Abstract: A pulse pressure measuring apparatus including a plurality of pressing elements, a plurality of pressure sensors, and a processing unit is provided. The pressing elements are used to press the site to be measured, and each pressing element has a position coordinate Pi (i=1, 2, 3 . . . ). The pressure sensors are configured to respectively measure pressure on the pressing elements to generate measured values of pressure intensity Ii (i=1, 2, 3 . . . ) at the position coordinates Pi (i=1, 2, 3 . . . ). The processing unit utilizes the position coordinates Pi (i=1, 2, 3 . . . ) and the measured values of pressure intensity Ii (i=1, 2, 3 . . . ) to determine the blood vessel locus.

Abstract: A server includes a housing, a motherboard and at least one expansion module. The housing has an accommodation space and a front opening. The front opening is located at one side of the accommodation space and communicates with the accommodation space. The motherboard is located in the accommodation space and has at least one mainboard connector. The expansion module is removably disposed in the accommodation space and exposed to outside from the front opening. The expansion module includes a main body, a main connector and two fluid connectors. The main connector is disposed on the main body and removably assembled with the mainboard connector of the motherboard. The fluid connectors are disposed on the main body.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a first low dielectric constant (low-k) layer, a first metal layer, a metal cap layer, a dielectric on dielectric (DoD) layer, an etch stop layer (ESL), a second low-k layer, a metal via and a second metal layer. The dielectric constant of the first low-k layer is less than 4. The first metal layer is embodied in the first low-k layer. The first low-k layer exposes the first metal layer. The metal cap layer is disposed on the first metal layer. The DoD layer is disposed on the first low-k layer. The etch stop layer is disposed on the metal cap layer and the DoD layer. The second low-k layer is disposed above the etch stop layer. The metal via is embodied in the second low-k layer and connected to the first metal layer.

Abstract: The present disclosure provides a cooling device, including a cooling plate and a mounting cover. A lower flow channel is provided in the cooling plate, a top of the cooling plate is provided with a water outlet and two openings. The water outlet is located between the two openings. The mounting cover is sealed on the top of the cooling plate. The mounting cover comprises a first mounting cover and a second mounting cover. The first mounting cover and the cooling plate form an intermediate flow channel, the second mounting cover and the cooling plate form a branch flow channel. The intermediate flow channel is in communication with the two branch flow channels, The first mounting cover is provided with a water inlet, and the two branch flow channels are in communication with the lower flow channel through the two openings.

Abstract: A light emitting diode package structure and a method for manufacturing the same are provided. The LED package structure includes a substrate having a first and a second surface opposite to each other, a conductive structure including a first and a second conductive structure electrically connected with each other, a first gold layer disposed on the first conductive structure, a second gold layer disposed on the second conductive structure, an LED chip disposed on the first gold layer, and a package layer disposed on the first surface and encapsulating the first conductive structure, the first gold layer, and the LED chip. The first conductive structure is disposed on the first surface. The second conductive structure is disposed on the second surface. A thickness of the first gold layer is greater than 1 ?m. The second conductive structure is completely covered by the second gold layer.

Abstract: A semiconductor structure includes a semiconductor substrate; fin active regions protruded above the semiconductor substrate; and a gate stack disposed on the fin active regions; wherein the gate stack includes a high-k dielectric material layer, and various metal layers disposed on the high-k dielectric material layer. The gate stack has an uneven profile in a sectional view with a first dimension D1 at a top surface, a second dimension D2 at a bottom surface, and a third dimension D3 at a location between the top surface and the bottom surface, and wherein each of D1 and D2 is greater than D3.

Abstract: An electric appliance includes a memory storing instructions and a processor configured to call and execute the instructions to control a first device to acquire a user instruction for a second device, generate an operation instruction for the second device based on the user instruction, and send the operation instruction to the second device to control the second device to perform a corresponding target operation. The first device is one of a clothes treatment device and a floor cleaning device, and the second device is another one of the clothes treatment device and the floor cleaning device.

Abstract: A high voltage direct-mounted energy storage method and system for eliminating a frequency multiplying current in battery charge and discharge is provided.

Abstract: An interconnect structure includes a first conductive feature, a first dielectric layer a first etch stop layer, a second etch stop layer, a second dielectric layer, and a second conductive feature. The first etch stop layer is disposed over the first conductive feature and the first dielectric layer. The second etch stop layer is disposed on the first etch stop layer. The second dielectric layer is disposed on the second etch stop layer. The second conductive feature includes a first conductive layer and a first barrier layer. The first conductive layer extends through the second dielectric layer, the second and the first etch stop layers to contact to the first conductive feature. The first barrier layer is sandwiched between the first conductive layer and the second dielectric layer, the first conductive layer and the second etch stop layer, and between the first conductive layer and the first etch stop layer.

Abstract: A method for manufacturing a semiconductor device includes: forming a plurality of sacrificial stack portions on a semiconductor substrate, the sacrificial stack portions being spaced apart from each other; forming a metal material layer to cover the sacrificial stack portions, the metal material layer including a first metal and a second metal different from the first metal, the first metal having a reduction potential lower than that of the second metal; and annealing the metal material layer to form a self-forming barrier layer conformally covering the sacrificial stack portions, the self-forming barrier layer including a metal oxide, a metal silicide, or a combination thereof formed from the first metal by annealing.

Abstract: The fish screen for a suction strainer includes at least one first plate having a central opening formed therethrough, a second plate, a helical spring, and a mesh bag. The helical spring has opposed first and second ends, with the first end secured to the at least one first plate and the second end secured to the second plate. The helical spring has first and second portions positioned respectively adjacent to the first and second ends. The second portion has a smaller diameter than a diameter of the first portion. The mesh bag releasably and removably covers and receives the at least one first plate, the second plate and the helical spring. The second portion of the helical spring is adapted for releasably holding a free end of a suction strainer received within an interior of the helical spring through the central opening of the at least one first plate.

Abstract: A rollable electronic device with a rollable axis includes a base layer, an insulating layer, and one or more electronic units. The insulating layer is disposed on the base layer and includes a plurality of first trenches. The first trenches have a first longitudinal direction parallel to the rollable axis. The one or more electronic units are disposed on the insulating layer. In a top view, at least one of the electronic units is disposed between two adjacent first trenches of the first trenches, and the two adjacent first trenches are overlapped with each other along a direction perpendicular to the first longitudinal direction.

Abstract: A display device includes a display panel including a rollable portion and a non-rollable portion. The display panel includes a supporting structure including a groove disposed on a first side of the supporting structure, a substrate disposed on a second side of the supporting structure and the first side opposite to the second side, and a circuit board fixed onto a back of the display panel. The non-rollable portion has a first region. A first region of the circuit board is joined to the first region of the non-rollable portion. The non-rollable portion has a first end and a second end. The first end is connected to the rollable portion. The second end is connected to the circuit board.

Abstract: An electronic assembly is provided. The electronic assembly includes a first circuit structure including a conductive structure, a second circuit structure disposed on the first circuit structure, a plurality of electronic elements disposed on the first circuit structure, and a connecting element disposed on the first circuit layer. The connecting element is disposed between two adjacent ones of the plurality electronic elements and electrically connected to the second circuit layer and one of the two adjacent ones of the plurality of electronic elements.

Abstract: A multi-configuration exercise device may include a base frame. A multi-configuration exercise device may include an interface frame. A multi-configuration exercise device may include a first cylindrical pad, such that the interface frame is manipulatable in one or more of: a height with respect to the base frame, or an orientation with respect to the base frame. In a first configuration, the first cylindrical pad is removably coupled to the interface frame. In a second configuration, the first cylindrical pad is removably coupled to the base frame.

Abstract: Intelligent process management is provided. A start time is determined for an additional process to be run on a worker node within a duration of a sleep state of a task of a process already running on the worker node by adding a first defined buffer time to a determined start time of the sleep state of the task. A backfill time is determined for the additional process by subtracting a second defined buffer time from a determined end time of the sleep state of the task. A scheduling plan is generated for the additional process based on the start time and the backfill time corresponding to the additional process. The scheduling plan is executed to run the additional process on the worker node according to the start time and the backfill time corresponding to the additional process.

Abstract: An electronic device including an electronic module, an inflator and an airbag is disclosed. The airbag is configured to be inflated by a gas produced by the inflator. The electronic module is disposed on the airbag and includes a first surface, a corner connecting with the first surface and a second surface opposite to the first surface. When the airbag is not inflated by the gas, at least a portion of the second surface is disposed between the first surface and the air bag, and the electronic module is at least partially overlapped with the airbag and not overlapped with the inflator in a top-view direction of the electronic module. When the airbag is inflated by the gas, the airbag contacts the corner of the electronic module, and the airbag at least partially contacts the first surface of the electronic module in the top-view direction of the electronic module.

Abstract: An electronic device including a flexible substrate, a plurality of electronic components, and a first driving unit is provided. The flexible substrate includes a surface having a first region and a second region. The first region has a Gaussian curvature of 0 and the second region has a non-zero Gaussian curvature. The plurality of electronic components are disposed on the flexible substrate. The first driving unit is disposed on the first region of the flexible substrate. One of the plurality of electronic components located on the second region of the flexible substrate is driven by the first driving unit.

Abstract: An interconnect structure, along with methods of forming such, are described. The structure includes a dielectric layer, a conductive feature disposed in the dielectric layer, and a conductive layer disposed over the dielectric layer, wherein the conductive layer includes a first portion and a second portion adjacent the first portion. The structure also includes a first barrier layer in contact with the first portion of the conductive layer, a second barrier layer in contact with the second portion of the conductive layer, and a dielectric material disposed between and in contact with the first and second barrier layers, wherein a bottom surface of the second barrier layer and a bottom surface of the dielectric material are substantially co-planar.