Abstract: Disclosed is a light-emitting module, comprising: a circuit board, a conductive layer, a light-emitting device, and an adhesive material. The circuit board comprises a device-attachment area, the conductive layer being disposed on the device-attachment area, the light-emitting device being disposed on the conductive layer and electrically connected to the circuit board through the conductive layer, and the adhesive layer being used for connecting the light-emitting device to the circuit board, wherein a curing temperature of the adhesive layer is lower than a melting point of the conductive layer. Adopting the aforementioned technical means, the degree of offset in the position of the light-emitting device after reflow soldering can be greatly reduced. In addition, a vehicle lamp device using the light-emitting module is also provided.

Abstract: Disclosed is a light-emitting module, comprising: a circuit board, a conductive layer, a light-emitting device, and an adhesive material. The circuit board comprises a device-attachment area, the conductive layer being disposed on the device-attachment area, the light-emitting device being disposed on the conductive layer and electrically connected to the circuit board through the conductive layer, and the adhesive layer being used for connecting the light-emitting device to the circuit board, wherein a curing temperature of the adhesive layer is lower than a melting point of the conductive layer. Adopting the aforementioned technical means, the degree of offset in the position of the light-emitting device after reflow soldering can be greatly reduced. In addition, a vehicle lamp device using the light-emitting module is also provided.

Abstract: Disclosed is a light-emitting module, comprising: a circuit board, a conductive layer, a light-emitting device, and an adhesive material. The circuit board comprises a device-attachment area, the conductive layer being disposed on the device-attachment area, the light-emitting device being disposed on the conductive layer and electrically connected to the circuit board through the conductive layer, and the adhesive layer being used for connecting the light-emitting device to the circuit board, wherein a curing temperature of the adhesive layer is lower than a melting point of the conductive layer. Adopting the aforementioned technical means, the degree of offset in the position of the light-emitting device after reflow soldering can be greatly reduced. In addition, a vehicle lamp device using the light-emitting module is also provided.

Abstract: Disclosed is a light-emitting module, comprising: a circuit board, a conductive layer, a light-emitting device, and an adhesive material. The circuit board comprises a device-attachment area, the conductive layer being disposed on the device-attachment area, the light-emitting device being disposed on the conductive layer and electrically connected to the circuit board through the conductive layer, and the adhesive layer being used for connecting the light-emitting device to the circuit board, wherein a curing temperature of the adhesive layer is lower than a melting point of the conductive layer. Adopting the aforementioned technical means, the degree of offset in the position of the light-emitting device after reflow soldering can be greatly reduced. In addition, a vehicle lamp device using the light-emitting module is also provided.

Abstract: A casing includes a main body, a silicone rubber layer, and a bonding layer. The main body is made of magnesium alloy. The bonding layer is bonded between the main body and the silicone rubber layer. The bonding layer includes about 12 to about 30 by percentage weight of silane coupling agent.

Abstract: A casing includes a main body, a silicone rubber layer, and a bonding layer. The main body is made of magnesium alloy. The bonding layer is bonded between the main body and the silicone rubber layer. The bonding layer includes about 12 to about 30 by percentage weight of silane coupling agent.

Abstract: A method for manufacturing an insert-molded cover for electronic devices, including manufacturing a metallic body, processing the metallic body by a chemical method and forming an oxide film on a surface of the metallic body, and molding a plastic antenna lid on the metallic body by insert molding so that the plastic antenna lid is attached on the oxide film.

Abstract: The present invention relates to an improved glued light core for a light-emitting diode (LED), which provides an optical lamp body integrally formed on an upper end of an LED lead frame. In particular, the optical lamp body is designed as a glued structure with minimal epoxy, to simplify a complicated packaging operation in a conventional manufacturing process, to directly fasten a crystal cup, a crystal cell and a conductive gold wire to the upper end of the lead frame by the epoxy, and to provide illumination comparable to that of general light core. Additionally, a light-emitting housing is made of polychloroprene or plastic resin which is able to be applied or injected outside the glued light core, such that a light source inside the glued light core emits light beams through the light-emitting housing to form collection or stray lights of a special light source with multiple variations. Thus, the manufacturing process and multiple applications of the LED can be greatly simplified.

Abstract: The present invention relates to a pre-molded LED light bulb package with its main improvements being: the chip and gold wire outside the chip cup at the top of the traditional conducting bracket is covered with an appropriate quantity of epoxy resin colloid and then baked to form an oblate spheroid, which is inserted into the mold and filled with injection PC or ordinary resin to rapidly condense into LED enclosure package, wherein the special effect of multiple amplified or integrated light source whereby the light source is amplified internally and then gathered externally can be achieved by means of an internal optical amplifying light source effect through the pre-molded oblate spheroid and the convex or concave structure on the upper part of the external injection molded LED enclosure, significantly improving the existing single lighting deflection technology, therefore reducing the time of the packaging process and increasing the output capacity of mass production significantly.

Abstract: The present invention relates to a double layer injection mould LED bulb, in which the main improvements are: the epoxy resin light body at the top of the conducting bracket of a traditional LED light is specially designed as one epoxy resin injection mould body integrated with a PC or injection mould shell; two positioning grooves are provided on the right and left of the opening at the lower part of the shell so that the two shoulders of the conducting bracket may slide into the grooves for positioning and a small quantity of injection mould body may be condensed and moulded shortly after injection.

Abstract: A method for manufacturing an insert-molded cover for electronic devices, including manufacturing a metallic body, processing the metallic body by a chemical method and forming an oxide film on a surface of the metallic body, and molding a plastic antenna lid on the metallic body by insert molding so that the plastic antenna lid is attached on the oxide film.

Abstract: An exemplary insert-molded cover (10) for electronic devices includes a metallic body (11), a plastic antenna lid (12) integrally formed with the metallic body and an oxide film (12) formed on a surface (111) of the metallic body for attaching the plastic antenna lid. The present invention also relates a method for manufacturing the insert-molded cover for electronic devices.

Abstract: The present invention relates to a lamp of replaceable LED, comprising the lamp cover, translucent board, reflective frame, conducting plate, circuit board, LED lamp, lamp seat, copper head and a plurality of connecting screws, and in particular to one wherein the reflective frame is provided with equally spaced semicircle lamp cups, the lamp cups are provided with connected cross ring grooves for embedding and fastening of the convex plate above the conducting plate and embedding of the positive and negative conducting brackets of the LED lamp into the cross ring grooves in the lamp cups to form the weld-free rapid pressing device with the convex plate above the conducting plate so as to achieve the integrated stable conducting effect, prevent the quality of chips from being undermined due to traditional direct solder fusion and provide the convenience of replacing the LED lamp rapidly.

Abstract: The present invention relates to a LED bracket weld-free plug-in lamp, comprising the lamp cover, lamp seat, circuit board, two conducting brackets, chips, conducting wires, transparent adhesive tapes and copper heads, wherein a cross ring groove is provided at the center of the lamp seat for embedding and fastening of the circuit board so that the two conducting brackets are pressed in and inserted and the positive and negative plates on the two sides of the circuit board press tightly into one to stabilize the conducting effect, prevent the quality of chips from being undermined due to traditional direct solder fusion and significantly extend the service life of the LED chips.

Abstract: The present invention relates to a multi-facet light source LED lamp, comprising the lamp cap, lamp base, circuit board, conductive pin and a plurality of LED conducting brackets; the main improvements including: the circuit board may be welded with more than two sets of LED conducting brackets, forming a single lamp with a plurality of light sources; furthermore, the center of the upper end of the outer LED conducting brackets is designed toward the taper angle surface, making the outer chips generating a upward taper surface coalescence center and emit light intensively to the conducting brackets; and through the staggered radiators at the bottom of the conducting brackets, the heat of the chips at the top is transferred rapidly downward to the doubled area of contact surface of radiators so that the heat is diffused rapidly.

Abstract: The present invention relates to a single multi-facet light source LED bracket and in particular to one that departs from the traditional structure of single spot gathering chip cup lighting, the main improvements including: the epoxy resin or silicon cover is provided with 2 to 3 sets of positive/negative conducting brackets opposite to each other, the side of the left/right conducting brackets extend to present a trapezoidal block surface for fastening 3 equally spaced chips connected in series for lighting. The central conducting bracket extends upward to present a trapezoidal block surface and the design in which the 3 equally spaced chips are fastened and connected in series for upward lighting. The structure is provided to achieve the industrial application of a single multi-facet uniform lighting source LED bracket.

Abstract: The present invention relates to a conducting bracket that can be bridged for expansion of multi-facet lighting chips, comprising a plurality of conducting brackets, a plurality of chips, a plurality of conducting wires, a plurality of fluorescent layers and sealing blocks, the main improvements including: a third conducting bracket is provided in addition to the 2 traditional conducting brackets, the 3rd conducting bracket enables serial connection and bridging of lighting chips of different blocks for expansion of 2-facet, 3-facet, 4-facet (and above) serial connection and lighting function of chips of different blocks, wherein the surface of the chips of the blocks is covered with the fluorescent layer by design to allow the chips to provide the choices of color system effects of different light sources and achieve the industrial application of a single LED bridged for expansion of multi-facet lighting sources.

Abstract: The present invention relates to a multi-loop parallel and serial application chip bracket, comprising a substrate, a plurality of chips, a plurality of conducting wires, positive and negative conducting brackets, a plurality of fluorescent layers and transparent adhesive tape and in particular one in which a pair of positive and negative conducting brackets are designed on both sides of the substrate for the placement of a plurality of conducting wires for a plurality of chips on the front side and back side for serial connection of the positive and negative conducting brackets on the two sides, therefore offering the single serial and parallel lighting effect of the front side and back side, wherein at least one pair of positive and negative conducting brackets may be added on the two sides of the substrate to realize the multi-stage single serial and parallel alternative switching cyclic permanent illuminating lighting control function and achieve the industrial application of the multi-facet chip loop int

Abstract: The present invention relates to a two-section light rack and in particular to one in which the light rack bracket adopts the combined structure whereby the upper section and lower section are made of different materials, the main improvements being: the lower section of the light rack of the general LED bracket is bent in the reverse direction for embedding, clamping and positioning of the upper end of the other conducting pin and insulating resin is used to seal the I body at the bottom of the lamp body to form the light stud. As the conducting pin is made of red copper and bronze of good conductivity, the use of copper at the bracket at the top may be avoided and it may be replaced by iron plated copper and iron plated silver so as to reduce the consumption of precious metal.

Abstract: The present invention relates to an intermittent cyclic permanent illuminating LED lamp, comprising a radiating substrate, a plurality of chips, a plurality of conducting wires, 4 insulating pieces, 4 sets of positive and negative conducting pieces, 2 fluorescent layers and transparent adhesive tape, wherein 2 insulating pieces are bonded to the front side and back side of the radiating substrate, the insulating pieces are available for bonding of the 4 sets of positive and negative conducting pieces, and the plurality of conducting wires on the front side and back side of the radiating substrate are provided for serial connection with the plurality of chips and the positive pole and negative pole on the two sides to offer the intermittent switching cyclic permanent lighting effect or achieve the industrial application of multi-serial connection all illuminating and multi-color light selection and control effect.