Abstract: Disclosed herein is a printed circuit board for an optical waveguide, including a base board, and an optical waveguide formed on the base board. The optical waveguide includes a lower clad layer formed on the base board, an insulation layer formed on the lower clad layer and having a core-forming through-hole, a core part formed on a region of the lower clad layer, which is exposed through the through-hole, and an upper clad layer formed in the through-hole and on the insulation layer.

Abstract: A method of manufacturing a printed circuit board in which optical waveguides are formed for transmitting optical signals together with electrical signals, which includes a cladding, a core embedded in the cladding that transmits optical signals, and a wiring pattern embedded in the cladding that transmits electrical signals, can offer improved optical connection efficiency and reduced material costs by enabling the cladding to act as an insulation layer and embedding the wiring pattern in the cladding.

Abstract: A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The printed circuit board can include: an optical waveguide, in one side of which a circuit pattern and a pad are buried; an insulation layer stacked over one side of the optical waveguide; a first insulating material stacked over the insulation layer; a first electrical wiring layer stacked over the first insulating material; a second insulating material stacked over the other side of the optical waveguide; a second electrical wiring layer stacked over the second insulating material; and a via penetrating the optical waveguide. Certain embodiments of the invention enable the efficient transmission of optical and electrical signals, reduce loss in the optical signals transferred to the photoelectric converters, and allow more efficient designs for the wiring in the board.

Abstract: A printed circuit board and a method of manufacturing a printed circuit board are disclosed. A printed circuit board in which optical waveguides are formed for transmitting optical signals together with electrical signals, which includes a cladding, a core embedded in the cladding that transmits optical signals, and a wiring pattern embedded in the cladding that transmits electrical signals, can offer improved optical connection efficiency and reduced material costs by enabling the cladding to act as an insulation layer and embedding the wiring pattern in the cladding.

Abstract: A method of manufacturing an optical board is disclosed. The method of manufacturing an optical board may include stacking an optical waveguide core layer over a first optical waveguide cladding layer, forming an inclined surface by diffracting a laser with a mask to remove a portion of the optical waveguide core layer, and stacking a reflective layer over the inclined surface.

Abstract: An optical wiring board and a method of manufacturing the optical wiring board are disclosed. The method of manufacturing an optical wiring board may include forming a lower cladding over an insulating layer; forming a side cladding, which has an indentation corresponding with the core, over the lower cladding; filling a core material in the indentation; and forming an upper cladding such that the core material is covered. Embodiments of the invention can be utilized to readily control the thickness of the core.

Abstract: An optical printed circuit board which can transfer optical signal and electric signals simultaneously, and a method of fabricating the optical printed circuit board. An optical printed circuit board which includes an upper cladding layer, a core layer positioned in the upper cladding layer that has a first reflecting surface and a second reflecting surface at both ends to guide optical signals, a lower cladding layer of which one side is in contact with the upper cladding layer and which has a circuit pattern and light connecting bumps on the other side corresponding to the first reflecting surface and the second reflecting surface, may provide the advantage of high optical connection efficiency.

Abstract: A printed circuit board is disclosed. A printed circuit board, which includes a first board part, a flexible board part which has one side coupled with the first board part and which includes an electrical wiring layer and an optical waveguide to transmit both electrical signals and optical signals, and a second board part coupled with the other side of the flexible board part, where the electrical wiring layer and the optical waveguide are disposed with a gap in-between, can provide greater bendability and reliability, by having the optical waveguide and electrical wiring layer separated with a gap in-between at the flexible portion of the board, and the optical waveguide can be manufactured with greater precision for even higher reliability, by having the optical waveguide manufactured separately and then inserted during the manufacturing process of the board.

Abstract: A printed circuit board is disclosed. A printed circuit board, which includes a first board part, a flexible board part which has one side coupled with the first board part and which includes an electrical wiring layer and an optical waveguide to transmit both electrical signals and optical signals, and a second board part coupled with the other side of the flexible board part, where the electrical wiring layer and the optical waveguide are disposed with a gap in-between, can provide greater bendability and reliability, by having the optical waveguide and electrical wiring layer separated with a gap in-between at the flexible portion of the board, and the optical waveguide can be manufactured with greater precision for even higher reliability, by having the optical waveguide manufactured separately and then inserted during the manufacturing process of the board.

Abstract: A printed circuit board is disclosed. The printed circuit board includes a first board unit and a second board unit disposed with a gap in-between, and a flexible optical board configured to transmit optical signals, which has one side stacked on the first board unit and the other side stacked on the second board unit, where the flexible optical board includes a core through which the optical signals travel, a cladding surrounding the core, and a circuit pattern buried in the cladding which transmits electrical signals. By forming the rigid boards and the flexible optical board as an integrated structure, the need for separate connectors is obviated, and thus the cost of the product can be lowered.

Abstract: A method of manufacturing an optical waveguide includes: forming a first reflective bump and a second reflective bump, which have inclined surfaces formed on sides opposite to each other and which are disposed with a predetermined distance in-between, on an upper side of a conductive carrier; polishing the surfaces of the first reflective bump and the second reflective bump; forming a core between the first reflective bump and the second reflective bump; stacking an upper cladding over the upper side of the carrier to cover the first reflective bump, the second reflective bump, and the core; removing the carrier; and stacking a lower cladding over a lower side of the upper cladding. Forming reflective bumps on a conductive carrier, and polishing the reflective bumps to form inclined surfaces, can reduce lead time and can provide a high degree of freedom in design.

Abstract: An optical waveguide, a package board having the optical waveguide, and manufacturing methods thereof are disclosed. The method of manufacturing an optical waveguide includes: forming a first reflective bump and a second reflective bump, which have inclined surfaces formed on sides opposite to each other and which are disposed with a predetermined distance in-between, on one side of a first cladding; forming a core between the first reflective bump and the second reflective bump; and stacking a second cladding over the one side of the first cladding such that the second cladding covers the first reflective bump, the second reflective bump, and the core. With this method, inclined surfaces can be formed by stacking a metal layer on the lower cladding and then selectively etching the metal layer, which can reduce lead time and enable a high degree of freedom in design.

Abstract: A printed circuit board is disclosed. A printed circuit board, which includes a first board part, a flexible board part which has one side coupled with the first board part and which includes an electrical wiring layer and an optical waveguide to transmit both electrical signals and optical signals, and a second board part coupled with the other side of the flexible board part, where the electrical wiring layer and the optical waveguide are disposed with a gap in-between, can provide greater bendability and reliability, by having the optical waveguide and electrical wiring layer separated with a gap in-between at the flexible portion of the board, and the optical waveguide can be manufactured with greater precision for even higher reliability, by having the optical waveguide manufactured separately and then inserted during the manufacturing process of the board.

Abstract: An optical waveguide, a package board having the optical waveguide, and manufacturing methods thereof are disclosed. The method of manufacturing an optical waveguide includes: forming a first reflective bump and a second reflective bump, which have inclined surfaces formed on sides opposite to each other and which are disposed with a predetermined distance in-between, on one side of a first cladding; forming a core between the first reflective bump and the second reflective bump; and stacking a second cladding over the one side of the first cladding such that the second cladding covers the first reflective bump, the second reflective bump, and the core. With this method, inclined surfaces can be formed by stacking a metal layer on the lower cladding and then selectively etching the metal layer, which can reduce lead time and enable a high degree of freedom in design.

Abstract: A parallel chip embedded printed circuit board and manufacturing method thereof are disclosed. With a method of manufacturing a parallel chip embedded printed circuit board, comprising: (a) forming a parallel chip by connecting in parallel a plurality of unit chips having electrodes or electrically connected members formed on the upper and lower surfaces thereof, using at least one conductive member; (b) joining an electrode on one side of the parallel chip to a first board; and (c) joining an electrode on the other side of the parallel chip to a second board, chips may be embedded in a printed circuit board at a low cost, as a plurality of unit chips can be embedded at once, and a mechanical drill or router can be used instead of a laser drill in perforating the cavity or via holes.

Abstract: A package board and a method for the manufacturing of the package board are disclosed. A package board, which includes a first metal layer, a heat-release layer stacked on the first metal layer with a first insulation layer interposed in-between, a cavity formed in the heat-release layer, a mounting layer formed in the cavity in contact with the first insulation layer, a first component mounted on the mounting layer, and a second insulation layer covering at least a portion of the heat-release layer and the cavity, may offer improved heat release and smaller thickness.

Abstract: A printed circuit board is disclosed. A printed circuit board, which includes a first board part, a flexible board part which has one side coupled with the first board part and which includes an electrical wiring layer and an optical waveguide to transmit both electrical signals and optical signals, and a second board part coupled with the other side of the flexible board part, where the electrical wiring layer and the optical waveguide are disposed with a gap in-between, can provide greater bendability and reliability, by having the optical waveguide and electrical wiring layer separated with a gap in-between at the flexible portion of the board, and the optical waveguide can be manufactured with greater precision for even higher reliability, by having the optical waveguide manufactured separately and then inserted during the manufacturing process of the board.

Abstract: A method of manufacturing an optical component embedded printed circuit board is disclosed. An optical component embedded printed circuit board that includes a metal core in which at least one cavity is formed, an optical component embedded in the cavity, a first insulation layer stacked on one side of the metal core, a second insulation layer stacked on the other side of the metal core, and a circuit pattern which is formed on the first insulation layer and which is electrically connected with the optical component, provides a thin printed circuit board having a superb heat releasing effect.

Abstract: A printed circuit board and a method of manufacturing a printed circuit board are disclosed. A printed circuit board in which optical waveguides are formed for transmitting optical signals together with electrical signals, which includes a cladding, a core embedded in the cladding that transmits optical signals, and a wiring pattern embedded in the cladding that transmits electrical signals, can offer improved optical connection efficiency and reduced material costs by enabling the cladding to act as an insulation layer and embedding the wiring pattern in the cladding.

Abstract: An optical printed circuit board which can transfer optical signal and electric signals simultaneously, and a method of fabricating the optical printed circuit board. An optical printed circuit board which includes an upper cladding layer, a core layer positioned in the upper cladding layer that has a first reflecting surface and a second reflecting surface at both ends to guide optical signals, a lower cladding layer of which one side is in contact with the upper cladding layer and which has a circuit pattern and light connecting bumps on the other side corresponding to the first reflecting surface and the second reflecting surface, may provide the advantage of high optical connection efficiency.