Patents by Inventor Han-Pei Huang

Han-Pei Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9320143
    Abstract: A wiring board includes a substrate, a first conductor layer, a second conductor layer, and a through-via conductor. The substrate has a first surface, a second surface, and at least one through-via. The first conductor layer is formed on the first surface, and the second conductor layer is formed on the second surface. The through-via conductor is formed in the through-via for electrically connecting to the first conductor layer and the second conductor layer. The through-via has a first depressed portion exposed in the first surface, a second depressed portion exposed in the second surface, and a tunnel portion between the first depressed portion and the second depressed portion for connecting the first depressed portion and the second depressed portion. The first depressed portion and the second depressed, portion are non-coaxial.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: April 19, 2016
    Assignee: Unimicron Technology Corp.
    Inventors: Cheng-Ming Weng, Wei-Ming Cheng, Han-Pei Huang
  • Patent number: 9288917
    Abstract: A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, a substrate having two surfaces opposite to each other and a via connecting there between is provided. Next, a patterned circuit layer is formed on each of the surfaces by using the via as an alignment target. Each patterned circuit layer includes a concentric-circle pattern. Next, a first stacking layer is formed on each of the surfaces. Then, a first through hole penetrating regions of the first stacking layer and the substrate where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed. Next, a second stacking layer is formed on each first stacking layer. Afterward, a second through hole penetrating regions of the first, the second stacking layers and the substrate where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed.
    Type: Grant
    Filed: November 7, 2013
    Date of Patent: March 15, 2016
    Assignee: Unimicron Technology Corp.
    Inventors: Pei-Chang Huang, Cheng-Po Yu, Han-Pei Huang
  • Publication number: 20160004373
    Abstract: A method for providing auxiliary information and touch control display apparatus using the same are provided. The method includes steps as following. An operating signal is received, and whether the operating signal is an auxiliary information request signal is determined. When the operating signal is an auxiliary information request signal, the auxiliary information of an object is presented, wherein the object corresponds to a coordinate of the auxiliary information request signal on the touch-control screen.
    Type: Application
    Filed: November 17, 2014
    Publication date: January 7, 2016
    Inventor: HAN-PEI HUANG
  • Patent number: 9198303
    Abstract: A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, two core layers are compressed to form a substrate having two surfaces opposite to each other. Then, a via connecting the surfaces is formed. A patterned circuit layer including a concentric-circle pattern is then formed on each surface by using the via as an alignment target. Next, a first stacking layer is formed on each surface. Then, a first through hole penetrating regions of the first stacking layer and the substrate where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed. A second stacking layer is then formed on each first stacking layer. Afterward, a second through hole penetrating regions of the first, the second stacking layers and the substrate where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed.
    Type: Grant
    Filed: November 7, 2013
    Date of Patent: November 24, 2015
    Assignee: Unimicron Technology Corp.
    Inventors: Pei-Chang Huang, Cheng-Po Yu, Han-Pei Huang, Ai-Hwa Lim
  • Publication number: 20150266806
    Abstract: A diamine monomer with a large side chain R is provided. The large side chain would interrupt the symmetry and regularity of diamine monomer. The diamine monomer has the general formula shown as formula (V) below: The functional group R includes ?-substitution cycloalkene with at least a tertiary carbon atom, cycloalkene with at least a tertiary carbon atom, cycloalkane with at least a tertiary carbon atom, ?-substitution phenyl, phenyl, ?-substitution naphthalyl, naphthalyl, ?-substitution phenanthrenyl, phenanthrenyl, ?-substitution anthracenyl, anthracenyl, ?-substitution adamantyl, adamantyl, ?-substitution diamantyl and diamantyl.
    Type: Application
    Filed: June 3, 2015
    Publication date: September 24, 2015
    Inventor: Han-Pei Huang
  • Patent number: 9095083
    Abstract: A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, a substrate having a first via penetrating the substrate is provided. Next, a patterned circuit layer is formed on a surface of the substrate by using the first via as an alignment target. The first patterned circuit layer includes a first concentric-circle pattern surrounding the first via. Next, a first stacking layer is formed on the surface. Then, a first through hole penetrating regions where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected on the first stacking layer and the substrate is formed. Next, a second stacking layer is formed on the first stacking layer. Afterward, a second through hole penetrating regions where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected on of the first, the second stacking layers and the substrate is formed.
    Type: Grant
    Filed: November 7, 2013
    Date of Patent: July 28, 2015
    Assignee: Unimicron Technology Corp.
    Inventors: Pei-Chang Huang, Cheng-Po Yu, Han-Pei Huang
  • Patent number: 9074051
    Abstract: A dianhydride monomer having a large side chain R is provided. The large side chain would interrupt the symmetry and regularity of diamine monomer. The diamine monomer has the general formula shown as formula (I) below: The functional group R includes ?-substitution cycloalkene having at least a tertiary carbon atom, cycloalkene having at least a tertiary carbon atom, cycloalkane having at least a tertiary carbon atom, ?-substitution phenyl, phenyl, ?-substitution naphthalyl, naphthalyl, ?-substitution phenanthrenyl, phenanthrenyl, ?-substitution anthracenyl, anthracenyl, ?-substitution adamantyl, adamantyl, ?-substitution adamantyl and adamantyl.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: July 7, 2015
    Assignee: Unimicron Technology Corp.
    Inventor: Han-Pei Huang
  • Patent number: 9045597
    Abstract: A polyimide compound with a large side chain R and R? is provided. The large side chain would interrupt the symmetry and regularity of polyimide compound. The polyimide compound has the general formula shown as formula (I) below: The functional group R and R? are selecting individually from the group consisting: ?-substitution cycloalkene with at least a tertiary carbon atom, cycloalkene with at least a tertiary carbon atom, cycloalkane with at least a tertiary carbon atom, ?-substitution phenyl, phenyl, ?-substitution naphthalyl, naphthalyl, ?-substitution phenanthrenyl, phenanthrenyl, ?-substitution anthracenyl, anthracenyl, ?-substitution adamantyl, adamantyl, ?-substitution diamantyl and diamantyl.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: June 2, 2015
    Assignee: Unimicron Technology Corp.
    Inventor: Han-Pei Huang
  • Publication number: 20150121693
    Abstract: A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, two core layers are compressed to form a substrate having two surfaces opposite to each other. Then, a via connecting the surfaces is formed. A patterned circuit layer including a concentric-circle pattern is then formed on each surface by using the via as an alignment target. Next, a first stacking layer is formed on each surface. Then, a first through hole penetrating regions of the first stacking layer and the substrate where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed. A second stacking layer is then formed on each first stacking layer. Afterward, a second through hole penetrating regions of the first, the second stacking layers and the substrate where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed.
    Type: Application
    Filed: November 7, 2013
    Publication date: May 7, 2015
    Applicant: Unimicron Technology Corp.
    Inventors: Pei-Chang Huang, Cheng-Po Yu, Han-Pei Huang, Ai-Hwa Lim
  • Publication number: 20150121694
    Abstract: A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, a substrate having two surfaces opposite to each other and a via connecting there between is provided. Next, a patterned circuit layer is formed on each of the surfaces by using the via as an alignment target. Each patterned circuit layer includes a concentric-circle pattern. Next, a first stacking layer is formed on each of the surfaces. Then, a first through hole penetrating regions of the first stacking layer and the substrate where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed. Next, a second stacking layer is formed on each first stacking layer. Afterward, a second through hole penetrating regions of the first, the second stacking layers and the substrate where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed.
    Type: Application
    Filed: November 7, 2013
    Publication date: May 7, 2015
    Applicant: Unimicron Technology Corp.
    Inventors: Pei-Chang Huang, Cheng-Po Yu, Han-Pei Huang
  • Publication number: 20150125625
    Abstract: A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, a substrate having a first via penetrating the substrate is provided. Next, a patterned circuit layer is formed on a surface of the substrate by using the first via as an alignment target. The first patterned circuit layer includes a first concentric-circle pattern surrounding the first via. Next, a first stacking layer is formed on the surface. Then, a first through hole penetrating regions where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected on the first stacking layer and the substrate is formed. Next, a second stacking layer is formed on the first stacking layer. Afterward, a second through hole penetrating regions where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected on of the first, the second stacking layers and the substrate is formed.
    Type: Application
    Filed: November 7, 2013
    Publication date: May 7, 2015
    Applicant: Unimicron Technology Corp.
    Inventors: Pei-Chang Huang, Cheng-Po Yu, Han-Pei Huang
  • Publication number: 20140275470
    Abstract: A dianhydride monomer having a large side chain R is provided. The large side chain would interrupt the symmetry and regularity of diamine monomer. The diamine monomer has the general formula shown as formula (I) below: The functional group R includes ?-substitution cycloalkene having at least a tertiary carbon atom, cycloalkene having at least a tertiary carbon atom, cycloalkane having at least a tertiary carbon atom, ?-substitution phenyl, phenyl, ?-substitution naphthalyl, naphthalyl, ?-substitution phenanthrenyl, phenanthrenyl, ?-substitution anthracenyl, anthracenyl, ?-substitution adamantyl, adamantyl, ?-substitution adamantyl and adamantyl.
    Type: Application
    Filed: March 18, 2013
    Publication date: September 18, 2014
    Applicant: UNIMICRON TECHNOLOGY CORP.
    Inventor: HAN-PEI HUANG
  • Publication number: 20140275441
    Abstract: A polyimide compound with a large side chain R and R? is provided. The large side chain would interrupt the symmetry and regularity of polyimide compound. The polyimide compound has the general formula shown as formula (I) below: The functional group R and R? are selecting individually from the group consisting: ?-substitution cycloalkene with at least a tertiary carbon atom, cycloalkene with at least a tertiary carbon atom, cycloalkane with at least a tertiary carbon atom, ?-substitution phenyl, phenyl, ?-substitution naphthalyl, naphthalyl, ?-substitution phenanthrenyl, phenanthrenyl, ?-substitution anthracenyl, anthracenyl, ?-substitution adamantyl, adamantyl, ?-substitution diamantyl and diamantyl.
    Type: Application
    Filed: March 18, 2013
    Publication date: September 18, 2014
    Applicant: UNIMICRON TECHNOLOGY CORP.
    Inventor: HAN-PEI HUANG
  • Publication number: 20140275440
    Abstract: A diamine monomer having a large side chain R is provided. The large side chain would interrupt the symmetry and regularity of diamine monomer. The diamine monomer has the general formula shown as formula (V) below: The functional group R includes ?-substitution cycloalkene with at least a tertiary carbon atom, cycloalkene with at least a tertiary carbon atom, cycloalkane with at least a tertiary carbon atom, ?-substitution phenyl, phenyl, ?-substitution naphthalyl, naphthalyl, ?-substitution phenanthrenyl, phenanthrenyl, ?-substitution anthracenyl, anthracenyl, ?-substitution adamantyl, adamantyl, ?-substitution diamantyl and diamantyl.
    Type: Application
    Filed: March 18, 2013
    Publication date: September 18, 2014
    Applicant: UNIMICRON TECHNOLOGY CORP.
    Inventor: HAN-PEI HUANG
  • Publication number: 20140174791
    Abstract: A circuit board and a manufacturing method thereof are provided. A dielectric layer is formed on a substrate, wherein an internal circuit layer is formed on the substrate and the dielectric layer covers the internal circuit layer. A first trench, a second trench and an opening are formed in the dielectric layer. The opening is located below the first trench and connected with the first trench, and a portion of the internal circuit layer is exposed by the opening. A patterned conductive layer is formed on the dielectric layer. The patterned conductive layer covers a portion of the dielectric layer and fills the first trench, the second trench and the opening so as to form a first circuit layer, a second circuit layer and a conductive through via, respectively, wherein the conductive through via is electrically connected with the first circuit layer and the internal circuit layer.
    Type: Application
    Filed: December 26, 2012
    Publication date: June 26, 2014
    Applicant: UNIMICRON TECHNOLOGY CORP.
    Inventors: Cheng-Po Yu, Han-Pei Huang, Shang-Feng Huang
  • Publication number: 20140151107
    Abstract: A wiring board includes a substrate, a first conductor layer, a second conductor layer, and a through-via conductor. The substrate has a first surface, a second surface, and at least one through-via. The first conductor layer is formed on the first surface, and the second conductor layer is formed on the second surface. The through-via conductor is formed in the through-via for electrically connecting to the first conductor layer and the second conductor layer. The through-via has a first depressed portion exposed in the first surface, a second depressed portion exposed in the second surface, and a tunnel portion between the first depressed portion and the second depressed portion for connecting the first depressed portion and the second depressed portion. The first depressed portion and the second depressed, portion are non-coaxial.
    Type: Application
    Filed: March 18, 2013
    Publication date: June 5, 2014
    Applicant: UNIMICRON TECHNOLOGY CORP.
    Inventors: CHENG-MING WENG, WEI-MING CHENG, HAN-PEI HUANG
  • Publication number: 20140151099
    Abstract: A laser drilling method of a wiring board is provided. In the method, a laser beam shines on a wiring substrate including an insulating layer to remove a portion of the insulating layer. The wiring substrate is placed in a focus section of the laser beam. The focus section contains a central region, an optical axis located in the central region, and a peripheral region surrounding the central region. The maximum light intensity of the focus section is located in the peripheral region.
    Type: Application
    Filed: March 18, 2013
    Publication date: June 5, 2014
    Applicant: UNIMICRON TECHNOLOGY CORP.
    Inventors: CHENG MING WENG, WEI-MING CHENG, HAN-PEI HUANG
  • Patent number: 8436254
    Abstract: A method of fabrication a circuit board structure comprising providing a circuit board main body, forming a molded, irregular plastic body having a non-plate type, stereo structure and at least one scraggy surface by encapsulating at least a portion of said circuit board main body with injection molded material, and forming a first three-dimensional circuit pattern on said molded, irregular plastic body thereby defining a three-dimensional circuit device.
    Type: Grant
    Filed: November 22, 2011
    Date of Patent: May 7, 2013
    Assignee: Unimicron Technology Corp.
    Inventors: Cheng-Po Yu, Han-Pei Huang
  • Publication number: 20120255770
    Abstract: A method for fabricating a carrier is disclosed, wherein the carrier is applied for a microelectromechanical sensing device. The method includes the steps of: providing a first substrate, wherein the first substrate includes a first metal layer, a first dielectric layer, and a first opening; providing a second substrate, wherein the second substrate includes a second metal layer, a second dielectric layer, and a second opening; providing a reticular element; pressing the first substrate, the reticular element, and the second substrate to form a composite substrate, wherein the first opening and the second opening form a hole, and the reticular element is positioned in the hole; and forming at least one conductive via in the composite substrate.
    Type: Application
    Filed: February 10, 2012
    Publication date: October 11, 2012
    Inventors: Han-Pei Huang, Yu-Ying Chao, Chih-Hsueh Shih
  • Publication number: 20120060368
    Abstract: A method of fabrication a circuit board structure comprising providing a circuit board main body, forming a molded, irregular plastic body having a non-plate type, stereo structure and at least one scraggy surface by encapsulating at least a portion of said circuit board main body with injection molded material, and forming a first three-dimensional circuit pattern on said molded, irregular plastic body thereby defining a three-dimensional circuit device.
    Type: Application
    Filed: November 22, 2011
    Publication date: March 15, 2012
    Inventors: Cheng-Po Yu, Han-Pei Huang