Abstract: A leadframe (300) for use in semiconductor devices, comprising an assembly pad (3010 having rectangular sides, the pad extending, on one pad side (301b), into a lead (302) and, on the opposite pad side (301a), into straps (350) oriented normal to the side (301a) and anchored in adjacent tie bars (313), strap surfaces having recesses (501, 502) suitable for interlocking with packaging materials. The leadframe further includes a plurality of leads (303) parallel to and alternating with the straps.

Abstract: A semiconductor system (900) has a flat interposer (510) with a first surface (401a) in a first plane, a second surface (401b) in a parallel second plane, and a uniform first height (401) between the surfaces; the interposer is patterned in metallic zones separated by gaps (412, 415), the zones include metal of the first height and metal of a second height (402) smaller than the first height; an insulating material fills the gaps and the zone differences between the first and the second heights. Semiconductor chips of a first (610) and a second (611) set have first terminals attached to metallic zones of the first interposer surface while the chips of the second set have their second terminals facing away from the interposer. A first leadframe (700) is attached to the second terminals of the second set chips, and a second leadframe (800) is attached to respective metallic zones of the second interposer surface.

Abstract: An integrated circuit (IC) package including a bottom leadframe, an interposer mounted on the bottom leadframe, a flipchip die mounted on the interposer and a top leadframe electrically connected to the interposer. Also, a method of making an integrated circuit (IC) package including electrically and physically attaching a die to an interposer, attaching the interposer to a bottom leadframe, attaching a discrete circuit component to the interposer and attaching a top leadframe to the bottom leadframe.