Abstract: Disclosed is a test for a semiconductor device, including: a test board that has a preparation surface on which a test tray with the semiconductor device mounted to an insert is prepared, and performs a test on the semiconductor device mounted to the insert; and a pressing unit that is positioned to face the preparation surface and presses the insert of the test tray prepared on the preparation surface toward the test board.

Abstract: The method of loading the semiconductor device having the fine bumps into the insert according to an embodiment of the disclosure comprises: by a first vision module, capturing a bottom image of the semiconductor device picked up by a picker; by a second vision module, capturing a top image of the insert; and by the picker, loading the semiconductor device into the insert, based on the bottom image and the top image.

Abstract: A test tray for testing a semiconductor product according to an embodiment of the disclosure may include a tray and an insert comprising an accommodating portion configured to accommodate the semiconductor product and inserted into the tray. The accommodating portion may have a first posture at a first angle to the tray to accommodate the semiconductor product, and a second posture at a second angle to the tray to test the semiconductor product.

Abstract: An automated mounting test system for testing a semiconductor product in a standing state according to one embodiment of the present disclosure includes a test tray including a plurality of inserts and having a tray groove into which each insert is inserted, a handler configured to load a semiconductor product to be tested into an empty insert and collect the tested semiconductor product from the insert, a tester including a plurality of socket modules, each facing one of the inserts, in a state where the test tray is seated, and a rack master configured to transport the test tray between the handler and the tester.

Abstract: Disclosed is an insert module for test tray, including: a pitch adjuster configured to seat the electronic device thereon, and including a first side electrically connected to connection pins of the electronic device, and a second side provided with electrical contact means at a second pitch wider than a first pitch of the connection pins; and a holder configured to hold the seated electronic device. According to the disclosure, the insert module for test tray and the test tray including the same are capable of the accurate contact corresponding to the fine pitch of the electronic device, and maintain the precise contact during the test, thereby improving the accuracy of the test.

Abstract: Disclosed is a test for a semiconductor device, including: a test board that has a preparation surface on which a test tray with the semiconductor device mounted to an insert is prepared, and performs a test on the semiconductor device mounted to the insert; and a pressing unit that is positioned to face the preparation surface and presses the insert of the test tray prepared on the preparation surface toward the test board.

Abstract: Disclosed is a test tray to which a semiconductor device is mounted according to an embodiment of the disclosure, the test tray including: a plurality of inserts to which the semiconductor devices are mounted; and a frame which supports the inserts in arrangement respectively corresponding to sockets of a test apparatus and has a length in a first axis and a width in a second axis.