Abstract: A multi-channel light emitting diode package structure includes a supporting unit, a driver chip, at least one upper light emitting chip, and a lower light emitting chip. The supporting unit has a top supporting surface, and includes a first accommodating portion and a second accommodating portion recessed from the top supporting surface. The driver chip is disposed in the first accommodating portion, and a top surface of the driver chip is lower than the top supporting surface of the supporting unit. At least one upper lighting chip is disposed on the top supporting surface of the supporting unit. A lower lighting chip is disposed in the second accommodating portion. A top surface of the lower lighting chip is lower than the top supporting surface of the supporting unit. The second accommodating portion is filled with phosphor materials and the phosphor materials completely cover the lower lighting chip.