Abstract: The present disclosure provides a package device and a method of manufacturing the same. The package device includes a supporting member, a main component, a sealant, and a conductive encapsulant. The supporting member includes a plurality of grounding contacts. The main component is mounted on the supporting member. The sealant covers the main component. The conductive encapsulant encases the sealant and the grounding contacts exposed through the sealant for EMI shielding.

Abstract: The present disclosure provides a package device and a method of manufacturing the same. The package device includes a supporting member, a main component, a sealant, and a conductive encapsulant. The supporting member includes a plurality of grounding contacts. The main component is mounted on the supporting member. The sealant covers the main component. The conductive encapsulant encases the sealant and the grounding contacts exposed through the sealant for EMI shielding.

Abstract: A tray for holding an integrated circuit component includes a base frame and at least a pair of supporting walls. The supporting walls are connected to the base frame. The supporting walls are opposite to each other. Each of the supporting walls has a curved surface substantially facing to each other. The curved surfaces are configured to respectively support at least two portions of the integrated circuit component. A gap exists between the integrated circuit component and the base frame when the integrated circuit component is held by the curved surfaces.

Abstract: A package substrate is disclosed. The package substrate includes a base layer and a dam structure or a dent structure on at least one side of the base layer. The base layer may be a CCL core, a molding compound, or an epoxy base.

Abstract: A package substrate is disclosed. The package substrate includes a base layer and a dam structure or a dent structure on at least one side of the base layer. The base layer may be a CCL core, a molding compound, or an epoxy base.

Abstract: A method for fabricating a gold finger of a circuit board is provided. First, a circuit board having a board edge for cutting is provided. Next, a copper conducting wire pattern is formed on the circuit board. The copper conducting wire pattern includes a plurality of gold finger bodies and a plurality of tie bars. Each tie bar is connected to a corresponding gold finger body, and the tie bars are disposed across the board edge. Thereafter, a surface of each gold finger body is plated with gold, and the tie bars on the board edge are removed by etching. Because the tie bars on the board edge are removed, tear resistance of the gold finger is maintained after cutting the board edge.

Abstract: A method for fabricating a gold finger of a circuit board is provided. First, a circuit board having a board edge for cutting is provided. Next, a copper conducting wire pattern is formed on the circuit board. The copper conducting wire pattern includes a plurality of gold finger bodies and a plurality of tie bars. Each tie bar is connected to a corresponding gold finger body, and the tie bars are disposed across the board edge. Thereafter, a surface of each gold finger body is plated with gold, and the tie bars on the board edge are removed by etching. Because the tie bars on the board edge are removed, tear resistance of the gold finger is maintained after cutting the board edge.