Patents by Inventor Han Sub Hwang

Han Sub Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Injection molding machine
    Patent number: 8439664
    Abstract: An injection molding machine to prevent a molded piece from being separated from a mold after molds are disassembled from each other includes a first mold, a second mold assembled with the first mold to form a cavity, and a binding device or a pressing device to get a molded piece held in the first mold when the first mold and the second mold are disassembled from each other.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: May 14, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang Hak Kim, Han Sub Hwang
  • INJECTION MOLDING MACHINE
    Publication number: 20120013044
    Abstract: An injection molding machine to prevent a molded piece from being separated from a mold after molds are disassembled from each other includes a first mold, a second mold assembled with the first mold to form a cavity, and a binding device or a pressing device to get a molded piece held in the first mold when the first mold and the second mold are disassembled from each other.
    Type: Application
    Filed: September 23, 2011
    Publication date: January 19, 2012
    Applicant: Samsung Electronics Co., Ltd
    Inventors: Sang Hak KIM, Han Sub HWANG
  • Injection molding machine and method with pressing device
    Patent number: 8057720
    Abstract: An injection molding machine to prevent a molded piece from being separated from a mold after molds are disassembled from each other includes a first mold, a second mold assembled with the first mold to form a cavity, and a binding device or a pressing device to get a molded piece held in the first mold when the first mold and the second mold are disassembled from each other.
    Type: Grant
    Filed: March 4, 2009
    Date of Patent: November 15, 2011
    Assignee: SAMSUNG Electronics Co., Ltd.
    Inventors: Sang Hak Kim, Han Sub Hwang
  • Injection molding apparatus
    Patent number: 7670134
    Abstract: An injection molding apparatus capable of minimizing cracks at the corners of a mold is provided. The injection molding apparatus includes first and second molds that mate with each other to define a molding cavity, a stationary member that supports the first mold, a movable member that supports the second mold and moves backwards and forwards together with the second mold, and a plurality of pressing members installed around the first mold so as to press a periphery of the first mold toward the molding cavity by a pressing force of the movable member when the first mold is mated with the second mold.
    Type: Grant
    Filed: October 18, 2007
    Date of Patent: March 2, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Han Sub Hwang, Sung Ki Min, Sang Hun Lee, Jong Won Lee
  • INJECTION MOLDING MACHINE
    Publication number: 20090256281
    Abstract: An injection molding machine to prevent a molded piece from being separated from a mold after molds are disassembled from each other includes a first mold, a second mold assembled with the first mold to form a cavity, and a binding device or a pressing device to get a molded piece held in the first mold when the first mold and the second mold are disassembled from each other.
    Type: Application
    Filed: March 4, 2009
    Publication date: October 15, 2009
    Applicant: Samsung Electronics Co., Ltd
    Inventors: Sang Hak KIM, Han Sub Hwang
  • INJECTION MOLDING APPARATUS
    Publication number: 20080175946
    Abstract: An injection molding apparatus capable of minimizing cracks at the corners of a mold is provided. The injection molding apparatus includes first and second molds that mate with each other to define a molding cavity, a stationary member that supports the first mold, a movable member that supports the second mold and moves backwards and forwards together with the second mold, and a plurality of pressing members installed around the first mold so as to press a periphery of the first mold toward the molding cavity by a pressing force of the movable member when the first mold is mated with the second mold.
    Type: Application
    Filed: October 18, 2007
    Publication date: July 24, 2008
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Han Sub HWANG, Sung Ki Min, Sang Hun Lee, Jong Won Lee