Abstract: Disclosed herein is a multi-planar circuit board, as well as related structures and methods. In an embodiment, a circuit board may include a first surface, a first section having the first surface in a first plane, a second section having the first surface in a second plane, and a third section connecting the first and second sections, where the third section defines a gradient between the first and second planes, and where all sections are sections within a contiguous board. In another embodiment, circuit board may further include a first component having a first thickness coupled on the first face of the first section, and a second component having a second thickness, greater than the first component, coupled on the first face of the second section, where the second section is in a lower plane, and where the overall thickness is the circuit board thickness plus the second thickness.

Abstract: Techniques are provided for managing power delivery to multiple universal serial bus (USB) type-C ports of a desktop computer system. In an example, a method can include providing a first power level to a USB power delivery controller during a non-sleep mode operation of the desktop computer, and providing a second power level to the USB power delivery controller when the computer is in a sleep mode, the second power level configured to provide default charge power to a connected device when the computer is in the sleep mode.

Abstract: Techniques are provided for managing power delivery to multiple universal serial bus (USB) type-C ports of a desktop computer system. In an example, a method can include providing a first power level to a USB power delivery controller during a non-sleep mode operation of the desktop computer, and providing a second power level to the USB power delivery controller when the computer is in a sleep mode, the second power level configured to provide default charge power to a connected device when the computer is in the sleep mode.

Abstract: Disclosed herein is a multi-planar circuit board, as well as related structures and methods. In an embodiment, a circuit board may include a first surface, a first section having the first surface in a first plane, a second section having the first surface in a second plane, and a third section connecting the first and second sections, where the third section defines a gradient between the first and second planes, and where all sections are sections within a contiguous board. In another embodiment, circuit board may further include a first component having a first thickness coupled on the first face of the first section, and a second component having a second thickness, greater than the first component, coupled on the first face of the second section, where the second section is in a lower plane, and where the overall thickness is the circuit board thickness plus the second thickness.

Abstract: A three capacitor stack and associated methods are shown. An exemplary capacitor device may include a first capacitor stack that includes a first plurality of layers of reference electrodes interleaved with first capacitor electrodes, a second capacitor stack on the first capacitor stack that includes a second plurality of layers of reference electrodes interleaved with second capacitor electrodes, and a third capacitor stack on the second capacitor stack that includes a reference electrode and a third capacitor electrode. A respective layer of dielectric material is formed between the reference electrodes and the first capacitor electrodes, the second capacitor electrodes, and the third capacitor electrode.

Abstract: A three capacitor stack and associated methods are shown. An exemplary capacitor device may include a first capacitor stack that includes a first plurality of layers of reference electrodes interleaved with first capacitor electrodes, a second capacitor stack on the first capacitor stack that includes a second plurality of layers of reference electrodes interleaved with second capacitor electrodes, and a third capacitor stack on the second capacitor stack that includes a reference electrode and a third capacitor electrode. A respective layer of dielectric material is formed between the reference electrodes and the first capacitor electrodes, the second capacitor electrodes, and the third capacitor electrode.

Abstract: Methods, apparatuses, and systems may provide for regulating the system voltage in a mobile device by utilizing a bypass switch as a linear control circuit. A second switch is connected an output of a first switch and to a voltage control circuit. The linear control circuit detects a system voltage and compares the detected system voltage to a reference voltage. The linear control circuit will fully turn on the second switch when the system voltage is below the voltage threshold set by the reference voltage. However, when the system voltage exceeds the set voltage threshold, the second switch will automatically clamp the system voltage to remain at the voltage that is set by reference voltage.