Patents by Inventor Han Seon Kang

Han Seon Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11938493
    Abstract: Provided is a substrate processing apparatus. The substrate processing apparatus includes a swing nozzle that is arranged on one side of the support module, moves in a swing manner, and sprays a chemical solution to the substrate, a sensor arranged on one side of the swing nozzle to sense movement of the swing nozzle, an electromagnet and a magnet installed on the other side of the swing nozzle so as to be able to adjust spacing relative to each other, and a controller for receiving a sensing result of the sensor and performing a damping operation to the swing nozzle by providing power to the electromagnet to generate an attractive force or repulsive force between the electromagnet and the magnet.
    Type: Grant
    Filed: August 5, 2020
    Date of Patent: March 26, 2024
    Assignee: Semes Co., Ltd.
    Inventors: Noh Hoon Myoung, Han Seon Kang, Jung Min Yoon
  • Patent number: 11152240
    Abstract: Provided is an apparatus for conveying a carrier and a system for controlling a carrier having the same, which couples a hoist and a hand using a non-contact damping structure using an eddy current. The apparatus for conveying the carrier conveys a carrier containing a wafer, and includes: a gripper for gripping the carrier; and a lifter for raising and lowering the gripper, in which the gripper and the lifter are connected in a non-contact damping structure, and a relative motion thereof is suppressed.
    Type: Grant
    Filed: August 5, 2020
    Date of Patent: October 19, 2021
    Assignee: Semes Co., Ltd.
    Inventors: Noh Hoon Myoung, Han Seon Kang, Jung Min Yoon, Chung Il Cho
  • Publication number: 20210043486
    Abstract: Provided is an apparatus for conveying a carrier and a system for controlling a carrier having the same, which couples a hoist and a hand using a non-contact damping structure using an eddy current. The apparatus for conveying the carrier conveys a carrier containing a wafer, and includes: a gripper for gripping the carrier; and a lifter for raising and lowering the gripper, in which the gripper and the lifter are connected in a non-contact damping structure, and a relative motion thereof is suppressed.
    Type: Application
    Filed: August 5, 2020
    Publication date: February 11, 2021
    Inventors: Noh Hoon Myoung, Han Seon Kang, Jung Min Yoon, Chung Il Cho
  • Publication number: 20210039119
    Abstract: Provided is a substrate processing apparatus. The substrate processing apparatus includes a swing nozzle that is arranged on one side of the support module, moves in a swing manner, and sprays a chemical solution to the substrate, a sensor arranged on one side of the swing nozzle to sense movement of the swing nozzle, an electromagnet and a magnet installed on the other side of the swing nozzle so as to be able to adjust spacing relative to each other, and a controller for receiving a sensing result of the sensor and performing a damping operation to the swing nozzle by providing power to the electromagnet to generate an attractive force or repulsive force between the electromagnet and the magnet.
    Type: Application
    Filed: August 5, 2020
    Publication date: February 11, 2021
    Inventors: Noh Hoon Myoung, Han Seon Kang, Jung Min Yoon