Patents by Inventor Han-Yi Hung

Han-Yi Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240088042
    Abstract: A semiconductor structure includes a dielectric layer over a substrate, a via conductor over the substrate and in the dielectric layer, and a first graphene layer disposed over the via conductor. In some embodiments, a top surface of the via conductor and a top surface of the dielectric layer are level. In some embodiments, the first graphene layer overlaps the via conductor from a top view. In some embodiments, the semiconductor structure further includes a second graphene layer under the via conductor and a third graphene layer between the dielectric layer and the via conductor. In some embodiments, the second graphene layer is between the substrate and the via conductor.
    Type: Application
    Filed: January 11, 2023
    Publication date: March 14, 2024
    Inventors: SHU-WEI LI, HAN-TANG HUNG, YU-CHEN CHAN, CHIEN-HSIN HO, SHIN-YI YANG, MING-HAN LEE, SHAU-LIN SHUE
  • Publication number: 20240071822
    Abstract: A method for manufacturing a semiconductor structure includes forming a first interconnect feature in a first dielectric feature, the first interconnect feature including a first conductive element exposed from the first dielectric feature; forming a first cap feature over the first conductive element, the first cap feature including a first cap element which includes a two-dimensional material; forming a second dielectric feature with a first opening that exposes the first cap element; forming a barrier layer over the second dielectric feature while exposing the first cap element from the barrier layer; removing a portion of the first cap element exposed from the barrier layer; and forming a second conductive element in the first opening.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chin-Lung CHUNG, Shin-Yi YANG, Yu-Chen CHAN, Han-Tang HUNG, Shu-Wei LI, Ming-Han LEE
  • Patent number: 11757789
    Abstract: The present invention provides a frame transmission method of an electronic device, wherein the frame transmission method includes the steps of: receiving a pause frame from another electronic device, wherein the pause frame includes a plurality of inter frame gap control indicator, and each of the inter frame gap control indicator includes a plurality of packet size ranges and corresponding pause times; selecting one of the inter frame gap control indicator according to a priority of a first packet to be sent to the other electronic device, and determining a first inter frame gap according to which packet size range the first packet belongs to; and after a first frame including the first packet is sent to the other electronic device, at least waiting for the first inter frame gap before starting to send a second frame to the other electronic device.
    Type: Grant
    Filed: September 22, 2022
    Date of Patent: September 12, 2023
    Assignee: Realtek Semiconductor Corp.
    Inventors: Han-Yi Hung, Cheng-Yan Wu, Sheng-Pin Lin, Yi-Kuang Ko
  • Publication number: 20230122404
    Abstract: The present invention provides a frame transmission method of an electronic device, wherein the frame transmission method includes the steps of: receiving a pause frame from another electronic device, wherein the pause frame includes a plurality of inter frame gap control indicator, and each of the inter frame gap control indicator includes a plurality of packet size ranges and corresponding pause times; selecting one of the inter frame gap control indicator according to a priority of a first packet to be sent to the other electronic device, and determining a first inter frame gap according to which packet size range the first packet belongs to; and after a first frame including the first packet is sent to the other electronic device, at least waiting for the first inter frame gap before starting to send a second frame to the other electronic device.
    Type: Application
    Filed: September 22, 2022
    Publication date: April 20, 2023
    Applicant: Realtek Semiconductor Corp.
    Inventors: Han-Yi Hung, Cheng-Yan Wu, Sheng-Pin Lin, Yi-Kuang Ko
  • Patent number: 11601375
    Abstract: A frame transmission method of an electronic device, wherein the frame transmission method includes the steps of: receiving a pause frame from another electronic device, wherein the pause frame includes a plurality of packet size ranges and corresponding pause times; referring to content of the pause frame, and determining a first frame interval according to which packet size range a first packet to be sent to the other electronic device belongs to; and after a first frame including the first packet is sent to said another electronic device, at least waiting for the first frame interval before starting to send a second frame to said another electronic device.
    Type: Grant
    Filed: May 26, 2021
    Date of Patent: March 7, 2023
    Assignee: Realtek Semiconductor Corp.
    Inventors: Han-Yi Hung, Huai-Chih Ma, Yi-Kuang Ko
  • Publication number: 20220029927
    Abstract: A frame transmission method of an electronic device, wherein the frame transmission method includes the steps of: receiving a pause frame from another electronic device, wherein the pause frame includes a plurality of packet size ranges and corresponding pause times; referring to content of the pause frame, and determining a first frame interval according to which packet size range a first packet to be sent to the other electronic device belongs to; and after a first frame including the first packet is sent to said another electronic device, at least waiting for the first frame interval before starting to send a second frame to said another electronic device.
    Type: Application
    Filed: May 26, 2021
    Publication date: January 27, 2022
    Inventors: Han-Yi Hung, Huai-Chih Ma, Yi-Kuang Ko
  • Patent number: 11119959
    Abstract: A data communication and processing method of a master device and a slave device is provided, wherein the method includes the steps of: using the master device to transmit a frame to the slave device via a communication medium, wherein the frame includes a plurality of fields, the plurality of fields includes a bursting size field and a data field, and contents within the bursting size field indicate a data amount of the data field; and using the slave device to receive the frame and store contents of the data field, or output data to the data field according to the data amount indicated by the contents within the bursting size field of the frame. In addition, a method for replacing preamble bits with a postamble bit to improve transmission efficiency is provided.
    Type: Grant
    Filed: January 30, 2020
    Date of Patent: September 14, 2021
    Assignee: Realtek Semiconductor Corp.
    Inventors: Jeong-Fa Sheu, Sheng-Pin Lin, Han-Yi Hung, Chien-Wei Lee
  • Publication number: 20200257641
    Abstract: A data communication and processing method of a master device and a slave device is provided, wherein the method includes the steps of: using the master device to transmit a frame to the slave device via a communication medium, wherein the frame includes a plurality of fields, the plurality of fields includes a bursting size field and a data field, and contents within the bursting size field indicate a data amount of the data field; and using the slave device to receive the frame and store contents of the data field, or output data to the data field according to the data amount indicated by the contents within the bursting size field of the frame. In addition, a method for replacing preamble bits with a postamble bit to improve transmission efficiency is provided.
    Type: Application
    Filed: January 30, 2020
    Publication date: August 13, 2020
    Inventors: Jeong-Fa Sheu, Sheng-Pin Lin, Han-Yi Hung, Chien-Wei Lee