Abstract: The method of manufacturing a copper foil with a high elongation rate includes: preparing a plating solution by mixing a copper ion, an additive for improving conductivity, a plating inhibitor, and a plating accelerator; and manufacturing the copper foil by immersing a substrate in the plating solution and applying an electric current to the plating solution to electroplate the copper foil on a surface of the substrate.

Abstract: An ultra-micro electrode that performs electrochemical analysis and a method of manufacturing the same is provided. The method includes preparing an insulating member having a capillary shape with a hollow region, preparing a conductive wire including a conductive material with an oxidation resistance greater than an oxidation resistance of copper, inserting the conductive wire into the hollow region of the insulating member, manufacturing half-finished products by applying heat and an external force to the insulating member having the conductive wire inserted therein to stretch the insulating member and the conductive wire so that a central portion of the insulating member is thin and the insulating member and the conductive wire are ruptured at central portions thereof, forming a groove by etching the conductive wire located on a ruptured surface of each half-finished product, and forming a filling layer by filling the groove with a conductive material by a plating process.

Abstract: The electroplating apparatus for surface modification of pipes includes: a housing comprising an inner space accommodating an electrode, a plating solution, and a pipe therein, and a plating solution inlet disposed on a lower surface of the housing and allowing the plating solution to be injected therethrough; a plating auxiliary part disposed inside the housing, vertically fixing the pipe inserted into the housing, and guiding the plating solution injected into the housing to flow toward an upper portion of the housing; and an auxiliary support part disposed inside the housing, spacing the plating auxiliary part and the plating solution inlet apart from each other by a predetermined distance, and guiding the plating solution introduced through the plating solution inlet to flow in a direction, where the plating auxiliary part is disposed.

Abstract: A method of manufacturing a multilayer metal plate by electroplating includes a first forming operation of forming one of a first metal layer and a second metal layer on a substrate by electroplating, wherein the second metal layer is less recrystallized than the first metal layer, the second metal layer is comprised of nanometer-size grains, and the second metal layer has a higher level of tensile strength than the first metal layer; and a second forming operation of forming, by electroplating, a third metal layer not formed in the first forming operation on a surface of one of the first metal layer and the second metal layer formed in the first forming operation.

Abstract: The multilayer copper foil includes: a recrystallization active layer disposed on a surface of a substrate; and a recrystallization suppressing layer disposed on a surface of the recrystallization active layer to inhibit recrystallization of the recrystallization active layer, wherein a concentration of impurities within the recrystallization suppressing layer is greater than a concentration of impurities within the recrystallization active layer.