Patents by Inventor Han Jun Bae
Han Jun Bae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11501350Abstract: An intermediary device for mediating a transaction of used heavy equipment may be provided. The intermediary device may provide a semitransparent photographing guideline including guidance on a photographing portion and a photographing angle for photographing a heavy equipment image on a heavy equipment portion basis to a sale terminal device. When the intermediary device receives heavy equipment sales request information including at least one of a nameplate image and a registration certificate image of the heavy equipment to be sold, an appearance image, first heavy equipment information, heavy equipment location information, and a desired sale price from the sale terminal device, the intermediary device may recognize at least one of the nameplate image and the registration certificate image to extract second heavy equipment information.Type: GrantFiled: December 24, 2018Date of Patent: November 15, 2022Inventors: Seok-Ho Bae, Han-Jun Bae, Hyun-Woong Bae
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Patent number: 11309303Abstract: A semiconductor package includes a substrate and a sub semiconductor package disposed over the substrate. The sub semiconductor package includes a sub semiconductor chip which has chip pads on its active surface facing the substrate, a sub molding layer which surrounds side surfaces of the sub semiconductor chip and has one surface facing the substrate, and redistribution conductive layers which are connected to the chip pads and extend over the one surface of the sub molding layer. The redistribution conductive layers include a signal redistribution conductive layer, which extends onto an edge of the sub molding layer and has a signal redistribution pad on its end portion, and a power redistribution conductive layer, which has a length shorter than a length of the signal redistribution conductive layer and has a power redistribution pad on its end portion.Type: GrantFiled: January 22, 2021Date of Patent: April 19, 2022Assignee: SK hynix Inc.Inventors: Ju Il Eom, Han Jun Bae, Seung Yeop Lee
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Patent number: 11270958Abstract: A semiconductor package includes: a sub semiconductor package disposed over a substrate, the sub semiconductor package including a sub semiconductor chip which has chip pads on its upper surface, a molding layer which surrounds side surfaces of the sub semiconductor chip, and a redistribution layer formed over the sub semiconductor chip and the molding layer, the redistribution layer including redistribution conductive layers which are connected to the chip pads of the sub semiconductor chip and extend onto edges of the molding layer while having redistribution pads on their end portions; first sub package interconnectors connected to the redistribution pads to electrically connect the sub semiconductor chip and the substrate; a capacitor formed in the molding layer and including a first electrode, a second electrode, and a body portion, the first and second electrodes having upper surfaces which are connected to the redistribution conductive layers, respectively.Type: GrantFiled: August 12, 2020Date of Patent: March 8, 2022Assignee: SK hynix Inc.Inventors: Ju Il Eom, Jin Kyoung Park, Han Jun Bae
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Publication number: 20220037304Abstract: A semiconductor package includes a substrate and a sub semiconductor package disposed over the substrate. The sub semiconductor package includes a sub semiconductor chip which has chip pads on its active surface facing the substrate, a sub molding layer which surrounds side surfaces of the sub semiconductor chip and has one surface facing the substrate, and redistribution conductive layers which are connected to the chip pads and extend over the one surface of the sub molding layer. The redistribution conductive layers include a signal redistribution conductive layer, which extends onto an edge of the sub molding layer and has a signal redistribution pad on its end portion, and a power redistribution conductive layer, which has a length shorter than a length of the signal redistribution conductive layer and has a power redistribution pad on its end portion.Type: ApplicationFiled: January 22, 2021Publication date: February 3, 2022Applicant: SK hynix Inc.Inventors: Ju Il EOM, Han Jun BAE, Seung Yeop LEE
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Publication number: 20210366847Abstract: A semiconductor package includes: a sub semiconductor package disposed over a substrate, the sub semiconductor package including a sub semiconductor chip which has chip pads on its upper surface, a molding layer which surrounds side surfaces of the sub semiconductor chip, and a redistribution layer formed over the sub semiconductor chip and the molding layer, the redistribution layer including redistribution conductive layers which are connected to the chip pads of the sub semiconductor chip and extend onto edges of the molding layer while having redistribution pads on their end portions; first sub package interconnectors connected to the redistribution pads to electrically connect the sub semiconductor chip and the substrate; a capacitor formed in the molding layer and including a first electrode, a second electrode, and a body portion, the first and second electrodes having upper surfaces which are connected to the redistribution conductive layers, respectively.Type: ApplicationFiled: August 12, 2020Publication date: November 25, 2021Applicant: SK hynix Inc.Inventors: Ju Il EOM, Jin Kyoung PARK, Han Jun BAE
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Publication number: 20210334869Abstract: An intermediary device for mediating a transaction of used heavy equipment may be provided. The intermediary device may provide a semitransparent photographing guideline including guidance on a photographing portion and a photographing angle for photographing a heavy equipment image on a heavy equipment portion basis to a sale terminal device. When the intermediary device receives heavy equipment sales request information including at least one of a nameplate image and a registration certificate image of the heavy equipment to be sold, an appearance image, first heavy equipment information, heavy equipment location information, and a desired sale price from the sale terminal device, the intermediary device may recognize at least one of the nameplate image and the registration certificate image to extract second heavy equipment information.Type: ApplicationFiled: December 24, 2018Publication date: October 28, 2021Inventors: Seok-Ho BAE, Han-Jun BAE, Hyun-Woong BAE
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Patent number: 9972568Abstract: A semiconductor package includes a molding member, a chip embedded in the molding member to have a warped shape, and connectors disposed in the molding member. The molding member includes an extendible material which includes a first part having a warped shape, a second part extending from one end of the first part to be flat, and a third part extending from the other end of the first part to be flat, where first surfaces of the connectors are exposed at a surface of the molding member and second surfaces of the connectors are coupled to the chip.Type: GrantFiled: September 28, 2017Date of Patent: May 15, 2018Assignee: SK hynix Inc.Inventors: Jong Hoon Kim, Han Jun Bae, Chan Woo Jeong
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Patent number: 9888567Abstract: A flexible device includes a first conductive pattern, a second conductive pattern, and a dielectric layer. The first conductive pattern includes a first sliding contact portion and a first extension portion. The second conductive pattern includes a second sliding contact portion overlapping with the first sliding contact portion and the second conductive pattern includes a second extension portion. The second sliding contact portion is in contact with the first sliding contact portion and is movable on the first sliding contact portion for a sliding motion. The first and second conductive patterns are embedded in the dielectric layer.Type: GrantFiled: January 7, 2016Date of Patent: February 6, 2018Assignee: SK hynix Inc.Inventors: Seung Yeop Lee, Joo Hyun Kang, Jong Hoon Kim, Han Jun Bae
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Publication number: 20180019188Abstract: A semiconductor package includes an extendible molding member, a chip embedded in the molding member to have a warped shape, and connectors disposed in the molding member. First surfaces of the connectors are exposed at a surface of the molding member, and second surfaces of the connectors are coupled to the chip.Type: ApplicationFiled: September 28, 2017Publication date: January 18, 2018Applicant: SK hynix Inc.Inventors: Jong Hoon KIM, Han Jun BAE, Chan Woo JEONG
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Patent number: 9847285Abstract: There may be provided a method of manufacturing a semiconductor package. The method may include disposing a first semiconductor device and through mold ball connectors (TMBCs) on a first surface of an interconnection structure layer, forming a molding layer on the first surface of the interconnection structure layer to expose a portion of each of the TMBCs, attaching outer connectors to the exposed portions of the TMBCs, mounting a second semiconductor device on a second surface of the interconnection structure layer opposite to the molding layer, and attaching a heat spreader to the second surface of the interconnection structure layer to overlap with a portion of the first semiconductor device.Type: GrantFiled: February 17, 2017Date of Patent: December 19, 2017Assignee: SK hynix Inc.Inventors: Ki Jun Sung, Jong Hoon Kim, Han Jun Bae
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Publication number: 20170352612Abstract: There may be provided a method of manufacturing a semiconductor package. The method may include disposing a first semiconductor device and through mold ball connectors (TMBCs) on a first surface of an interconnection structure layer, forming a molding layer on the first surface of the interconnection structure layer to expose a portion of each of the TMBCs, attaching outer connectors to the exposed portions of the TMBCs, mounting a second semiconductor device on a second surface of the interconnection structure layer opposite to the molding layer, and attaching a heat spreader to the second surface of the interconnection structure layer to overlap with a portion of the first semiconductor device.Type: ApplicationFiled: February 17, 2017Publication date: December 7, 2017Applicant: SK hynix Inc.Inventors: Ki Jun SUNG, Jong Hoon KIM, Han Jun BAE
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Patent number: 9806015Abstract: A semiconductor package includes first bump pads on a first surface of an interconnection structure layer, elevated pads thicker than the first bump pads on the first surface of the interconnection structure layer, a first semiconductor device connected on the first bump pads, through mold ball connectors connected on the elevated pads, respectively, a molding layer disposed covering the first surface of the interconnection structure layer to expose a portion of each of the through mold ball connectors, outer connectors respectively attached to the through mold ball connectors, and a second semiconductor device on a second surface of the interconnection structure layer opposite to the molding layer.Type: GrantFiled: January 30, 2017Date of Patent: October 31, 2017Assignee: SK hynix Inc.Inventors: Ki Jun Sung, Jong Hoon Kim, Han Jun Bae
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Patent number: 9806016Abstract: A semiconductor package includes an extendible molding member, a chip embedded in the molding member to have a warped shape, and connectors disposed in the molding member. First surfaces of the connectors are exposed at a surface of the molding member, and second surfaces of the connectors are coupled to the chip.Type: GrantFiled: March 14, 2016Date of Patent: October 31, 2017Assignee: SK hynix Inc.Inventors: Jong Hoon Kim, Han Jun Bae, Chan Woo Jeong
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Publication number: 20170148708Abstract: A semiconductor package includes an extendible molding member, a chip embedded in the molding member to have a warped shape, and connectors disposed in the molding member. First surfaces of the connectors are exposed at a surface of the molding member, and second surfaces of the connectors are coupled to the chip.Type: ApplicationFiled: March 14, 2016Publication date: May 25, 2017Inventors: Jong Hoon KIM, Han Jun BAE, Chan Woo JEONG
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Patent number: 9659833Abstract: A semiconductor package includes an adhesive member disposed on a package substrate to have a trapezoid cross-section view, and a semiconductor chip disposed on the adhesive member and attached to the package substrate by the adhesive member. The semiconductor chip has a first surface and a second surface facing the first surface, and the second surface of the semiconductor chip contacts the adhesive member. The semiconductor chip includes a tension supplement pattern attached to the second surface and spaced apart from the package substrate.Type: GrantFiled: July 24, 2015Date of Patent: May 23, 2017Assignee: SK hynix Inc.Inventors: Dae Woong Lee, Tae Min Kang, Han Jun Bae
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Publication number: 20170064832Abstract: A flexible device includes a first conductive pattern, a second conductive pattern, and a dielectric layer. The first conductive pattern includes a first sliding contact portion and a first extension portion. The second conductive pattern includes a second sliding contact portion overlapping with the first sliding contact portion and the second conductive pattern includes a second extension portion. The second sliding contact portion is in contact with the first sliding contact portion and is movable on the first sliding contact portion for a sliding motion. The first and second conductive patterns are embedded in the dielectric layer.Type: ApplicationFiled: January 7, 2016Publication date: March 2, 2017Inventors: Seung Yeop Lee, Joo Hyun Kang, Jong Hoon Kim, Han Jun Bae
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Publication number: 20170033081Abstract: A stack package may include a substrate, and a first semiconductor chip mounted over the substrate. The stack package may include a support member disposed over the substrate and the first semiconductor chip, and spaced apart from the substrate and the first semiconductor chip. The stack package may include a plurality of second semiconductor chips stacked over the support member.Type: ApplicationFiled: October 28, 2015Publication date: February 2, 2017Inventors: Je Sik YOO, Jong Hyun KIM, Yo Seph JEONG, Han Jun BAE
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Patent number: 9543384Abstract: A semiconductor device includes a substrate, an elastic buffer layer disposed on a surface of the substrate, wiring patterns disposed on a first surface of the elastic buffer layer, and a semiconductor chip disposed on a second surface of the elastic buffer layer facing away from the first surface of the elastic buffer layer. The semiconductor chip includes trenches formed on a surface facing the elastic buffer layer. Interconnection members are disposed to electrically connect the elastic buffer layer to the substrate. Each of the interconnection members has one end electrically connected to one of the wiring patterns and the other end electrically connected to the substrate.Type: GrantFiled: September 10, 2015Date of Patent: January 10, 2017Assignee: SK HYNIX INC.Inventors: Han Jun Bae, Won Duck Jung
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Publication number: 20160254251Abstract: A semiconductor device includes a substrate, an elastic buffer layer disposed on a surface of the substrate, wiring patterns disposed on a first surface of the elastic buffer layer, and a semiconductor chip disposed on a second surface of the elastic buffer layer facing away from the first surface of the elastic buffer layer. The semiconductor chip includes trenches formed on a surface facing the elastic buffer layer. Interconnection members are disposed to electrically connect the elastic buffer layer to the substrate. Each of the interconnection members has one end electrically connected to one of the wiring patterns and the other end electrically connected to the substrate.Type: ApplicationFiled: September 10, 2015Publication date: September 1, 2016Inventors: Han Jun BAE, Won Duck JUNG
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Publication number: 20160211188Abstract: A semiconductor package includes an adhesive member disposed on a package substrate to have a trapezoid cross-section view, and a semiconductor chip disposed on the adhesive member and attached to the package substrate by the adhesive member. The semiconductor chip has a first surface and a second surface facing the first surface, and the second surface of the semiconductor chip contacts the adhesive member. The semiconductor chip includes a tension supplement pattern attached to the second surface and spaced apart from the package substrate.Type: ApplicationFiled: July 24, 2015Publication date: July 21, 2016Inventors: Dae Woong LEE, Tae Min KANG, Han Jun BAE