Abstract: A polypropylene composite resin composition and an automotive interior part molded using the polypropylene composite resin composition are provided herein. The polypropylene composite resin composition contains: (a) an easily injection moldable polypropylene polymer, (b) a thermoplastic elastomer for improving impact resistance, (c) a platy inorganic filler surface-treated with an organosilane having affinity for a phytoncide, (d) a phytoncide having deodorizing capability and aromaticity, (e) a processing oil preventing pyrolysis of the phytoncide, and (f) a surfactant for improving the compatibility between the base resin and the phytoncide at specific compositional ratios. The automotive interior part molded using the polypropylene composite resin composition disclosed herein provides a pleasant environment for drivers by removing the offensive odor from volatile organic compounds (VOCs), etc. and maintaining the intrinsic scent of the phytoncide for a long time.

Abstract: A composition of polypropylene composite resin having high impact strength and high adhesion is provided. The composition of polypropylene composite resin having high impact strength and high adhesion can largely enhance base adhesion and impact resistance due to a high friction coefficient while providing a similar mechanical property to the related art. The compositions provided herein include mixing a polypropylene polymer, a polyethylene resin composition, and a thermoplastic elastomer, a silane-based propylene polymer, and an inorganic filler as main components at a specific content ratio. The compositions have advantages including process simplification, cost reduction, and eco-friendly without a separate adhering process. Such compositions can be used for interior components such as sun visors, door trims, pillar trims of vehicles and various other industrial components and materials.

Abstract: A low gloss ASA-based resin composition having excellent weatherability and heat resistance is provided. The low gloss ASA-based resin composition is obtained by blending a general SAN copolymer, a heat-resistant SAN copolymer, a crosslinked aromatic vinyl compound-cyanide vinyl compound copolymer, and an amorphous inorganic material with large diameter and extra-large diameter ASA graft copolymers at a predetermined composition ratio. The low gloss ASA-based resin composition is useful in the manufacture of a high-quality molded article in which gloss characteristics are uniformly exhibited because impact resistance, heat resistance, flowability, weatherability, and low gloss characteristics are all excellent, and particularly, the gloss deviation on the entire surface of the injection molded article is significantly reduced.

Abstract: A semiconductor device and a method of fabricating the same are provided. The semiconductor device includes a multi-channel active pattern including germanium and an inner region and an outer region, the outer region formed along a profile of the inner region, and a germanium fraction of the outer region being smaller than a germanium fraction of the inner region. A gate electrode intersects the multi-channel active pattern.

Abstract: A composition of polypropylene composite resin having high impact strength and high adhesion is provided. The composition of polypropylene composite resin having high impact strength and high adhesion can largely enhance base adhesion and impact resistance due to a high friction coefficient while providing a similar mechanical property to the related art. The compositions provided herein include mixing a polypropylene polymer, a polyethylene resin composition, and a thermoplastic elastomer, a silane-based propylene polymer, and an inorganic filler as main components at a specific content ratio. The compositions have advantages including process simplification, cost reduction, and eco-friendly without a separate adhering process. Such compositions can be used for interior components such as sun visors, door trims, pillar trims of vehicles and various other industrial components and materials.

Abstract: Compositions of high-rigid polypropylene composite resin are provided herein. Such compositions having excellent tactile sensation and dimensional stability, and more particularly, the compositions of polypropylene composite resin having excellent tactile sensation such as thermoplastic rubber, excellent impact strength and rigidity, and low shrinkage anisotropy. The compositions of polypropylene composite resin provided herein also have excellent impact strength and rigidity as well as excellent tactile sensation such as a thermoplastic rubber and low shrinkage anisotropy. Thus, they exhibit excellent moldability and the compositions can be molded into a vehicle component. Furthermore, the compositions of polypropylene composite resin have excellent tactile sensation and can be used as a high-quality material that does not require separate painting and maintains excellent physical properties and dimensional stability as a vehicle component.

Abstract: An integrated circuit device as provided herein may include a device region and an inter-device isolation region. Within the device region, a fin-type active region may protrude from a substrate, and opposite sidewalls of the fin-type active region may be covered by an inner isolation layer. An outer isolation layer may fill an outer deep trench in the inter-device isolation region. The inner isolation layer may extend away from the device region at an inner sidewall of the outer deep trench and into the inter-device isolation region. There may be multiple fin-type active regions, and trenches therebetween. The outer deep trench and the trenches between the plurality of fin-type active regions may be of different heights. The integrated circuit device and methods of manufacturing described herein may reduce a possibility that various defects or failures may occur due to an unnecessary fin-type active region remaining around the device region.

Abstract: A polypropylene resin composition, particularly, an olefin-based polypropylene resin composition includes: about 50 to 70% by weight of a high crystalline polypropylene; about 10 to 20% by weight of a reactor made thermoplastic polyolefin (RTPO) polypropylene; about 5 to 20% by weight of an inorganic filler; about 10 to 20% by weight of a rubber elastomer; and about 3% by weight or less of a slip agent, based on the total weight of the composition. The composition provides excellent physical properties such as high strength and impact resistance, and thus superior resistance to damage, and shows low gloss characteristics and excellent fluidity. The polypropylene resin composition is used as interior and exterior materials for vehicles.

Abstract: A plasma processing apparatus includes a susceptor, a chamber housing that accommodates the susceptor and encloses a reaction space, and an annular shaped baffle plate that annularly surrounds the susceptor. The baffle plate includes a first layer that includes a conductive material and a second layer that includes a non-conductive material, and the second layer is closer to the reaction space than the first layer.

Abstract: A method of manufacturing a semiconductor device includes forming a first plurality of recessed regions in a substrate, the substrate having a protruded active region between the first plurality of recessed regions and the protruded active region having an upper surface and a sidewall, forming a device isolation film in the first plurality of recessed regions, the device isolation film exposing the upper surface and an upper portion of the sidewall of the protruded active region, and performing a first plasma treatment on the exposed surface of the protruded active region, wherein the plasma treatment is performed using a plasma gas containing at least one of an inert gas and a hydrogen gas in a temperature of less than or equal to about 700° C.

Abstract: A chemical resistant polymer composition for a center fascia includes a resin composition consisting of 10 to 20% by weight of a polyester copolymer containing a residue of a dicarboxylic acid component containing terephthalic acid and a residue of a diol component containing dianhydrohexitoll; 15 to 25% by weight of polytrimethyleneterephthalate; 10 to 20% by weight of one or more copolymers selected from the group consisting of an unsaturated nitrile-diene-based rubber-aromatic vinyl graft copolymer, an alkylmethacrylate-diene-based rubber-aromatic vinyl graft copolymer, and an alkylmethacrylate-silicone/alkylacrylate graft copolymer; and 50 to 65% by weight of polycarbonate based on the weight of the resin composition. The polymer composition further comprises 0.1 to 10 parts by weight of a phosphite-based antioxidant, based on 100 parts by weight of the resin composition.

Abstract: A method of manufacturing a semiconductor device includes forming a first plurality of recessed regions in a substrate, the substrate having a protruded active region between the first plurality of recessed regions and the protruded active region having an upper surface and a sidewall, forming a device isolation film in the first plurality of recessed regions, the device isolation film exposing the upper surface and an upper portion of the sidewall of the protruded active region, and performing a first plasma treatment on the exposed surface of the protruded active region, wherein the plasma treatment is performed using a plasma gas containing at least one of an inert gas and a hydrogen gas in a temperature of less than or equal to about 700.

Abstract: Disclosed is a resin composition for forming a steering wheel remote control bezel. The resin composition comprises: an amount of about 40 to 50 wt % of a polyester copolymer including a dicarboxylic acid component residue including terephthalic acid and a diol component residue including dianhydrohexitol; an amount of about 10 to 20 wt % of at least one copolymer selected from a group consisting of unsaturated nitrile-diene-based rubber-aromatic vinyl grafted copolymers and alkylmethacrylate-diene-based rubber-aromatic vinyl grafted copolymers; and an amount of about 40 to 50 wt % of polycarbonate. Further, an amount of 0.1 to 0.5 parts by weight of a phosphate base antioxidant-based on 100 parts by weight of the resin composition is further added to the resin composition.

Abstract: A semiconductor device and a method of fabricating the same are provided. The semiconductor device includes a multi-channel active pattern including germanium and an inner region and an outer region, the outer region formed along a profile of the inner region, and a germanium fraction of the outer region being smaller than a germanium fraction of the inner region. A gate electrode intersects the multi-channel active pattern.

Abstract: A substrate treating method may be performed by a plasma treating apparatus. The substrate treating method may include: providing a substrate on a platform in a lower portion of an inner space of a process chamber; directing a first process gas upward from a first nozzle formed at an inner wall of the process chamber into an upper portion of the inner space, the first process gas being an inert gas and wherein the first nozzle is an obliquely upward-oriented nozzle structured to direct the first process gas upward; directing a second process gas downward from a second nozzle formed at a inner wall of the process chamber into a lower portion of the inner space, the second process gas being hydrogen gas and wherein the second nozzle is an obliquely downward-oriented nozzle structured to direct the second process gas downward; and applying a microwave to the upper portion of the inner space to excite the first process gas and the second process gas into plasma, and then processing the substrate.

Abstract: A substrate treating method may be performed by a plasma treating apparatus. The substrate treating method may include: providing a substrate on a platform in a lower portion of an inner space of a process chamber; directing a first process gas upward from a first nozzle formed at an inner wall of the process chamber into an upper portion of the inner space, the first process gas being an inert gas and wherein the first nozzle is an obliquely upward-oriented nozzle structured to direct the first process gas upward; directing a second process gas downward from a second nozzle formed at a inner wall of the process chamber into a lower portion of the inner space, the second process gas being hydrogen gas and wherein the second nozzle is an obliquely downward-oriented nozzle structured to direct the second process gas downward; and applying a microwave to the upper portion of the inner space to excite the first process gas and the second process gas into plasma, and then processing the substrate.

Abstract: A chemical resistant polymer resin composition for an overhead console includes a polyester resin including a residue of a dicarboxylic acid component containing terephthalic acid and a residue of a diol component containing 5 to 60 mol % of isosorbide, 5 to 80 mol % of cyclohexanedimethanol, and a residual amount of other diol compounds; polycarbonate; and an unsaturated nitrile-aromatic vinyl-alkylacrylate graft copolymer based on the total weight of the polyester resin, polycarbonate, and unsaturated nitrile-aromatic vinyl-alkylacrylate graft copolymer. The composition further includes 0.1 to 10 parts by weight of a weather resistant additive, based on 100 parts by weight of the polyester resin, polycarbonate, and unsaturated nitrile-aromatic vinyl-alkylacrylate graft copolymer.

Abstract: A chemical resistant polymer composition for a center fascia includes a resin composition consisting of 10 to 20% by weight of a polyester copolymer containing a residue of a dicarboxylic acid component containing terephthalic acid and a residue of a diol component containing dianhydrohexitoll; 15 to 25% by weight of polytrimethyleneterephthalate; 10 to 20% by weight of one or more copolymers selected from the group consisting of an unsaturated nitrile-diene-based rubber-aromatic vinyl graft copolymer, an alkylmethacrylate-diene-based rubber-aromatic vinyl graft copolymer, and an alkylmethacrylate-silicone/alkylacrylate graft copolymer; and 50 to 65% by weight of polycarbonate based on the weight of the resin composition. The polymer composition further comprises 0.1 to 10 parts by weight of a phosphite-based antioxidant, based on 100 parts by weight of the resin composition.

Abstract: A semiconductor device includes a substrate, an isolation layer on the substrate, and at least one active fin on the substrate. The isolation layer includes a first surface opposite a second surface. The first surface is contiguous with the substrate. The at least one active fin protrudes from the substrate and includes a first region having a side wall above the second surface of the isolation layer and a second region on the first region. The second region has an upper surface. The first region has a first width contiguous with the second surface of the isolation layer and a second width contiguous with the second region. The second width is 60% or greater than the first width (e.g., 60% to 100%).

Abstract: A substrate treating method may be performed by a plasma treating apparatus. The substrate treating method may include: providing a substrate on a platform in a lower portion of an inner space of a process chamber; directing a first process gas upward from a first nozzle formed at an inner wall of the process chamber into an upper portion of the inner space, the first process gas being an inert gas and wherein the first nozzle is an obliquely upward-oriented nozzle structured to direct the first process gas upward; directing a second process gas downward from a second nozzle formed at a inner wall of the process chamber into a lower portion of the inner space, the second process gas being hydrogen gas and wherein the second nozzle is an obliquely downward-oriented nozzle structured to direct the second process gas downward; and applying a microwave to the upper portion of the inner space to excite the first process gas and the second process gas into plasma, and then processing the substrate.