Abstract: The present application discloses a light sensor circuit comprising a first amplifier, a second amplifier and an active load. An integration circuit is formed by the operation of this light sensor circuit and connected to a photodiode. The cathode of the photodiode is controlled to maintain an identical or approximate voltage level with the anode of the photodiode, which significantly reduces the influence of the dark current from the photodiode. Consequently, when applied to an analog-to-digital conversion device, the light sensor circuit effectively maintains the performance and accuracy of the device. Additionally, this design significantly reduces circuit complexity and manufacturing costs.

Abstract: A method includes forming a gate dielectric on a semiconductor region, depositing a work-function layer over the gate dielectric, depositing a silicon layer over the work-function layer, and depositing a glue layer over the silicon layer. The work-function layer, the silicon layer, and the glue layer are in-situ deposited. The method further includes depositing a filling-metal over the glue layer; and performing a planarization process, wherein remaining portions of the glue layer, the silicon layer, and the work-function layer form portions of a gate electrode.

Abstract: A drug-loaded nanofiber membrane includes a first fiber, a second fiber, and a drug. The drug is dispersed into the first fiber. The first fiber includes poly(lactic-co-glycolic acid) copolymer (PLGA copolymer), and the second fiber includes poly(p-dioxanone) (PDO).

Abstract: There is provided a smart control system including a host, at least one sensor and an informing device. The host identifies the activity of a specific member according to the detection result of the at least one sensor, and informs the specific member to take medicine on time or avoid eating specific ingredients using the informing device.

Abstract: An electronic device includes two speakers, a single functional chip, a parameter extraction circuit, an audio processing module, a gain adjusting circuit and a current detecting unit. The current detecting unit is disposed in the functional chip for detecting the driving current of the two speakers. The functional chip provides the driving voltage of the two speakers based on an output signal and converts the analogue current/voltages of the two speakers into digital current/voltages. The parameter extraction circuit acquires the parameter of each speaker based on the digital current/voltages. The audio processing module acquires the gains of various physical quantities based on the parameter of each speaker and determines the final gain of each physical quantity. The gain adjusting circuit provides the output signal by adjusting the gain of an input signal based on the final gain of each physical quantity.

Abstract: A school admission prediction system and method are provided. The system includes a user interface for receiving personal data from an applicant, including academic and activity data. A data acquisition module connected to the user interface acquires this personal data. A data preprocessing module connected to the data acquisition module preprocesses the academic and activity data. An attribute selection module connected to the data preprocessing module extracts multiple attributes from the preprocessed data. A machine learning model generates an evaluation report based on the extracted attributes. This report includes a prediction of whether the applicant will be admitted to the school. The system also includes a loss calculation module for evaluating the performance of the machine learning model and optimizing its parameters based on the evaluation results. The method and system provide a reliable and efficient way to predict school admissions, helping applicants to better prepare their applications.

Abstract: An electronic device includes a substrate, a first electronic unit, a second electronic unit, a first buffer layer, and a second buffer layer. The first electronic unit is disposed on the substrate. The second electronic unit is disposed on the substrate and adjacent to the first electronic unit. The first buffer layer is disposed on the first electronic unit and has a first curved bottom surface. The second buffer layer is disposed on the second electronic unit and has a second curved bottom surface. The width of the first curved bottom surface is different from the width of the second curved bottom surface.

Abstract: A defogging lens barrel structure includes a lens barrel, a lens assembly, a heating module, a temperature-sensing module, and a thermal insulating material. The lens barrel has a receiving groove. An inner portion of the receiving groove includes an abutting surface and a recess disposed on the abutting surface. The lens assembly is disposed inside the lens barrel and includes a first lens disposed in the receiving groove. The first lens has a lens abutting surface correspondingly facing the abutting surface. The heating module is disposed between the abutting surface of the lens barrel and the lens abutting surface of the first lens and is adapted to provide a heat source. The temperature-sensing module is engaged with the heating module and is received in the recess of the lens barrel. The thermal insulating material encloses around the temperature-sensing module to be filled into the recess.

Abstract: A display device includes light-emitting elements disposed on an array substrate. The array substrate includes a substrate, switch elements disposed on the substrate, an insulating layer, a connecting layer, a conductive layer and a spacer layer. The insulating layer is disposed on the switching elements and has through holes. The connecting layer is disposed on the insulating layer and is electrically connected to the switching elements through the through holes. The conductive layer is disposed on the connecting layer and includes pads electrically connected to the connecting layer. The spacer layer disposed between the connecting layer and the conductive layer. The conductive layer extends on the spacer layer and is orthographically projected on the substrate to form a first orthographic projection area, where the through holes are located in the first orthographic projection.

Abstract: A display device and a driving method thereof are provided. In the display device, a display panel has multiple first pixel rows and multiple second pixel rows arranged alternately. In a first time interval, a first gate driver sequentially drives the first pixel rows using a first driving method. In a second time interval, a second gate driver sequentially drives the second pixel rows using the first driving method. In a third time interval, a third gate driver sequentially drives the first pixel rows using a second driving method. In a fourth time interval, a fourth gate driver sequentially drives the second pixel rows using the second driving method. One of the first driving method and the second driving method is a pulse amplitude modulation driving method, and the other of the first driving method and the second driving method is a pulse width modulation driving method.

Abstract: An example of a flow cell includes a substrate, a plurality of chambers defined on or in the substrate, and a plurality of depressions defined in the substrate and within a perimeter of each of the plurality of chambers. The depressions are separated by interstitial regions. Primers are attached within each of the plurality of depressions, and a capture site is located within each of the plurality of chambers.

Abstract: A method includes forming a first active fin structure and a second active fin structure on a substrate. A dummy fin structure is formed on the substrate, the dummy fin structure being interposed between the first active fin structure and the second active fin structure. The dummy fin structure is removed to expose a first portion of the substrate, the first portion of the substrate being disposed directly below the dummy fin structure. A plurality of protruding features is formed on the first portion of the substrate. A shallow trench isolation (STI) region is formed over the first portion of the substrate, the STI region covering the plurality of protruding features, at least a portion of the first active fin structure and at least a portion of the second active fin structure extending above a topmost surface of the STI region.

Abstract: An electronic device includes a light emitting structure that includes a light emitting surface. The light emitting surface includes a first region and a second region arranged along a first direction. The light emitting structure outputs a first light in the first region and outputs a second light in the second region. The first light has a first normal brightness in a first orthogonal direction perpendicular to the first direction and a first oblique brightness in a first inclined direction, and the first orthogonal direction and the first inclined direction form a first acute included angle. The second light has a second normal brightness in a second orthogonal direction and a second oblique brightness in a second inclined direction, and the second orthogonal direction and the second inclined direction form a second acute included angle. The first normal brightness and the second normal brightness are different.

Abstract: In an embodiment, a package includes an integrated circuit die comprising a first insulating bonding layer and a first semiconductor substrate and an interposer comprising a second insulating bonding layer, a first seal ring, and a second semiconductor substrate. The second insulating bonding layer is directly bonded to the first insulating bonding layer with dielectric-to-dielectric bonds, and wherein the integrated circuit die overlaps the first seal ring. A sidewall of the integrated circuit die is exposed at an outer sidewall of the package.

Abstract: A method includes etching a portion of a wafer to form a first trench in a scribe line of the wafer, wherein the scribe line is between a first device die and a second device die of the wafer. After the etching, a top surface of the portion of wafer in the scribe line is underlying and exposed to the first trench, and the first trench is between opposing sidewalls of the wafer. A laser grooving process is then performed to form a second trench extending from the top surface further down into the wafer, and the second trench is laterally between the opposing sidewalls of the wafer. A die-saw process is then performed to saw the wafer. The die-saw process is performed from a bottom of the second trench, and the die-saw process results in the first device die to be separated from the second device die.

Abstract: In an embodiment, a package include an integrated circuit die comprising a first insulating bonding layer and a first semiconductor substrate and an interposer comprising a second insulating bonding layer and a second semiconductor substrate. The second insulating bonding layer is directly bonded to the first insulating bonding layer with dielectric-to-dielectric bonds. The package further includes an encapsulant over the interposer and surrounding the integrated circuit die. The encapsulant is further disposed between the first insulating bonding layer and the second insulating bonding layer along a line perpendicular to a major surface of the first semiconductor substrate.

Abstract: An electronic includes a substrate, at least one driving unit, a first signal line and a second signal line. The substrate has a first side edge extending in a first extension direction and a second side edge extending in a second extension direction. The first side edge and the second side edge are curved in a normal direction of a projection surface of a top surface of the substrate. A curvature of the first side edge is different from a curvature of the second side edge, and the curvatures of the first side edge and the second side edge are not equal to zero. The first signal line and the second signal line are disposed on the substrate. The first signal line is electrically connected to the at least one driving unit, and a curvature of the first signal line is different from a curvature of the second signal line.

Abstract: An aerial vehicle includes a communication unit configured to receive a wireless signal from a geo-fencing device, and a flight controller configured to generate one or more control signals that cause the aerial vehicle to operate in accordance with a set of flight regulations generated based on the wireless signal. The geo-fencing device is configured not for landing of the aerial vehicle. The set of flight regulations includes rules for controlling at least one of the aerial vehicle, a carrier carried by the aerial vehicle, or a payload of the aerial vehicle.

Abstract: A display device and a driving method thereof are provided. In the display device, a display panel has multiple first pixel rows and multiple second pixel rows arranged alternately. In a first time interval, a first gate driver sequentially drives the first pixel rows using a first driving method. In a second time interval, a second gate driver sequentially drives the second pixel rows using the first driving method. In a third time interval, a third gate driver sequentially drives the first pixel rows using a second driving method. In a fourth time interval, a fourth gate driver sequentially drives the second pixel rows using the second driving method. One of the first driving method and the second driving method is a pulse amplitude modulation driving method, and the other of the first driving method and the second driving method is a pulse width modulation driving method.

Abstract: A semiconductor structure includes a first metallization feature, a first dielectric structure over the first metallization feature, a second metallization feature embedded in the first dielectric structure, a via structure between the first metallization feature and the second metallization feature, and a first insulating layer between the first dielectric structure and the first metallization feature, and between the first dielectric structure and the via structure. The first metallization feature extends along a first direction, and the second metallization feature extends along a second direction different from the first direction. The first insulating layer covers first sidewalls of the via structure along the second direction.