of p+ strips and the plurality of groups of n+ strips are allocated in an alternating layout. The ESD protection circuit further includes a plurality of gate stacks, each including a first edge aligned to an edge of a group in the plurality of groups of p+ strips, and a second edge aligned to an edge of a group in the plurality of groups of n+ strips.Type: ApplicationFiled: June 2, 2016Publication date: April 6, 2017Inventors: Yu-Ti Su, Han-Jen Yang, Wun-Jie Lin, Li-Wei Chu