Abstract: An adhesive composition for semiconductor devices, an adhesive film, and a dicing die bonding film, the adhesive composition including an elastomer resin, an epoxy resin, a curable phenolic resin, a curing accelerator, a silane coupling agent, and a filler, wherein the silane coupling agent includes an epoxy group-containing silane coupling agent and a transition metal scavenging functional group-containing silane coupling agent.

Abstract: A microfluidic device and a method for measurement of biomaterials using the same. The microfluidic device includes a microfluidic structure including: a sample chamber which receives and accommodates blood; a reagent chamber which contains a luminescent reactant; a first detection chamber which contains a first material that is positively charged; a second detection chamber which is connected to the first detection chamber, and contains a second material having a boronate moiety; and at least one channel which connects the sample chamber, the reagent chamber and the first and second detection chambers.

Abstract: Disclosed are a micro-fluidic structure for detecting biomolecules and a micro-fluidic device having the same. More particularly, a target material including at least two cis-diols is detected by a first material containing a boronate moiety and a second material containing another boronate moiety while generating electrical signals.

Abstract: A microfluidic device and a method for measurement of biomaterials using the same. The microfluidic device includes a microfluidic structure including: a sample chamber which receives and accommodates blood; a reagent chamber which contains a luminescent reactant; a first detection chamber which contains a first material that is positively charged; a second detection chamber which is connected to the first detection chamber, and contains a second material having a boronate moiety; and at least one channel which connects the sample chamber, the reagent chamber and the first and second detection chambers.

Abstract: An adhesive film composition includes a polymer binder; a curable resin; and about 40 to about 60 wt. % of solvent, wherein the solvent is a binary solvent consisting essentially of at least a first solvent with a boiling point of about 40° C. to about 100° C. and at least a second solvent with a boiling point of about 140° C. to about 200° C.

Abstract: An adhesive composition for semiconductor devices, an adhesive film, and a dicing die bonding film, the adhesive composition including an elastomer resin, an epoxy resin, a curable phenolic resin, a curing accelerator, a silane coupling agent, and a filler, wherein the silane coupling agent includes an epoxy group-containing silane coupling agent and a transition metal scavenging functional group-containing silane coupling agent.

Abstract: Disclosed are a micro-fluidic structure for detecting biomolecules and a micro-fluidic device having the same. More particularly, a target material including at least two cis-diols is detected by a first material containing a boronate moiety and a second material containing another boronate moiety while generating electrical signals.

Abstract: An adhesive film for semiconductor assembly includes a binder portion 1, a sub-binder portion, and a cured portion, wherein the binder portion 1 and the sub-binder portion co-exist in a co-continuous phase structure after curing begins.

Abstract: An adhesive film composition includes a polymer binder; a curable resin; and about 40 to about 60 wt. % of solvent, wherein the solvent is a binary solvent consisting essentially of at least a first solvent with a boiling point of about 40° C. to about 100° C. and at least a second solvent with a boiling point of about 140° C. to about 200° C.