Patents by Inventor Han Verbunt

Han Verbunt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper bath composition for electroless and/or electrolytic filling of vias and trenches for integrated circuit fabrication
    Patent number: 6897152
    Abstract: The present invention is directed to a copper bath composition and a process for the electroless and/or electrolytic plating of copper to fill vias and trenches during the manufacture of integrated circuits. Specifically, the copper bath composition comprises water, copper ions, hydroxide ions, a complexing agent to inhibit the formation of copper oxides, copper hydroxides and copper salts, a stabilizer to control the rate of electroless copper plating, a reducing agent to promote the electroless reduction of the copper ions to copper metal, and a catalyst to promote the electrolytic reduction copper ions to copper metal.
    Type: Grant
    Filed: February 5, 2003
    Date of Patent: May 24, 2005
    Assignee: Enthone Inc.
    Inventor: Han Verbunt
  • Copper activator solution and method for semiconductor seed layer enhancement
    Patent number: 6875260
    Abstract: The present invention is directed to an activator solution and method for activating a copper-seeded surface to facilitate plating of copper onto the copper-seeded surface. The activator solution is prepared by heating a precursor solution to a temperature of at least about 95° C., and maintaining the precursor solution at said temperature for at least about 30 minutes, wherein the precursor solution comprises water, chlorine ions, copper ions, tin (II) ions, and an antioxidant compound which substantially prevents the oxidation of the tin (II) ions to tin (IV) ions.
    Type: Grant
    Filed: December 10, 2002
    Date of Patent: April 5, 2005
    Assignee: Enthone Inc.
    Inventor: Han Verbunt
  • Copper bath composition for electroless and/or electrolytic filling of vias and trenches for integrated circuit fabrication
    Publication number: 20040152303
    Abstract: The present invention is directed to a copper bath composition and a process for the electroless and/or electrolytic plating of copper to fill vias and trenches during the manufacture of integrated circuits. Specifically, the copper bath composition comprises water, copper ions, hydroxide ions, a complexing agent to inhibit the formation of copper oxides, copper hydroxides and copper salts, a stabilizer to control the rate of electroless copper plating, a reducing agent to promote the electroless reduction of the copper ions to copper metal, and a catalyst to promote the electrolytic reduction copper ions to copper metal.
    Type: Application
    Filed: February 5, 2003
    Publication date: August 5, 2004
    Applicant: Enthone, Inc.
    Inventor: Han Verbunt
  • Copper activator solution and method for semiconductor seed layer enhancement
    Publication number: 20040110374
    Abstract: The present invention is directed to an activator solution and method for activating a copper-seeded surface to facilitate plating of copper onto the copper-seeded surface. The activator solution is prepared by heating a precursor solution to a temperature of at least about 95° C., and maintaining the precursor solution at said temperature for at least about 30 minutes, wherein the precursor solution comprises water, chlorine ions, copper ions, tin (II) ions, and an antioxidant compound which substantially prevents the oxidation of the tin (II) ions to tin (IV) ions.
    Type: Application
    Filed: December 10, 2002
    Publication date: June 10, 2004
    Applicant: Enthone, Inc.
    Inventor: Han Verbunt